CN1588182A - Pressure programming electrical property detecting device and method - Google Patents
Pressure programming electrical property detecting device and method Download PDFInfo
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- CN1588182A CN1588182A CN 200410056688 CN200410056688A CN1588182A CN 1588182 A CN1588182 A CN 1588182A CN 200410056688 CN200410056688 CN 200410056688 CN 200410056688 A CN200410056688 A CN 200410056688A CN 1588182 A CN1588182 A CN 1588182A
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Abstract
The invention is an electric detecting device and method for pressing process, where the device includes the component to be pressed, pressing component, pressing part, guide component and electric tester. The pressing component is arranged on the component to be pressed, the guide component has a first end and a second one, where the first one is coupled with the pressing part and the second one is arranged on the component to be pressed so as to form a first test part. The electric tester tests the first test part to indirectly measure the resistance value of the pressing part.
Description
Technical field
The present invention relates to a kind of electrical detection device, particularly relate to a kind of electrical detection device of pressure programming.
Background technology
Liquid crystal flat panel display gradually becomes the main flow of display, and is main because liquid crystal flat panel display take up space is come for a short time than the conventional cathode vacuum display device.Yet the processing procedure of making liquid crystal flat panel display but comes difficultly than cathode vacuum display.Its main reason is that product all needs suitable technology in each step of processing procedure, and processing procedure needs higher quality.Pressure programming is considerable one section in the processing procedure of flat-panel screens, comprises that chip pressing substrate (Chip on Glass), flexible PCB pressing substrate (FlexiblePrinted Circuit on Glass), chip pressing flexible PCB (Chip on FlexiblePrinted Circuit) and flexible PCB pressing printed circuit board (PCB) (Flexible Printed Circuiton Printed Circuit Board) etc. all can use the technology of pressure programming.Traditionally, checking above-mentioned pressure programming quality all is to utilize the mode of reviewer's visual inspection, via a pressing thing of product behind the check pressure programming with one whether obvious, with decision pressing thing and by the electrical quality of pressing thing pressing by the impression of pressing thing.Yet it is quite subjective checking product in the mode of reviewer's visual inspection, can only do to qualitatively judge and can't do quantitative judgement by quantitative testing, unless just belong to by the time and can carry out quantitative test after the pressing printed circuit board (PCB) processing procedure of product back segment finishes.Therefore, belong to product leading portion many processing procedures partly if there is flaw just can't learn early, thereby wasted many times and cost.In addition, adopt the mode of reviewer's visual inspection to detect traditionally and also make processing procedure robotization more.
Summary of the invention
In view of this, the electrical detection device and method that the purpose of this invention is to provide a kind of pressure programming, monitor the electrical quality of the pressure programming in each stage in real time in the mode of detection by quantitative, can make pressure programming detect more robotization, improve detection efficiency, and then reduce production costs.
According to purpose of the present invention, a kind of electrical detection device of pressure programming is proposed, comprise one by pressing assembly, a pressing assembly, a pressing portion, an arrangement for guiding and a testing electrical property device.The pressing arrangement of components is on by the pressing assembly, and arrangement for guiding has first end and second end.First end couples pressing portion, and second end is disposed at by the pressing assembly to form first test department.The testing electrical property device is tested first test department, records the resistance value of pressing portion indirectly.
According to purpose of the present invention, reintroduce a kind of electrical detection method of pressure programming, comprising: at first, provide by pressing assembly and pressing assembly.Then, form pressing portion on the pressing assembly, and pressing portion has an electrical loop.Then, with pressing portion connection pressing assembly and by the pressing assembly.Then, first end of arrangement for guiding is coupled to pressing portion, and second end of arrangement for guiding is disposed at by the pressing assembly, and form first test department in second end.At last, test first test department, record the resistance value of pressing portion indirectly.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and be described with reference to the accompanying drawings as follows.
Description of drawings
Figure 1A shows the vertical view according to the electrical detection device of the pressure programming of the present invention one first embodiment.
Figure 1B shows the sectional view by the pressing portion among conducting wire conducting Figure 1A.
Fig. 1 C shows the sectional view by the pressing portion among conductive pad conducting Figure 1A.
Fig. 2 shows the vertical view according to the pressing electrical detection device of the present invention one second embodiment.
Fig. 3 shows the vertical view according to the pressing electrical detection device of the present invention 1 the 3rd embodiment.
Fig. 4 A shows 4 vertical views that measure the electrical detection device.
Fig. 4 B shows the sectional view by the pressing portion among conductive pad conducting Fig. 4 A.
Fig. 4 C shows the sectional view by the pressing portion among conducting line conduction Fig. 4 A.
Fig. 5 shows the process flow diagram of the electrical detection method of pressure programming of the present invention.
The drawing reference numeral explanation
101: chip for driving
102: glass substrate
103,403: pressing portion
104,404: arrangement for guiding
105: the first ends
106: the second ends
107: the first test departments
130a, 130b, 430a, 430b, 430c: reserve weld pad
110: the testing electrical property device
110a: first probe
110b: second probe
120,420: the first projections
121,421: the second projections
130a, 430a: first conductive pad
130b, 430b: second conductive pad
130,430: the conducting conductive pad
131,431: passivation layer
140,440: the conducting circuit
201: flexible PCB
207: the second test departments
301: printed circuit board (PCB)
307: the three test departments
490: four measure the electrical detection device
422: the three projections
430c: the 3rd conductive pad
410: four measurement instrument
Embodiment
First embodiment
Please refer to Figure 1A, it shows the vertical view according to the electrical detection device of the pressure programming of the present invention one first embodiment.The electrical detection device 190 of pressure programming comprises: one by pressing assembly, a pressing assembly, a pressing portion 103, an arrangement for guiding 104 and a testing electrical property device 110.In first embodiment, be glass substrate 102 by the pressing assembly, the pressing assembly is a chip for driving 101.Arrangement for guiding 104 has first end 105 and second end 106.First end 105 is coupled to pressing portion 103, the second ends 106 and is disposed at glass substrate 102 and forms first test department 107.Pressing portion 103 is that arrangement for guiding 104 links chip for driving 101 parts.
Please refer to Figure 1B, it shows the sectional view by the pressing portion among conducting wire conducting Figure 1A.Pressing portion 103 tools, first projection 120, second projection 121, the first conductive pad 130a, the second conductive pad 130b and a passivation layer 131 (Passivation).The first conductive pad 130a and the second conductive pad 130b are the reservation weld pad (Dummy Pad) of two no special roles on the chip for driving 101.Utilize conducting circuit 140 conductings, first projection 120 and second projection 121 of chip for driving 101 inside, to form an electrical loop.Shown in 1A figure, utilize testing electrical property device 110 to place first test department 107 recording the resistance value of chip for driving 101 and glass substrate 102 pressings, that is the resistance value of pressing portion 103.
Please refer to Fig. 1 C, it shows the sectional view by the pressing portion among conductive pad conducting Figure 1A.The first conductive pad 130a that is disposed at first projection, 120 bottom surfaces extends to link with the second conductive pad 130b that is disposed at second projection, 121 bottom surfaces becomes a conducting conductive pad 130.Shown in Figure 1A, the first probe 110a and the second probe 110b of testing electrical property device 110 placed first test department 107 respectively, recording the resistance value of chip for driving 101 and glass substrate 102 pressings, that is the resistance value of pressing portion 103.
Second embodiment
Please refer to Fig. 2, it shows the vertical view according to the pressing electrical detection device of the present invention one second embodiment.Compared to first embodiment, second embodiment is except being pressed on chip for driving 101 on the glass substrate 102, and form outside first test department 107 by pressing portion 103 and arrangement for guiding 104, also comprise flexible PCB (FPC) 201 is pressed on the glass substrate 102.Flexible PCB 201 has second test department 207, couples with first test department 107.Testing electrical property device 110 records the resistance value of pressing portion 103 indirectly via first test department 107 and second test department 207.As shown in Figure 2, testing electrical property device 110 is placed in first resistance value that second test department 207 records 201 of chip for driving 101 and flexible PCBs.First resistance value is deducted the resistance value of flexible PCB 201 and glass substrate 102 pressings, is the resistance value of chip for driving 101 and glass substrate 102 pressings.And the resistance value of flexible PCB 201 and glass substrate 102 pressings is to utilize testing electrical property device 110 successively to be placed in first test department 107 and second test department 207 is tried to achieve.
The 3rd embodiment
Please refer to Fig. 3, it shows the vertical view according to the present invention 1 the 3rd embodiment.Compared to first and second embodiment, the 3rd embodiment is except being pressed on chip for driving 101 and flexible PCB 201 respectively on the glass substrate 102, and form outside first test department 107 and second test department 207, also comprise a printed circuit board (PCB) 301 is pressed on flexible PCB 201.Printed circuit board (PCB) 301 has one the 3rd test department 307, couples with second test department 207.Testing electrical property device 110 records the resistance value of pressing portion 103 indirectly via first test department 107, second test department 207 and the 3rd test department 307.Testing electrical property device 110 successively is placed in first test department 107, second test department 207 and the 3rd test department 307 to detect.In the 3rd test department 307 second resistance value of learning that measures is resistance value, and the joint resistance value of the resistance value of 201 of printed circuit board (PCB) 301 and flexible PCBs of 102 of the resistance value, flexible PCB 201 of 102 of chip for driving 101 and glass substrates and glass substrates.Therefore the resistance value of the resistance value of second resistance value deduction glass substrate 102 and flexible PCB 201 pressings and deduction flexible PCB 201 and printed circuit board (PCB) 301 pressings is the resistance value of pressing portion 103, that is the resistance value of chip for driving 101 and glass substrate 102 pressings.The 3rd embodiment is the resistance value of three kinds of different pressings of test, comprises the resistance value of 301 of the resistance value of 201 of the resistance value, glass substrate 102 of 101 of glass substrate 102 and chip for driving and flexible PCBs and flexible PCB 201 and printed circuit board (PCB)s.
The 4th embodiment
Please refer to Fig. 4 A, it shows at 4 and measures electrical detection device vertical view.4 measure electrical detection device 490, comprising: glass substrate 102, chip for driving 101, arrangement for guiding 404, flexible PCB 201, printed circuit board (PCB) 301 and 4 measurement instrument 410.Pressing portion 403 has reservation weld pad 430a, 430b, and the 430c of three no special roles, utilizes these three to reserve weld pads and link chip for driving 101 parts as arrangement for guiding 404.
Please refer to Fig. 4 B, show sectional view by the pressing portion among conductive pad conducting Fig. 4 A.Pressing portion 403 has first projection 420, second projection 421, the 3rd projection 422, the first conductive pad 430a, the second conductive pad 430b, the 3rd conductive pad 430c and passivation layer 431.Utilize conducting circuit 440 conductings first projection 420, second projection 421 and the 3rd projection 422 of chip for driving 101, to form an electrical loop.
Please refer to Fig. 4 C, show sectional view by the pressing portion among conducting line conduction Fig. 4 A.Being disposed at the conductive pad 430a of first projection, 420 bottom surfaces, the conductive pad 430c that is disposed at the conductive pad 430b of second projection, 421 bottom surfaces and is disposed at the 3rd projection 422 bottom surfaces extend to link and to become a conducting conductive pad 430.Shown in Fig. 4 A, 4 measurement instrument 410 successively are placed in first test department 107, second test department 207 and the 3rd test department 307.As described in above-mentioned the 3rd embodiment, can try to achieve the resistance value of three kinds of different pressings respectively, comprise the resistance value of 301 of the resistance value of 201 of the resistance value, glass substrate 102 of 101 of glass substrate 102 and chip for driving and flexible PCBs and flexible PCB 201 and printed circuit board (PCB)s.In the 4th embodiment, utilize measure electrical detection device 490 at 4, the resistance value that only measures first projection, 120 to second projections 121 in the pressing portion 403 than aforesaid first embodiment to the, three embodiment is more accurate.
Please refer to Fig. 5, it shows and is the process flow diagram according to the electrical detection method of a preferred embodiment of the present invention pressure programming.At first, provide by pressing assembly and pressing assembly in step 501.Next, step 502 forms pressing portion 103 on the pressing assembly, and pressing portion 103 has electrical loop.Continuation connects the pressing assemblies with pressing portion 103 and by the pressing assembly in step 503.Then, in step 504, first end 105 of arrangement for guiding 104 is coupled to pressing portion 103, and second end 106 of arrangement for guiding 104 is disposed at by the pressing assembly, and form first test department 107 at second end.Then,, test first test department 107, record the resistance value of pressing portion 103 indirectly in step 505.In step 506, the qualified resistance value of definition pressing.Continuation is at step 507 output resistance.At last, in step 508 comparison resistance value and the qualified resistance value of pressing.
Electrical pick-up unit and the method for pressure programming that the above embodiment of the present invention is disclosed is to measure the pressing assembly and by the resistance value of the pressing portion 103 of pressing inter-module, with the electrical quality of the pressure programming of monitoring each stage.When the design of product had change, (Lead Pitch) dwindled as pin-pitch, can do electrical affirmation by this device.And the electrical checking when the underproof semi-manufacture that the leading portion pressure programming is checked out can be used as anisotropy conductiving glue (Anisotropic Conductive Film) or the importing of relevant processing procedure material, to reduce the cost that other exploitation experiment slice and chip etc. are wasted.Device and method of the present invention is the quantification check system of pressure programming, makes pressure programming detect more robotization, can reduce pressure programming detection time, improve detection efficiency.
In sum; though the present invention discloses as above with a preferred embodiment; right its is not in order to limit the present invention; those skilled in the art can be used for a variety of modifications and variations under the premise without departing from the spirit and scope of the present invention, so protection scope of the present invention is as the criterion with claim of the present invention.
Claims (19)
1. the electrical detection device of a pressure programming comprises:
One by the pressing assembly;
One pressing assembly is disposed at this by on the pressing assembly;
One pressing portion is in order to connect this pressing assembly and this is by the pressing assembly;
One arrangement for guiding has one first end and one second end, and this first end is coupled to this pressing portion, and this second end is disposed at this by the pressing assembly and form one first test department; And
One testing electrical property device in order to test this first test department, records a resistance value of this pressing portion indirectly.
2. electrical detection device as claimed in claim 1, wherein this pressing portion comprises one first projection and one second projection, this first projection and this second projection conducting.
3. electrical detection device as claimed in claim 2, wherein this pressing assembly comprises a conducting circuit, in order to this first projection of conducting and this second projection to form an electrical loop.
4. electrical detection device as claimed in claim 2, wherein this pressing portion also comprises a conductive pad, is disposed on this pressing assembly, in order to connect this first projection and this second projection to form an electrical loop.
5. electrical detection device as claimed in claim 1, wherein this first test department is a pin or a lead-in wire.
6. electrical detection device as claimed in claim 1 should be a glass substrate by the pressing assembly wherein.
7. electrical detection device as claimed in claim 1, wherein this pressing assembly is a chip for driving.
8. electrical detection device as claimed in claim 6, wherein this electrical detection device also comprises a flexible PCB, be pressed on this glass substrate, this flexible PCB has one second test department, couple with this first test department, make this testing electrical property device via this first test department and this second test department, record this resistance value of this pressing portion indirectly.
9. electrical detection device as claimed in claim 8, wherein this second test department is a pin or a lead-in wire.
10. electrical detection device as claimed in claim 8, wherein the electrical detection device also comprises a printed circuit board (PCB), be pressed on this flexible PCB, this printed circuit board (PCB) has one the 3rd test department, couple with this second test department, make this testing electrical property device via this first test department, this second test department and the 3rd test department, record this resistance value of this pressing portion indirectly.
11. electrical detection device as claimed in claim 10, wherein the 3rd test department is a pin or a lead-in wire.
12. the electrical detection method of a pressure programming comprises:
Provide one by a pressing assembly and a pressing assembly;
Form a pressing portion on this pressing assembly, and this pressing portion has an electrical loop;
Connect this pressing assembly and this is by the pressing assembly with this pressing portion;
One first end of one arrangement for guiding is coupled to this pressing portion, and one second end of this arrangement for guiding is disposed at this by the pressing assembly, and form one first test department at this second end; And
Test this first test department, record a resistance value of this pressing portion indirectly.
13. electrical detection method as claimed in claim 12, wherein this method also comprises:
Define the qualified resistance value of a pressing;
Export this resistance value; And
Compare this resistance value and the qualified resistance value of this pressing.
14. electrical detection method as claimed in claim 12, wherein this pressing portion comprises one first projection and one second projection, this first projection and this second projection conducting.
15. electrical detection method as claimed in claim 14, wherein this method also comprises:
Form a conducting circuit in this pressing assembly; And
This first projection and this second projection are disposed on this conducting circuit, to form this electrical loop.
16. electrical detection method as claimed in claim 14, wherein this method also comprises:
Form a conductive pad in this pressing assembly; And
This first projection and this second projection are disposed at this conductive pad, to form this electrical loop.
17. electrical detection method as claimed in claim 12 should be a glass substrate by the pressing assembly wherein.
18. electrical detection method as claimed in claim 17, wherein this electrical detection method also comprises:
One flexible PCB is provided, and this flexible PCB has one second test department;
This flexible PCB of pressing and this glass substrate make this second test department and this first test department couple; And
Via this first test department and this second test department, record this resistance value of this pressing portion indirectly.
19. electrical detection method as claimed in claim 18, wherein the electrical detection method also comprises:
One printed circuit board (PCB) is provided, and this printed circuit board (PCB) has one the 3rd test department;
Be pressed on this printed circuit board (PCB) and this flexible PCB, make the 3rd test department and this second test department couple; And
Via this first test department, this second test department and the 3rd test department, record this resistance value of this pressing portion indirectly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100566881A CN100489602C (en) | 2004-08-12 | 2004-08-12 | Electric detection method for press-fit process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100566881A CN100489602C (en) | 2004-08-12 | 2004-08-12 | Electric detection method for press-fit process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1588182A true CN1588182A (en) | 2005-03-02 |
| CN100489602C CN100489602C (en) | 2009-05-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100566881A Expired - Fee Related CN100489602C (en) | 2004-08-12 | 2004-08-12 | Electric detection method for press-fit process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100489602C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102298224A (en) * | 2010-06-25 | 2011-12-28 | 上海天马微电子有限公司 | Crimping detection device |
| CN102005165B (en) * | 2009-08-28 | 2013-09-18 | 上海天马微电子有限公司 | Laminate testing device and method |
| CN107656191A (en) * | 2017-09-25 | 2018-02-02 | 京东方科技集团股份有限公司 | This pressure condition detection components, system and method |
| CN108519536A (en) * | 2018-01-19 | 2018-09-11 | 云谷（固安）科技有限公司 | Test system and test method |
-
2004
- 2004-08-12 CN CNB2004100566881A patent/CN100489602C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102005165B (en) * | 2009-08-28 | 2013-09-18 | 上海天马微电子有限公司 | Laminate testing device and method |
| CN102298224A (en) * | 2010-06-25 | 2011-12-28 | 上海天马微电子有限公司 | Crimping detection device |
| CN102298224B (en) * | 2010-06-25 | 2014-10-22 | 上海天马微电子有限公司 | Crimping detection device |
| CN107656191A (en) * | 2017-09-25 | 2018-02-02 | 京东方科技集团股份有限公司 | This pressure condition detection components, system and method |
| CN108519536A (en) * | 2018-01-19 | 2018-09-11 | 云谷（固安）科技有限公司 | Test system and test method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100489602C (en) | 2009-05-20 |
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Granted publication date: 20090520 Termination date: 20210812 |