CN107656191A - This pressure condition detection components, system and method - Google Patents
This pressure condition detection components, system and method Download PDFInfo
- Publication number
- CN107656191A CN107656191A CN201710874884.7A CN201710874884A CN107656191A CN 107656191 A CN107656191 A CN 107656191A CN 201710874884 A CN201710874884 A CN 201710874884A CN 107656191 A CN107656191 A CN 107656191A
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- support plate
- test
- pressure
- pressure condition
- detection components
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
- G01R31/68—Testing of releasable connections, e.g. of terminals mounted on a printed circuit board
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The present invention relates to circuit connection area, proposes a kind of this pressure condition detection components, system and method.The component includes：The first test pin group positioned at the first support plate, the second test pin group positioned at the second support plate, the test lead group and electrical signal collection unit positioned at the second support plate；First test pin group includes two first test pins of short circuit connection, and the second test pin group includes two second test pins, and in the first support plate and second this pressure of support plate, two second test pins and two first test pins difference face；Test lead group includes two test leads being connected respectively with two second test pins；Electrical signal collection unit is connected with two test leads, during for gathering the first support plate with second this pressure of support plate of institute, the electric signal between two test leads.In the present invention, the electric signal gathered by electrical signal collection unit draws the connection of the first test pin group and the second test pin group, so as to judge whether this pressure condition of the first support plate and the second support plate is suitable.
Description
Technical field
The present invention relates to circuit interconnection technique field, more particularly to a kind of this pressure condition detection components, system and method.
Background technology
In the prior art, when the pin on the pin and substrate on circuit board is attached, generally draw in circuit board
Anisotropic conductive film (ACF) is placed between pin and substrate draw-foot.Conducting particles is distributed with anisotropic conductive film (ACF),
When extruding circuit board with substrate (this pressure), conducting particles deformation contacts to form good electric conductor with circuit board, substrates into intimate,
So as to which circuit board connecting pins be connected with substrate draw-foot.But the degree of conducting particles crimp can influence the conduction of conducting particles
Performance, as shown in Fig. 2 being conducting particles this pressure condition schematic diagram.A represents that this pressure active force is too small in Fig. 2, and conducting particles is not led
Electricity；B represents that this pressure active force is adapted to, and conducting particles is conductive；C represents that this pressure active force is excessive, and conducting particles is non-conductive.
In the prior art, generally by observing conducting particles deformation situation at the back side of substrate or dividing circuit board and substrate
The impression and the conducting particles of residual that are stayed in after being extruded from observation conducting particles on electrode carry out the sheet of decision circuitry plate and substrate
Whether pressure condition is suitable.
But the above method is easily because human factor causes to judge by accident and artificially detection is lost time；Former simultaneously
It is transparent panel that method, which needs substrate, has certain limitation.
It should be noted that the information in the invention of above-mentioned background section is only used for strengthening the reason to background of the invention
Solution, therefore can include not forming the information to prior art known to persons of ordinary skill in the art.
The content of the invention
It is an object of the invention to provide a kind of this pressure condition detection components, system and method, and then at least in certain journey
One or more problem caused by the limitation of correlation technique and defect is overcome on degree.
According to an aspect of the present invention, there is provided a kind of this pressure condition detection components, including：
First test pin group, positioned at the first support plate, include two first test pins that short circuit connects；
Second test pin group, positioned at the second support plate, including two second test pins, and in first support plate and second
During this pressure of support plate, two second test pins and the two first test pin difference faces；
Test lead group, positioned at second support plate, including two tests being connected respectively with two second test pins
Lead；
Electrical signal collection unit, it is connected with two test leads, for gathering first support plate and the second support plate
During this pressure, the electric signal between two test leads.
In a kind of exemplary embodiment of the present invention, first support plate is circuit board, and second support plate is substrate；
Or first support plate is substrate, second support plate is circuit board.
In a kind of exemplary embodiment of the present invention, the test lead group also includes：
Two conductive pads, on second support plate, and it is connected respectively with two test leads.
In a kind of exemplary embodiment of the present invention, the surface area of the conductive pad is more than the electrical signal collection unit
The radial cross-section product of probe.
In a kind of exemplary embodiment of the present invention, two first test pins are disposed adjacent.
In a kind of exemplary embodiment of the present invention, in addition to：
Control unit, the input of described control unit are connected with the electrical signal collection unit, described control unit
Output end is connected with originally pressing power apparatus, and the electric signal that described control unit is gathered according to the electrical signal collection unit controls
Described presses power apparatus and provides corresponding pressure.
In a kind of exemplary embodiment of the present invention, first test pin is same with the first support plate pin
Conductive layer is formed by patterning processes.
According to an aspect of the present invention, there is provided a kind of this pressure condition detecting system, including multiple this above-mentioned pressure condition
Detection components, the first test pin group of multiple described pressure condition detection components and the second test pin component cloth
Between first support plate and second support plate this pressure surface.
In a kind of exemplary embodiment of the present invention, described pressure condition detection components are two, two described pressures
The the first test pin group and the second test pin group of state-detection component be distributed in first support plate with it is described
Second this pressure surface of support plate both ends.
According to an aspect of the present invention, there is provided a kind of this pressure condition detection method, detected using this above-mentioned pressure condition
Component or system, including：
First support plate is moved to the installation site with second support plate using this pressure head；
This pressure is carried out to first support plate and second support plate；
Record electric signal reading change of the electrical signal collection unit under different pressure pressures；
The electric signal reading is analyzed, judges the convenient pressure of this pressure.
A kind of this pressure condition detection components that a kind of exemplary embodiment of the present invention is provided, system and method.First
The first test pin group and the second test pin group are preset on support plate and the second support plate correspondence position；First test pin group is short
Connect, the second test pin group is connected with electrical signal collection unit.The electric signal gathered by electrical signal collection unit draws first
The connection of test pin group and the second test pin group, so as to whether judge this pressure condition of the first support plate and the second support plate
Properly.Compared with prior art, on the one hand, this example embodiment can be by electric signal that electrical signal collection unit gathers intuitively
Judge whether this pressure condition of the first support plate and the second support plate is suitable, caused by so as to avoid human factor in the prior art by mistake
Sentence；On the other hand this example embodiment is not limited the transparency of the first support plate and the second support plate, can be widely applied to each
Connection between kind support plate.
It should be appreciated that the general description and following detailed description of the above are only exemplary and explanatory, not
Can the limitation present invention.
Brief description of the drawings
Accompanying drawing herein is merged in specification and forms the part of this specification, shows the implementation for meeting the present invention
Example, and for explaining principle of the invention together with specification.It should be evident that drawings in the following description are only the present invention
Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
These accompanying drawings obtain other accompanying drawings.
Fig. 1 is this pressure condition monitoring assembly schematic diagram of the invention；
Fig. 2 is conducting particles this pressure condition schematic diagram；
Fig. 3 is that probe docks schematic diagram with conductive pad；
Fig. 4 is this pressure condition detection method flow chart of the invention；
Fig. 5 is three kinds of R-t curve maps between probe under different pressures.
Embodiment
Example embodiment is described more fully with referring now to accompanying drawing.However, example embodiment can be real in a variety of forms
Apply, and be not understood as limited to example set forth herein；On the contrary, these embodiments are provided so that the present invention will more comprehensively and
Completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.Identical reference represents in figure
Same or similar structure, thus their detailed description will be omitted.
Although the term of relativity, such as " on " " under " is used to describe icon component for another in this specification
The relativeness of one component, but these terms are used in this specification merely for convenient, for example, with reference to the accompanying drawings described in show
The direction of example.Be appreciated that, if making it turn upside down the upset of the device of icon, describe " on " component will
As " under " component.The term of other relativities, such as " height " " low " " top " " bottom " " left side " " right side " etc. are also made with similar
Implication.When certain structure other structures " on " when, it is possible to refer to that certain structural integrity is formed in other structures, or refer to certain structure
" direct " is arranged in other structures, or is referred to certain structure and be arranged on by another structure " indirect " in other structures.
Term "one", " one ", " described " to represent to exist one or more elements/part/etc.；Term " bag
Include " and " having " to represent it is open be included look like and refer to that the key element except listing/part/waits it
It is outer also may be present other key element/part/etc..
This example embodiment provides a kind of this pressure condition detection components first, with reference to figure 1, shows for this pressure condition monitoring assembly
It is intended to.
This pressure condition detection components include the first test pin group, the second test pin group, test lead group and electricity
Signal gathering unit.Wherein：The first test pin group is located at the first support plate 1, including two first tests of short circuit connection are drawn
Pin 11；The second test pin group is located at the second support plate 2, including two second test pins 21, and first support plate 1 with
When second support plate 2 is pressed, two second test pin, the 21 and two first test pin 11 difference faces；The test is drawn
Line group is located at second support plate 2, including two test leads 31 being connected respectively with two second test pins；The telecommunications
Number collecting unit is connected with two test leads 31, during for gathering first support plate 1 with institute's 2 pressures of the second support plate, two
Electric signal between the test lead 31.
A kind of this pressure condition detection components that the present exemplary embodiment is provided, position is corresponded in the first support plate and the second support plate
Put default first test pin group and the second test pin group；First test pin group short circuit, the second test pin group and electricity
Signal gathering unit connects.The electric signal gathered by electrical signal collection unit show that the first test pin group is drawn with the second test
The connection of pin group, so as to judge whether this pressure condition of the first support plate and the second support plate is suitable.Compared with prior art, a side
Face, this example embodiment can intuitively judge the first support plate and the second support plate by the electric signal that electrical signal collection unit gathers
This pressure condition it is whether suitable, caused by so as to avoid human factor in the prior art erroneous judgement；On the other hand this example embodiment
The transparency of first support plate and the second support plate is not limited, the connection that can be widely applied between various support plates.
It should be noted that the first test pin 11 is independently drawn for what is be separately provided outside 1 pin having of the first support plate
Pin；Short circuit connection between two first test pins 11；First test pin 11 and the first support plate pin are located at same conductive layer；Its
In, the first test pin 11 can uniformly be formed with the first support plate pin by patterning processes.Second test pin 21 is second
Support plate 2 has the individual pin being separately provided outside pin；Two second test pins 21 it is separated；Second test pin 21 with
Second support plate pin is located at same conductive layer；Wherein, the second test pin 11 can pass through patterning processes with the second support plate pin
It is unified to be formed.It is conducting particles this pressure condition schematic diagram with reference to figure 2, when 2 pressures of the first support plate 1 and the second support plate, first surveys
Try the test pin 21 of pin 11 and second and distinguish face.Test lead group can be located at the second support plate and the second test pin 21
In same conductive layer, and test lead group includes two test leads 31, and two test leads 31 can be tested with second respectively
Pin 21 connects；Wherein two test leads 31 can pass through patterning processes with the second test pin 21 and the second support plate pin
It is unified to be formed.Electrical signal collection unit is connected with two test leads, when the first support plate and second this pressure of support plate, electrical signal collection
Unit and the test pin of the first test pin 11 second form loop, gather electric signal.Wherein, electrical signal collection unit can be
Ohmmeter, the resistance value of the first test pin of collection and the second test pin composition structure, so as to draw the first test pin 11
With the connection situation between the second test pin 21, and then the connection feelings between the first support plate pin and the second support plate pin are judged
Condition, i.e. this pressure condition of the first support plate and the second support plate.In addition electrical signal collection unit can also be other structures, gather electric current
Or voltage, and then the connection feelings tested according to the curtage value of collection between the first support plate pin and the second support plate pin
Condition.These belong to the protection domain of the application.
In this example embodiment, first support plate 1 can be circuit board, and second support plate 2 can be substrate.Such as
In Oncell touch screen designs, the first support plate 1 is flexible PCB, and the second support plate 2 is color membrane substrates.Because color membrane substrates have
There is black matrix lightproof area, it is impossible to which the broken situation that conducting particles is observed by the color membrane substrates back side judges flexible PCB and coloured silk
This pressure condition of ilm substrate.Use this pressure condition detection components in this example embodiment can with accurate judgement flexible PCB with
Whether this pressure condition of color membrane substrates is suitable.
It should be noted that first support plate 1 can also be substrate, second support plate 2 can also be circuit board.Should
Embodiment can apply in other circuit interconnection techniques, and this belongs to protection scope of the present invention.
Electrical signal collection unit is connected by probe with test lead, but the width of test lead is smaller, and electric signal is adopted
The probe of collection unit is not easy to dock with test lead.In this example embodiment, the test lead group can also include：Two is conductive
Pad.
With reference to shown in figure 3, schematic diagram is docked with conductive pad for probe, two conductive pads 32 are located on second support plate 2, and two
Conductive pad side is connected (with reference to figure 1) with two test leads 31, the probe 5 of conductive pad opposite side and electrical signal collection unit
Docking.
It should be noted that conductive pad 32 can be the conducting strip on the second support plate 2.Two conductive pads draw with two tests respectively
Line connects and is located at same conductive layer with test lead, can uniformly be formed by patterning processes with test lead.It is wherein conductive
The radial cross-section that the surface area of pad is more than electrical signal collection unit probe accumulates, can be conveniently electric by the design of conductive pad 32
The probe of signal gathering unit turns on test lead, also improves the conductive effect between electrical signal collection unit and test lead
Rate.In addition, conductive pad can also be the tubaeform electric conductor being connected on the second support plate, loudspeaker opening surface laterally, passes through loudspeaker
The design of type directly can insert the probe of electrical signal collection unit in loudspeaker opening, so as to not need the feelings of aid
Under condition, probe is detachably mounted on conductive pad, simplifies characterization processes.Conductive pad can also in other shapes and technique
It is fixed on the second support plate, these belong to protection scope of the present invention.
In the above-mentioned embodiment of this example embodiment, this pressure condition detection components are needed manually according to electrical signal collection
The electric signal of unit collection is controlled to originally pressing through journey.But manual control waste of manpower and easily there is mistake.This example
In embodiment, it can also include：Control unit.
It should be noted that the input of described control unit is connected with the electrical signal collection unit, the control is single
The output end of member is connected with originally pressing power apparatus, the electric signal that described control unit is gathered according to the electrical signal collection unit
Control described to press power apparatus and corresponding pressure is provided.When be corresponding to the electric signal that control unit receives this pressing fit shape
During state, the control of control unit output control signal originally presses power apparatus and stops providing pressure.This example embodiment is single by controlling
The setting of member, realizes the automation that support plate originally presses through journey.
When two first test pins 11 are distributed in first 1 two positions in larger distance of support plate, two second test pins
21 are also distributed in correspondence position, can not if the electric signal of now electrical signal collection unit collection shows that this pressure condition is improper
Judge that this pressure pressure of which position of support plate is excessive or too small.In this example embodiment, two phases of first test pin 11
Neighbour is set.
, now can be with it should be noted that it is same position that two first test pins 11 being disposed adjacent, which are approximately considered,
Think the collection of electrical signal collection unit is the electric signal corresponding to this pressure condition of position, so as to accurate judgement support plate
Whether one this pressure condition of fixed position is suitable.
Although whether above-mentioned example embodiment can suitable with a certain this pressure condition of fixed position of accurate judgement support plate, can not
This whole pressure condition of support plate is measured.This example embodiment also provides a kind of this pressure condition detecting system.
It should be noted that the system includes multiple above-mentioned this pressure condition detection components, multiple described pressure condition inspections
Survey the first test pin group of component and the second test pin group is distributed in first support plate and carried with described second
Between this pressure surface of plate.Wherein, the first test pin group of multiple described pressure condition detection components and second test
Pin set can be distributed between the pin that two support plates originally have or be distributed in the pin both ends that two support plates originally have, Duo Gesuo
This pressure condition of support plate this pressure surface diverse location can be detected by stating this pressure condition detection components, so as to this overall pressure to two support plates
State is judged.
Originally there is the design of pin to not influence two support plates, described pressure condition detection components can be two, two institutes
The the first test pin group and the second test pin group for stating this pressure condition detection components are distributed in first support plate
With this pressure surface of second support plate both ends.With reference to shown in figure 3, schematic diagram is docked with conductive pad for probe, 4 be this pressure head in Fig. 3,
First support plate is adsorbed below this pressure head, the first support plate is compressed on the second support plate by pressing this pressure head, when described first
When support plate and suitable this pressure condition at this pressure surface of second support plate both ends, it can be deduced that press this pressure effect at this pressure head both ends
Power is suitable, because this pressure head has certain rigidity, it can be determined that this pressure active force between this pressure head both ends is also suitable.
This example embodiment also provides a kind of this pressure condition detection method, is this pressure condition detection method with reference to shown in figure 4
Flow chart, this method includes：
Step S1：First support plate is moved to the installation site with second support plate using this pressure head；
Step S2：This pressure is carried out to first support plate and second support plate；
Step S3：Record electric signal reading change of the electrical signal collection unit under different pressure pressures；
Step S4：The electric signal reading is analyzed, judges the convenient pressure of this pressure.
The present exemplary embodiment with：This pressure condition detection components can be two, and two described pressure condition detection groups
The the first test pin group and the second test pin group of part are distributed in first support plate and the second support plate sheet
Pressure surface both ends, exemplified by illustrate.Signal gathering unit uses ohmmeter, with reference to figure 3, it is assumed that：Resistance is between left end probe
R12, right-hand member probe resistance are R34.
Wherein, in step s3, electric signal reading of the electrical signal collection unit under different pressure pressures is recorded to become
Change can include：R-t (R- resistance, t- times) curve map of probe is recorded under different pressure pressures.Assuming that different pressure pressures
Three kinds of R-t curve maps of probe are as shown in figure 5, R-t curve maps when wherein a is this pressure pressure too small state under power；B is this pressure
R-t curve maps during pressure proper states；R-t curve maps when c is this pressure pressure excessive state.
In step s 4, the electric signal reading is analyzed, judging the convenient pressure of this pressure includes：Draw this pressure shape
State analytical table, it is as follows：
Wherein a, b, c distinguish a, b, c curve condition in corresponding diagram 4.
According under different pressure pressures, R-t (R- resistance, t- times) curve map of left and right probe is in this pressure condition analytical table
In find corresponding to this pressure pressure analytic explanation, so as to judge whether this pressure pressure suitable.Those skilled in the art are considering
After the invention that specification and practice are invented here, other embodiments of the present invention will readily occur to.The application is intended to this
Any modification, purposes or the adaptations of invention, these modifications, purposes or adaptations follow the general of the present invention
Property principle and including the present invention common knowledge or conventional techniques in the art do not invented.Description and embodiments
It is considered only as exemplary, true scope and spirit of the invention are pointed out by appended claim.
Above-mentioned described feature, structure or characteristic can be incorporated in one or more embodiment party in any suitable manner
In formula, if possible, it is characterized in discussed in each embodiment interchangeable.In superincumbent description, there is provided many specific thin
Section fully understands so as to provide to embodiments of the present invention.It will be appreciated, however, by one skilled in the art that this can be put into practice
The technical scheme of invention is without one or more in specific detail, or can use other methods, component, material
Deng.In other cases, known features, material or operation are not shown in detail or describe to avoid obscuring each side of the present invention
Face.
Claims (10)
- A kind of 1. this pressure condition detection components, it is characterised in that including：First test pin group, positioned at the first support plate, include two first test pins that short circuit connects；Second test pin group, positioned at the second support plate, including two second test pins, and in first support plate and the second support plate During this pressure, two second test pins and the two first test pin difference faces；Test lead group, positioned at second support plate, including two test leads being connected respectively with two second test pins；Electrical signal collection unit, it is connected with two test leads, for gathering first support plate and support plate this pressure of institute second When, the electric signal between two test leads.
- 2. according to claim 1 pressure condition detection components, it is characterised in that first support plate is circuit board, institute It is substrate to state the second support plate；Or first support plate is substrate, second support plate is circuit board.
- 3. according to claim 1 pressure condition detection components, it is characterised in that the test lead group also includes：Two conductive pads, on second support plate, and it is connected respectively with two test leads.
- 4. according to claim 3 pressure condition detection components, it is characterised in that the surface area of the conductive pad is more than institute State the radial cross-section product of electrical signal collection unit probe.
- 5. according to this pressure condition detection components described in claim any one of 1-4, it is characterised in that two first tests Pin is disposed adjacent.
- 6. according to this pressure condition detection components described in claim any one of 1-4, it is characterised in that also include：Control unit, the input of described control unit are connected with the electrical signal collection unit, the output of described control unit End is connected with originally pressing power apparatus, and described control unit is according to the electric signal control that the electrical signal collection unit is gathered Originally press power apparatus and corresponding pressure is provided.
- 7. according to this pressure condition detection components described in claim any one of 1-4, it is characterised in that first test pin It is that same conductive layer is formed by patterning processes with the first support plate pin.
- 8. a kind of this pressure condition detecting system, it is characterised in that including multiple this pressure shapes as described in claim any one of 1-7 State detection components, the first test pin group and the second test pin component of multiple described pressure condition detection components Cloth is between first support plate and second support plate this pressure surface.
- 9. according to claim 8 pressure condition detecting system, it is characterised in that described pressure condition detection components are two Individual, the first test pin group and the second test pin group of two described pressure condition detection components are distributed in described First support plate and this pressure surface of second support plate both ends.
- 10. a kind of this pressure condition detection method, using this pressure condition detection components described in claim any one of 1-9 or is System, it is characterised in that including：First support plate is moved to the installation site with second support plate using this pressure head；This pressure is carried out to first support plate and second support plate；Record electric signal reading change of the electrical signal collection unit under different pressure pressures；The electric signal reading is analyzed, judges the convenient pressure of this pressure.
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| CN201710874884.7A CN107656191B (en) | 2017-09-25 | 2017-09-25 | Local pressure state detection assembly, system and method |
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| CN201710874884.7A CN107656191B (en) | 2017-09-25 | 2017-09-25 | Local pressure state detection assembly, system and method |
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| CN105632382A (en) * | 2016-01-04 | 2016-06-01 | 京东方科技集团股份有限公司 | Display device and method for detecting binding condition of binding area |
| CN205487266U (en) * | 2016-03-31 | 2016-08-17 | 上海天马微电子有限公司 | Display panel and display device |
| CN106371234A (en) * | 2016-10-21 | 2017-02-01 | 芜湖赋兴光电有限公司 | Method for pressure detection in anisotropic conductive film (ACF) adhesive hot-pressing process |
| CN106443192A (en) * | 2016-10-31 | 2017-02-22 | 昆山国显光电有限公司 | Detection device and detection method for binding impedance of display screen |
| CN106658947A (en) * | 2016-12-30 | 2017-05-10 | 上海天马有机发光显示技术有限公司 | Flexible circuit board and display panel |
| CN106932643A (en) * | 2017-03-30 | 2017-07-07 | 深圳市立德通讯器材有限公司 | A kind of binding effect detection device and detection method for AMOLED products |
| CN107144602A (en) * | 2017-05-16 | 2017-09-08 | 武汉华星光电技术有限公司 | Binding region conducting particles presses detection method |
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