JPWO2024116873A1 - - Google Patents
Info
- Publication number
- JPWO2024116873A1 JPWO2024116873A1 JP2024561360A JP2024561360A JPWO2024116873A1 JP WO2024116873 A1 JPWO2024116873 A1 JP WO2024116873A1 JP 2024561360 A JP2024561360 A JP 2024561360A JP 2024561360 A JP2024561360 A JP 2024561360A JP WO2024116873 A1 JPWO2024116873 A1 JP WO2024116873A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
- H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/461—Leadframes specially adapted for cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/60—Seals
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022189770 | 2022-11-29 | ||
| PCT/JP2023/041293 WO2024116873A1 (ja) | 2022-11-29 | 2023-11-16 | 半導体モジュール |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024116873A1 true JPWO2024116873A1 (https=) | 2024-06-06 |
Family
ID=91323659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024561360A Pending JPWO2024116873A1 (https=) | 2022-11-29 | 2023-11-16 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250239506A1 (https=) |
| JP (1) | JPWO2024116873A1 (https=) |
| CN (1) | CN120266271A (https=) |
| DE (1) | DE112023004327T5 (https=) |
| WO (1) | WO2024116873A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026034289A1 (ja) * | 2024-08-09 | 2026-02-12 | ローム株式会社 | 半導体装置、半導体モジュールおよび車両 |
| WO2026053967A1 (ja) * | 2024-09-09 | 2026-03-12 | ローム株式会社 | 半導体モジュール |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4322910B2 (ja) * | 2006-10-20 | 2009-09-02 | 株式会社東芝 | 鉄道車両用電力変換装置 |
| JP6139330B2 (ja) * | 2013-08-23 | 2017-05-31 | 三菱電機株式会社 | 電力用半導体装置 |
| JP2019207897A (ja) * | 2016-09-29 | 2019-12-05 | 三菱電機株式会社 | パワーモジュール、その製造方法および電力変換装置 |
| WO2018211751A1 (ja) * | 2017-05-18 | 2018-11-22 | 三菱電機株式会社 | 半導体モジュールおよび電力変換装置 |
| JP2020115495A (ja) * | 2019-01-17 | 2020-07-30 | 三菱電機株式会社 | 半導体装置、及び半導体装置の製造方法 |
| JP7196047B2 (ja) * | 2019-09-18 | 2022-12-26 | 日立Astemo株式会社 | 電気回路体、電力変換装置、および電気回路体の製造方法 |
| JP7512659B2 (ja) * | 2020-04-24 | 2024-07-09 | 富士電機株式会社 | 半導体モジュール及び半導体モジュールの製造方法 |
| JP7555257B2 (ja) * | 2020-12-10 | 2024-09-24 | 日立Astemo株式会社 | 電気回路体、電力変換装置、および電気回路体の製造方法 |
-
2023
- 2023-11-16 JP JP2024561360A patent/JPWO2024116873A1/ja active Pending
- 2023-11-16 WO PCT/JP2023/041293 patent/WO2024116873A1/ja not_active Ceased
- 2023-11-16 CN CN202380081135.2A patent/CN120266271A/zh active Pending
- 2023-11-16 DE DE112023004327.2T patent/DE112023004327T5/de active Pending
-
2025
- 2025-04-09 US US19/174,378 patent/US20250239506A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20250239506A1 (en) | 2025-07-24 |
| WO2024116873A1 (ja) | 2024-06-06 |
| CN120266271A (zh) | 2025-07-04 |
| DE112023004327T5 (de) | 2025-07-31 |