CN120266271A - 半导体模块 - Google Patents

半导体模块 Download PDF

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Publication number
CN120266271A
CN120266271A CN202380081135.2A CN202380081135A CN120266271A CN 120266271 A CN120266271 A CN 120266271A CN 202380081135 A CN202380081135 A CN 202380081135A CN 120266271 A CN120266271 A CN 120266271A
Authority
CN
China
Prior art keywords
layer
semiconductor module
conductive layer
cover layer
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380081135.2A
Other languages
English (en)
Chinese (zh)
Inventor
吉田夏弥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN120266271A publication Critical patent/CN120266271A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202380081135.2A 2022-11-29 2023-11-16 半导体模块 Pending CN120266271A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022189770 2022-11-29
JP2022-189770 2022-11-29
PCT/JP2023/041293 WO2024116873A1 (ja) 2022-11-29 2023-11-16 半導体モジュール

Publications (1)

Publication Number Publication Date
CN120266271A true CN120266271A (zh) 2025-07-04

Family

ID=91323659

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380081135.2A Pending CN120266271A (zh) 2022-11-29 2023-11-16 半导体模块

Country Status (5)

Country Link
US (1) US20250239506A1 (https=)
JP (1) JPWO2024116873A1 (https=)
CN (1) CN120266271A (https=)
DE (1) DE112023004327T5 (https=)
WO (1) WO2024116873A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026034289A1 (ja) * 2024-08-09 2026-02-12 ローム株式会社 半導体装置、半導体モジュールおよび車両
WO2026053967A1 (ja) * 2024-09-09 2026-03-12 ローム株式会社 半導体モジュール

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4322910B2 (ja) * 2006-10-20 2009-09-02 株式会社東芝 鉄道車両用電力変換装置
JP6139330B2 (ja) * 2013-08-23 2017-05-31 三菱電機株式会社 電力用半導体装置
JP2019207897A (ja) * 2016-09-29 2019-12-05 三菱電機株式会社 パワーモジュール、その製造方法および電力変換装置
WO2018211751A1 (ja) * 2017-05-18 2018-11-22 三菱電機株式会社 半導体モジュールおよび電力変換装置
JP2020115495A (ja) * 2019-01-17 2020-07-30 三菱電機株式会社 半導体装置、及び半導体装置の製造方法
JP7196047B2 (ja) * 2019-09-18 2022-12-26 日立Astemo株式会社 電気回路体、電力変換装置、および電気回路体の製造方法
JP7512659B2 (ja) * 2020-04-24 2024-07-09 富士電機株式会社 半導体モジュール及び半導体モジュールの製造方法
JP7555257B2 (ja) * 2020-12-10 2024-09-24 日立Astemo株式会社 電気回路体、電力変換装置、および電気回路体の製造方法

Also Published As

Publication number Publication date
US20250239506A1 (en) 2025-07-24
WO2024116873A1 (ja) 2024-06-06
JPWO2024116873A1 (https=) 2024-06-06
DE112023004327T5 (de) 2025-07-31

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