CN1199466A - Device for and method of inspecting liquid crystal display panel and method of mfg. liquid crystal display panel - Google Patents

Device for and method of inspecting liquid crystal display panel and method of mfg. liquid crystal display panel Download PDF

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Publication number
CN1199466A
CN1199466A CN 97191125 CN97191125A CN1199466A CN 1199466 A CN1199466 A CN 1199466A CN 97191125 CN97191125 CN 97191125 CN 97191125 A CN97191125 A CN 97191125A CN 1199466 A CN1199466 A CN 1199466A
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CN
China
Prior art keywords
lcds
check
integrated circuit
wiring
chip
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Granted
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CN 97191125
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Chinese (zh)
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CN1175271C (en
Inventor
行田幸三
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Seiko Epson Corp
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Seiko Epson Corp
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Publication of CN1199466A publication Critical patent/CN1199466A/en
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Publication of CN1175271C publication Critical patent/CN1175271C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

A novel structure of a device for inspecting liquid crystal display panels. A liquid crystal display panel is almost completely inspected using the device before an IC chip is mounted and, further, wiring patterns on external terminals can be inspected simultaneously. An air supply inlet (40a) and a wide opening part (40b) are provided in the edge part of a holding plate (40), and an elastic sheet (42) is attached so as to close the wide opening part (40b). An IC chip (A) is bonded and fixed to the outer surface of the elastic sheet (42). A flexible circuit board (43) is bonded and fixed to the lower surface of the holding plate (40), and wiring patterns (43a) are provided on the flexible circuit board (43). Connection terminal parts (43b) are provided on the edge parts of the wiring patterns (43a) to which one ends of conductive wires (44) are bonded. The other ends of the conductive wires (44) are bonded to contact terminals (45). The connection terminal parts (43b) and the conductive wires (44) are encapsulated in a molding body (46).

Description

The manufacture method of the verifying attachment of LCDs, the method for inspection of LCDs and LCDs
The present invention relates to the verifying attachment of LCDs, particularly be used to the probe unit structure checked, this probe unit is applicable to the light a lamp occasion of check of the sort of LCDs of loading the IC chip on the terminal part externally.
In liquid crystal indicator in the past, stretch out one of them of two substrates constituting this display screen in the outer peripheral edge portion of LCDs, generally be furnished with the outside terminal part on the surface of its extension, it forms a plurality of outside terminals of drawing in the viewing area.
This outside terminal is partly arranged the outside terminal that is used to apply driving voltage, and this driving voltage drives LCDs and makes display action, and each outside terminal connects the wiring from liquid crystal display drive circuit.
In recent years, along with the high definitionization of liquid crystal indicator, the number of external terminals on the outside terminal part increases, and in addition, terminal is arranged and also developed to the narrow pitch direction.Therefore, usually, it is more to utilize heat seal externally to connect the situation of flexible printed circuit board on the terminal part.
And,, the LCDs of COG (chip on glass) type of the IC chip of dress liquid crystal display drive circuit in directly installing is arranged on the said external terminal part for miniaturization, the slimming of corresponding liquid crystal indicator.In this case, the wiring layer of drawing from the viewing area of LCDs connects with the first terminal group of the lead-out terminal that should be connected the IC chip, in the position relative with this first terminal group, arranges second terminal group corresponding with the input terminal of IC chip.This second terminal group in statu quo externally the peripheral edge portion of terminal part draw, as the outside terminal group that is connected with control circuit of outside etc.
In the LCDs of above-mentioned COG type in the past, after forming LCDs, the IC chip is installed on the terminal part externally, then, carry out the display screen check.But, if after the IC chip is installed, carry out the display screen check, owing under the bad or IC chip the is bad situation of one of them, still be bad as finished product, so there is the problem that can waste miscellaneous part in LCDs self.In fact, most cases is the bad more of LCDs, and has wasted the IC chip.
On the other hand, before being installed, the IC chip carries out under the situation of display screen check, can carry out the simple inspection of LCDs itself, but can not for example carry out the check of lighting a lamp of the precision of gray-scale Control by liquid crystal display drive circuit, carry out this check of lighting a lamp, must prepare the verifying attachment that has with the liquid crystal display drive circuit said function.
And, in the display screen check after above-mentioned IC chip is installed, owing to can only check the LCDs part before the first terminal group, can not carry out the cloth X-ray inspection X of second terminal group and connected outside terminal group simultaneously, even so defectiveness on the terminal part externally, can not detect badly when doing check after the IC chip is installed, still there is the problem that may waste the IC chip in the result.
Therefore, the present invention is conceived to address the above problem, its objective is provides, and can carry out display screen check substantially completely before the IC chip is installed, and can also carry out the verifying attachment structure of the novel liquid crystal display screen of the wiring figure check on the outside terminal part simultaneously.
Be used to realize that the LCDs verifying attachment of the present invention of above-mentioned purpose is characterised in that, comprise: keep body, load many wirings; Integrated circuit is installed in the fore-end of this maintenance body, is furnished with a plurality of splicing ears that expose; With a plurality of check probes, dispose side by side with the described splicing ear of this integrated circuit; On this check probe, be electrically connected described wiring.
According to this device, owing to keep body to descend externally on the terminal part by making, when integrated circuit splicing ear and external terminal portions branch is contacted, can also the exposure test probe, so, just can carry out and the identical check of installation integrated circuit situation in this state by carrying out the check of LCDs.
Wherein, described check probe preferably includes: the contact terminal part of exposing; The flexible metal wire that connects this contact terminal part and described wiring; With the elastic resin that contains this flexible metal wire.
According to this device, owing to be connected between wiring and the contact terminal part with flexible metal wire, and contain with elastic resin, so the check probe can be according to outside terminal surface elevation partly flexibly corresponding to contact terminal position partly, reliable contact can be obtained, the splicing ear of integrated circuit and the contact stabilization between the external terminal portions branch can also be made simultaneously.And, because after connecting flexible metal wire, can be only carry out filling and harden and form, so can easily make with elastic resin.
In addition, described integrated circuit flexibly assembles better for described maintenance body.
According to this device, because integrated circuit, can obtain to contact reliably so can make the contact condition between splicing ear and outside terminal part stable for keeping body to carry out the elasticity assembling.
And described maintenance body is preferably installed the circuit board that should be connected with described LCDs, the wiring layer that described wiring preferably forms on this circuit board.
According to this device, owing to keeping on the body circuit board that should be connected with LCDs being installed, institute is so that making becomes easy.
And described maintenance body preferably is furnished with the maintaining body that removably keeps described integrated circuit.
According to this device, utilization is furnished with the maintaining body that removably keeps described integrated circuit, when can suitably selecting different integrated circuit to test, after the installation integrated circuit is tested, owing to after this integrated circuit being fixed on the outside terminal part, can in statu quo take off, so on LCDs, integrated circuit can be installed.
In addition, on the wiring figure of the outside terminal part that is provided with on the substrate of LCDs, contact the splicing ear of the integrated circuit that clamps with the integrated circuit clamp device by predetermined extruding force;
Then, make with a plurality of check probes of the corresponding setting of described outside terminal part and contact described outside terminal part;
By this check probe, on described integrated circuit, supply with the check signal of LCDs, carry out the check that powers up of LCDs;
Subsequently, preferably, be electrically connected described integrated circuit and described splicing ear by the bonding described integrated circuit of resin adhesive and the described substrate of dispersed electro-conductive particle.
According to this device,, carry out the installation of integrated circuit subsequently, so the manufacture method of high efficiency LCDs can be provided owing to use integrated circuit to carry out the check that powers up of LCDs.
Fig. 1 is the amplification longitudinal diagram of the user mode of expression LCDs verifying attachment of the present invention.
Fig. 2 is the amplification view on the outside terminal part of expression LCDs.
Fig. 3 is the partial plan layout of the peripheral edge portion of expression LCDs.
Fig. 4 is the skeleton view of expression probe structure formation method.
Fig. 5 is the longitudinal diagram of state before the expression check beginning.
The longitudinal diagram of state when Fig. 6 is the expression check.
Fig. 7 is the planimetric map of the check arm of the different embodiment of expression.
Fig. 8 is the sectional view of the IC chip installation procedure of expression service test arm.
Below, with reference to the description of drawings embodiments of the invention.
Fig. 1 is the local amplification profile of user mode of the probe unit of expression present embodiment.LCDs is made of various types of liquid crystal displays, but in illustrated example, has constituted to seize on both sides by the arms liquid crystal layer 30 at the device substrate 10 of being furnished with the wiring layer 11 that is connected with pixel capacitors and be furnished with state between the counter substrate 20 of opposite electrode 21.
As shown in Figure 3, in the outer edge part of device substrate 10, form the outside terminal part 15 of stretching out in the side of also keeping to the side than the end of opposed substrate 20.On the surface of this outside terminal part 15, form a plurality of first lead-out wirings 12 of drawing and have second lead-out wiring 13 that the interval with respect to this first lead-out wiring forms from the viewing area relative with liquid crystal layer 30 by predetermined figure.
As shown in Figure 2, first lead-out wiring 12 is connected with described wiring layer 11 or opposite electrode 21, and its fore-end becomes the first terminal 12a with the corresponding formation of lead-out terminal of predetermined integrated circuit (IC) chip (being designated hereinafter simply as the IC chip) A.In addition, the medial end of second lead-out wiring 13 is divided into the second terminal 13a with the corresponding formation of input terminal of above-mentioned IC chip A, and the outboard end of second lead-out wiring 13 is divided into the outside terminal 13b that connects external control circuit and power-up circuit etc.For example in the splicing ear part B of flexible circuit board, outside terminal 13b is electrically connected splicing ear, constitutes this splicing ear, and it is arranged by the pitch identical with outside terminal 13b.
Design outside terminal part 15, so that be arranged side by side a plurality of IC chip A as shown in Figure 3, constituting these IC chips A makes it to receive by the control signal and the electric power that provide with outside terminal 13b that control circuit is connected with power-up circuit with the second terminal 13a, produce drive signal according to these control signals and electric power, transmit drive signal from the wiring layer or the opposite electrode of the first terminal 12a in LCDs.Have, typographic(al) mark 14 is used for determining the position of IC chip A again.
Kind according to LCDs, the situation that only forms outside terminal part 15 at the peripheral edge portion of device substrate 10 is arranged, also have at the peripheral edge portion of counter substrate 20 to form the part of stretching out laterally from the end of device substrate 10, this extension (inboard) also can form the situation with the same outside terminal part 25 in said external terminal part 15.
In the present embodiment, will keep the holding plate 40 of body to be loaded on the elevating mechanism not shown in the figures, constitute this maintenance body, and make it to move up and down accurately with conduct with the high-insulativity material of rigidity (for example, animi resin) formation to a certain degree.The wide mouthful of opening portion 40b that is provided with the air vent 40a that is communicated with up and down and is connected to form at the fore-end of this holding plate 40 with the downside of this air vent 40a.On the upper opening of air vent 40a, connect the air supply pipe 41 that is connected with feeder not shown in the figures.In addition, flexible film is housed, for example uses the flexure strip 42 of synthetic rubber sheet formation, to seal wide mouthful of opening portion 40b.
Above-mentioned IC chip A is being adhesively fixed on these flexure strip 42 outside surfaces.This IC chip A can be the IC chip A itself that installs on Fig. 2 or outside terminal part 15,25 shown in Figure 3, also can not be itself but has other IC chips in the roughly the same function of check time spent formation.
Owing to gas is supplied with air vent 40a by air supply pipe 41, the flexure strip 42 of covering wide mouth opening portion 40b is expanded downwards, utilize the elastic property corresponding with the gas supply pressure, can flexiblely keep IC chip A.
Below holding plate 40, the flexible circuit board 43 that is being adhesively fixed on this flexible circuit board 43, is provided with on the surface or a plurality of wiring figure 43a of the predetermined pattern shape that forms in inside.As splicing ear part 43b, this splicing ear part 43b side below holding plate 40 is in the face of the recess 40c in the formation of the rear of described wide mouthful of opening portion 40b the fore-end of these a plurality of wiring figure 43a.
On splicing ear part 43b, an end of the conductive metal line 44 that welding is made of gold thread etc.In addition, the other end of conductive metal line 44 is connected with metal contact terminal 45.And, in recess 40c behind the filling insulating resin, by solidifying to form moulded body 46, so that above-mentioned a plurality of splicing ear part 43b and a plurality of conductive metal line 44 are carried out mold pressing.This moulded body 46 is not only filled the recess 40c of holding plate 40 separately, with the coupling part of covering conductive metal line 44 and contact terminal 45, and, by constituting, to expose the downside surface of contact terminal 45 from the outstanding downwards shape of recess 40c.
Fig. 4 is the skeleton view of the formation method of expression moulded body 46.With arrange 47 welding of a plurality of connection pads on the conductive metal line 44 of the splicing ear part 43b of wiring figure 43a welding and the deckle board 48, wherein wiring figure 43a composition is formed on the surface of flexible circuit board 43.In this state, the flexible circuit board 43 that below holding plate shown in Figure 1 40, is adhesively fixed, insulating resin flows into the recess 40c of holding plate 40.After insulating resin sclerosis, take out deckle board 48, be connected contact terminal 45 in the exposed portions serve (with the part of deckle board 48 contacts) of connection pads 47.
On the wiring figure 43a of flexible circuit board 43, connect check control device 50, for a plurality of wiring figure 43a,, supply with control signal and power supply potential by predetermined round of visits and inspection figure.
According to the present embodiment of above explanation, as shown in Figure 5,, flexure strip 42 is expanded downwards by pressing predetermined pressure through air supply pipe 41 supply gas from feeder, make the outstanding state in the IC chip A side of keeping down with gaseous tension.Make the pressure of supply gas keep certain, utilize the elevating mechanism not shown in the figures that makes holding plate 40 actions, IC chip A and contact terminal 45 are dropped on the outside terminal part 15 of LCDs.
Then, as shown in Figure 6, for the input terminal a that makes IC chip A and lead-out terminal b contact with the first terminal 12a with the second terminal 13a shown in Figure 1, contact terminal 45 contacts with outside terminal 13b, if on device substrate 10, compress holding plate 40, IC chip A utilizes the elasticity that the flexure strip 42 that expanded by gaseous tension is added so, be pressed on the outside terminal part 15 by predetermined strength, in addition, contact terminal 45 utilizes the elasticity of moulded body 46, is pressed on the outside terminal part 15 by predetermined strength.
At this moment, for the input terminal a that confirms IC chip A contacts with the second terminal 13a and the first terminal 12a respectively really with lead-out terminal b, the pressure transducer that detects the gaseous tension rising that keeps certain by the contact pressure of IC chip A preferably is installed, under the detected pressure value of this pressure transducer rises to situation more than the predetermined value, elevating mechanism is stopped, stopping to move of holding plate 40 with control.
Behind the decline holding plate 40, the input terminal a of IC chip A contacts with the second terminal 13a of second lead-out wiring 13, the lead-out terminal b of IC chip A contacts with the first terminal 12a of first lead-out wiring 12, and, utilize contact terminal 45 to be in outside terminal 13b state of contact with second lead-out wiring 13, can be enough and the equal state that IC chip A is installed, the wiring figure 43a by flexible circuit board 43 tests.
Here, by using flexible circuit board with the outside terminal connection of second lead-out wiring 13 identical or the circuit substrate of same structure arranged, under the state identical, utilize flexible circuit board 43 to test and become possibility with the state of finishing as liquid crystal indicator.
In the present embodiment, contact with the second terminal 13a with the first terminal 12a, contact terminal 45 is contacted with outside terminal 13b, can carry out the check etc. of lighting a lamp of LCDs by making IC chip A.In this case, on holding plate 40, removably keep IC chip A by methods such as vacuum suction and clamp systems, after IC chip A being contacted with the outside terminal part 15 of LCDs test, if assay is good, just can intactly be installed in IC chip A on the outside terminal part 15.
As shown in Figure 7, be furnished with the clamp lever 61,62 that constitutes the phase mutual edge distance changeably, clamp IC chip A, constitute the installation of IC chip A, utilize the check arm 60 of double as holding plate 40 to implement to install in the present embodiment with these clamp levers 61,62 at leading section.On this check arm 60, same with above-mentioned holding plate 40, be provided with and the identical probe structure of contact terminal 45 on the wiring figure 43a that is connected flexible circuit board 43.Like this, clamp IC chip A, probe structure is set simultaneously, can realize holding plate 40 essentially identical structures with the foregoing description by above-mentioned clamp lever 61,62.
After this check arm 60 being dropped on the outside terminal part 15 of LCDs, can carry out check with above-mentioned same LCDs.At this moment, after not finding the LCDs condition of poor, this check arm 60 is intactly used as the installation top of IC chip A.Adopting under the situation of heat seal method as installation method, as shown in Figure 8, before installation, externally lay anisotropic conductive adhesive sheet 70 on the terminal part 15, utilize clamp lever 61 and 62 to clamp IC chip A, under this state, the time drop to equally on the outside terminal part 15 with check, make the terminal part of formation on the input terminal of IC chip A and lead-out terminal and the terminal part 15 externally be in regular contact position by anisotropic conductive adhesive sheet 70.Have, anisotropic conductive adhesive sheet 70 is adhesive sheets of dispersed electro-conductive particle in photo-hardening or thermosetting resin adhesive for example again.
Then, utilize pressurization utensil 71 shown in Figure 8, pressurize while heating (about 200 ℃) from the IC chip A top that clamps by clamp lever 61,62, fusion anisotropic conductive adhesive sheet 70, produce the conducting of above-below direction simultaneously, at the terminal of the IC chip A that is adhesively fixed under the state of conducting and the terminal on the outside terminal part 15.
According to this method, utilize check arm 60, can carry out the check of LCDs and the installation of IC chip A continuously, after IC chip A installs, can utilize original check arm to carry out IC chip A bad affirmation is installed simultaneously.
Aforesaid the present invention in the verifying attachment of LCDs, can carry out roughly display screen check completely before the IC chip is installed, in addition, can also carry out the check that outside terminal is partly gone up wiring figure simultaneously.

Claims (7)

1. the verifying attachment of a LCDs is characterized in that, comprising: keep body, load many wirings; Integrated circuit is installed in the fore-end of this maintenance body, is furnished with a plurality of splicing ears that expose; With a plurality of check probes, dispose side by side with the described splicing ear of this integrated circuit; On this check probe, be electrically connected described wiring.
2. the verifying attachment of LCDs as claimed in claim 1 is characterized in that, described check probe comprises: the contact terminal part of exposing; Make the flexible metal wire that is connected between this contact terminal part and the described wiring; With the elastic resin that contains this flexible metal wire.
3. the verifying attachment of LCDs as claimed in claim 1 is characterized in that, with respect to described maintenance body elasticity ground described integrated circuit is installed.
4. the verifying attachment of LCDs as claimed in claim 1 is characterized in that, described maintenance body is assembling the circuit board that should be connected with described LCDs, and described wiring is the wiring layer that forms on this circuit board.
5. the verifying attachment of LCDs as claimed in claim 1 is characterized in that, described maintenance body is furnished with the maintaining body that keeps described integrated circuit removably.
6. the method for inspection of a LCDs is characterized in that comprising:
The splicing ear of integrated circuit is contacted with pressure of stipulating and the outside terminal that is provided with in the substrate of LCDs wiring figure partly.
Then, make with a plurality of check probes of the corresponding setting of described outside terminal part and contact with described external terminal portions branch;
By this check probe, on described integrated circuit, supply with the LCDs check and use signal, carry out the check that powers up of LCDs.
7. the manufacture method of a LCDs is characterized in that comprising:
Use the splicing ear of the integrated circuit of integrated circuit clamp device clamping to contact with the pressure of regulation and the outside terminal wiring figure partly that in the substrate of LCDs, is provided with.
Then, make with a plurality of check probes of the corresponding setting of described outside terminal part and contact with described external terminal portions branch;
By this check probe, on described integrated circuit, supply with the LCDs check and use signal, carry out the check that powers up of LCDs;
Subsequently, by bonding described integrated circuit of the resin adhesive of dispersed electro-conductive particle and described substrate, be electrically connected described integrated circuit and described splicing ear.
CNB971911258A 1996-09-02 1997-09-02 Device for and method of inspecting liquid crystal display panel and method of mfg. liquid crystal display panel Expired - Fee Related CN1175271C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP232335/1996 1996-09-02
JP23233596A JP3624570B2 (en) 1996-09-02 1996-09-02 Liquid crystal display panel inspection apparatus, liquid crystal display panel inspection method, and integrated circuit mounting method
JP232335/96 1996-09-02

Publications (2)

Publication Number Publication Date
CN1199466A true CN1199466A (en) 1998-11-18
CN1175271C CN1175271C (en) 2004-11-10

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CNB971911258A Expired - Fee Related CN1175271C (en) 1996-09-02 1997-09-02 Device for and method of inspecting liquid crystal display panel and method of mfg. liquid crystal display panel

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JP (1) JP3624570B2 (en)
KR (1) KR100518161B1 (en)
CN (1) CN1175271C (en)
TW (1) TW359748B (en)
WO (1) WO1998010298A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100434925C (en) * 2003-04-25 2008-11-19 日本发条株式会社 Examining instrument for liquid crystal panel
CN1896811B (en) * 2005-07-15 2011-08-10 三菱电机株式会社 Flexible printed circuit and display device using the same
CN105867003A (en) * 2016-06-15 2016-08-17 苏州众显电子科技有限公司 Novel STN liquid crystal display screen
CN106205030A (en) * 2016-07-25 2016-12-07 京东方科技集团股份有限公司 A kind of circuit for alarming, surface-mounted integrated circuit and warning system

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KR100911467B1 (en) * 2002-12-31 2009-08-11 삼성전자주식회사 Apparatus for inspecting liquid crystal display
JP2008032958A (en) * 2006-07-28 2008-02-14 Optrex Corp Lighting inspection device and lighting inspection method for display panel
KR100843126B1 (en) * 2006-08-29 2008-07-02 주식회사 에스에프에이 Device for inspecting panel of flat display and method thereof, and system for bonding PCB of flat display and method thereof
KR20060122804A (en) * 2006-11-11 2006-11-30 윤재완 Probe block for display panel test
JP5347258B2 (en) * 2007-09-28 2013-11-20 カシオ計算機株式会社 Functional inspection equipment for electronic devices
KR101219285B1 (en) * 2011-01-06 2013-01-11 (주)에이앤아이 Inspection method and apparatus of substrate
KR101290669B1 (en) * 2013-02-04 2013-07-29 (주)메리테크 Bump-type probe, glass block panels for testing

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Publication number Priority date Publication date Assignee Title
JP2559242B2 (en) * 1987-12-25 1996-12-04 東京エレクトロン株式会社 Probe card
JPH02253168A (en) * 1989-03-28 1990-10-11 Seiko Epson Corp Probe for checking lighting of liquid crystal display panel
JP2524308Y2 (en) * 1989-12-27 1997-01-29 日本電子材料 株式会社 Probe card
JPH0489579A (en) * 1990-07-31 1992-03-23 Morimichi Fujiyoshi Inspecting device for printed board and the like
JPH0495929A (en) * 1990-08-08 1992-03-27 Fujitsu Ltd Device and method for test using active probe
JP2966671B2 (en) * 1991-11-18 1999-10-25 東京エレクトロン株式会社 Probe card
JPH06120647A (en) * 1992-10-06 1994-04-28 Fujitsu Ltd Method and apparatus for mounting semiconductor element

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100434925C (en) * 2003-04-25 2008-11-19 日本发条株式会社 Examining instrument for liquid crystal panel
CN1896811B (en) * 2005-07-15 2011-08-10 三菱电机株式会社 Flexible printed circuit and display device using the same
CN105867003A (en) * 2016-06-15 2016-08-17 苏州众显电子科技有限公司 Novel STN liquid crystal display screen
CN106205030A (en) * 2016-07-25 2016-12-07 京东方科技集团股份有限公司 A kind of circuit for alarming, surface-mounted integrated circuit and warning system
CN106205030B (en) * 2016-07-25 2019-01-29 京东方科技集团股份有限公司 A kind of circuit for alarming, integrated circuit board and warning system

Also Published As

Publication number Publication date
TW359748B (en) 1999-06-01
JPH1078456A (en) 1998-03-24
JP3624570B2 (en) 2005-03-02
KR20000064315A (en) 2000-11-06
WO1998010298A1 (en) 1998-03-12
KR100518161B1 (en) 2005-12-01
CN1175271C (en) 2004-11-10

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