CN106932643A - A kind of binding effect detection device and detection method for AMOLED products - Google Patents
A kind of binding effect detection device and detection method for AMOLED products Download PDFInfo
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- CN106932643A CN106932643A CN201710203315.XA CN201710203315A CN106932643A CN 106932643 A CN106932643 A CN 106932643A CN 201710203315 A CN201710203315 A CN 201710203315A CN 106932643 A CN106932643 A CN 106932643A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
- G01R31/68—Testing of releasable connections, e.g. of terminals mounted on a printed circuit board
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- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
The invention discloses a kind of binding effect detection device for AMOLED products, AMOLED products include AMOLED glass plates, IC chip and FPC wiring boards, and FPC wiring boards are provided with two groups of COG test points electrically connected with IC chip.Binding effect detection device includes：Base, rotating detector and display, rotating detector is provided with two groups of COG impedance probes, the arrangement position of two groups of impedance probes is identical with two groups of COG test points respectively, and rotating detector can turn to FPC wiring boards top, and two groups of COG impedance probes are contacted with two groups of COG test points.The invention allows for a kind of detection method of above-mentioned binding effect detection device.The present invention judges to bind effect by detecting binding impedance, improves detection efficiency and automatization level.
Description
Technical field
The present invention relates to AMOLED production detection technique fields, more particularly to a kind of binding for AMOLED products
Effect detection device and detection method.
Background technology
The Chinese full name of AMOLED is active matrix organic light-emitting diode or active-matrix organic light emitting diode, COG
（Chip On Glass）Refer to a kind of adhesive film comprising metallic particles（Anisotropic conductive film ACF）, will by precompressed
IC chip is bundled on AMOLED glass plates, connects the circuit between IC and LCD glass plates.It is single because IC chip area is small
I/O ends quantity is more.Want to make the circuit between IC and AMOLED glass plates connect well, it is necessary to carry out IC and AMOLED
Point-device positioning.
It is general using small MARK points are set in IC chip and AMOLED glass plates in the prior art, looked into by human eye
Whether both perfectly aligned binding effects to judge IC chip and AMOLED glass plates of MARK points are seen, because MARK points are non-
Often small, the identification of people's eye examination is highly difficult, and people's eyes tire easily and subjectivity are strong, for judging the contraposition of this high accuracy not only
False drop rate is high and efficiency is very low.
The content of the invention
In order to solve drawbacks described above present in prior art, the present invention proposes a kind of binding effect for AMOLED products
Fruit detection means and detection method, judge to bind effect by detecting binding impedance, improve detection efficiency and automatization level,
Ensure the quality of production of AMOLED products.
The technical solution adopted by the present invention is to design a kind of binding effect detection device for AMOLED products,
AMOLED products include AMOLED glass plates, the IC chip being bundled on AMOLED glass plates, are bundled on AMOLED glass plates
FPC wiring boards, the conducting end of FPC wiring boards is connected on AMOLED glass plates, test lead is located at outside AMOLED glass plates,
Test lead is provided with two groups of COG test points electrically connected with IC chip.
Binding effect detection device includes：Base, the rotating detector being rotatably arranged on base are electrically connected with rotating detector
Display, rotating detector is provided with two groups of COG impedance probes, the arrangement position of two groups of impedance probes respectively with two groups of COG
Test point is identical.Base is provided with the test section for placing AMOLED products, and rotating detector is can turn on FPC wiring boards
Side, two groups of COG impedance probes are contacted with two groups of COG test points.
Wherein, Measurement and Control System is provided between rotating detector and display, Measurement and Control System includes：With two groups of COG
The measuring circuit of impedance probe connection and CPU, the power supply module being connected on CPU of measuring circuit connection, are provided with A/D in CPU
Modular converter, A/D modular converters receive the analog signal of measuring circuit and are converted into data signal and are sent to CPU, and display connects
It is connected on CPU.
Preferably, CPU is also associated with the memory for storing measurement data.
Preferably, the test lead of FPC wiring boards is additionally provided with two groups of FOG test points electrically connected with conducting end, rotating detector
Be provided with two groups of FOG impedance probes being connected with measuring circuit, the arrangement position of two groups of FOG impedance probes respectively with two groups
FOG test points are identical.Rotating detector can turn to FPC wiring boards top, and two groups of COG impedance probes connect with two groups of COG test points
Touch, while two groups of FOG impedance probes are contacted with two groups of FOG test points.
Preferably, button group is additionally provided with base, button group is comprising power switch, for switching display display result
On open pass and under open passs, power switch is connected with power supply module, above open close and under open connection and be connected on CPU.
The invention allows for a kind of detection method of above-mentioned binding effect detection device, comprise the following steps：
Electricity in step 1, Measurement and Control System, sets the default impedance values of COG and the default impedance values of FOG of CPU；
Step 2, AMOLED products are placed on test section；
Step 3, rotate rotating detector, two groups of COG impedance probes is contacted with two groups of COG test points, two groups of FOG impedance probes and
Two groups of FOG test points contacts, measuring circuit collection COG impedance signals and FOG impedance signals；
COG impedance signals are converted into COG detection impedance values by step 4, CPU, and FOG impedance signals are converted into FOG detection impedance values,
COG detection impedance values are contrasted respectively with the default impedance values of COG, FOG detection impedance values and the default impedance values of FOG again, two
Group detection impedance value carries out step 5 when reaching default impedance value, and step 6 is carried out when not up to；
Step 5, CPU will detect that impedance value is stored in memory, and CPU control displays show qualified information, the AMOLED products
Test terminates；
Step 6, CPU control displays show unqualified information, and the AMOLED product tests terminate.
Compared with prior art, the present invention has advantages below：
1st, with detection speed, lower loss and smaller false drop rate faster；
2nd, the numerical value of binding impedance is accurately detected, 0.1 Ω can be accurate to, accuracy is high；
3rd, support automatic detection, improve production automation level；
4th, product reliability requirement is improved, bad and reliability product not up to standard is bound in effectively detection；
5th, finished product can also be detected, need not be disassembled during industrial analysis.
Brief description of the drawings
With reference to embodiment and accompanying drawing, the present invention is described in detail, wherein：
Fig. 1 is the structural representation of binding effect detection device in the present invention；
Fig. 2 is the test point distribution schematic diagram of AMOLED products in the present invention；
Fig. 3 is the circuit connection block diagram of Measurement and Control System in the present invention；
Fig. 4 is the schematic flow sheet of detection method in the present invention.
Specific embodiment
Binding effect detection device proposed by the present invention, the principle of AMOLED binding impedance detections is in AMOLED glass plates
Circuit, is drawn out to FPC wiring boards, eventually through precision resistance by the two ends design testing impedance point of upper binding region by IC ends
Measuring instrument detects two groups of voltages of test point so as to judge to bind effect.Specifically, as shown in figure 1, AMOLED product bags
Glass plate containing AMOLED, IC chip and FPC wiring boards 3, IC chip precompressed are bundled on AMOLED glass plates, FPC wiring boards 3
Conducting end is bundled on AMOLED glass plates, and the test lead of FPC wiring boards 3 is located at outside AMOLED glass plates, and test lead is provided with
Two groups of COG test points electrically connected with IC chip.As shown in Fig. 2 test lead is additionally provided with two groups of FOG electrically connected with conducting end surveying
Pilot, four groups of test points can be determined that COG（Chip on glass）With the binding effect of FOG (Fpc on glass).
Binding effect detection device includes：Base 1, rotating detector 2 and display 7 on base 1, rotating detector 2
Be rotatably connected on base 1 by a jointed shaft, rotating detector 2 is provided with two groups of COG impedance probes, display 7 with this two groups
COG impedance probes are electrically connected, and two groups of arrangement positions of impedance probe are identical with two groups of COG test points respectively.Base 1 is provided with use
In the test section for placing AMOLED products, rotating detector 2 can turn to the top of FPC wiring boards 3, two groups of COG impedance probes and two
Group COG test point contacts.
Preferably, as shown in figure 1, rotating detector 2 is provided with two groups of FOG impedance probes, two groups of rows of FOG impedance probes
Cloth position is identical with two groups of FOG test points respectively.Rotating detector 2 can turn to the top of FPC wiring boards 3, two groups of COG impedance probes
Contacted with two groups of COG test points, while two groups of FOG impedance probes are contacted with two groups of FOG test points, impedance probe collecting test point
Between impedance value, impedance data and test result are included on display screen 7.
Wherein, as shown in figure 3, being provided with Measurement and Control System between rotating detector 2 and display 7, Measurement and Control System bag
Include：The CPU of measuring circuit and the measuring circuit connection being connected with four groups of impedance probes, the power supply module being connected on CPU, supply
Electric module reliable reference voltage for measuring circuit is provided, and give the power supply such as CPU, display.A/D modular converters are provided with CPU,
A/D modular converters receive the analog signal of measuring circuit and are converted into data signal and are sent to CPU, and display 7 is connected to CPU
On, CPU is also associated with the memory for storing measurement data, and CPU receives the detection impedance value of measuring circuit, data are preserved
In memory, testing result is shown by display 7.
As shown in figure 1, being additionally provided with button group on base 1, button group includes power switch 4, is shown for switching display 7
Opened in result pass 5 and under open pass 6, power switch 4 be connected with power supply module, above opens pass 5 and opens to close with and 6 is connected to
On CPU, 5 a upper test result can be switched over by above opening to close, opened under pass 6 can switch over it is next
Test result, power switch 4 is cut-off or connects power supply module.
As shown in figure 4, a kind of detection method of above-mentioned binding effect detection device, comprises the following steps：
Electricity in step 1, Measurement and Control System, sets the default impedance values of COG and the default impedance values of FOG of CPU；
Step 2, AMOLED products are placed on test section；
Step 3, rotate rotating detector, two groups of COG impedance probes is contacted with two groups of COG test points, two groups of FOG impedance probes and
Two groups of FOG test points contacts, measuring circuit collection COG impedance signals and FOG impedance signals；
COG impedance signals are converted into COG detection impedance values by step 4, CPU, and FOG impedance signals are converted into FOG detection impedance values,
COG detection impedance values are contrasted respectively with the default impedance values of COG, FOG detection impedance values and the default impedance values of FOG again, two
Group detection impedance value carries out step 5 when reaching default impedance value, and step 6 is carried out when not up to；
Step 5, CPU will detect that impedance value is stored in memory, and CPU control displays show qualified information, the AMOLED products
Test terminates；
Step 6, CPU control displays show unqualified information, and the AMOLED product tests terminate.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.
Claims (6)
1. a kind of binding effect detection device for AMOLED products, the AMOLED products comprising AMOLED glass plates, tie up
The IC chip being scheduled on the AMOLED glass plates, the FPC wiring boards being bundled on the AMOLED glass plates, the FPC lines
The conducting end of road plate is connected on AMOLED glass plates, test lead is located at outside AMOLED glass plates, and the test lead is provided with two
The COG test points that group is electrically connected with the IC chip, it is characterised in that the binding effect detection device includes：Base, can revolve
Turn the display that the rotating detector on the base is electrically connected with the rotating detector, the rotating detector is provided with two
Group COG impedance probes, the arrangement position of two groups of impedance probes is identical with two groups of COG test points respectively；The base is provided with
Test section for placing AMOLED products, the rotating detector can turn to FPC wiring boards top, two groups of COG impedances
Probe is contacted with two groups of COG test points.
2. it is as claimed in claim 1 to bind effect detection device, it is characterised in that to be set between the rotating detector and display
There is Measurement and Control System, the Measurement and Control System includes：The measuring circuit being connected with two groups of COG impedance probes and institute
The CPU for stating measuring circuit connection, the power supply module being connected on CPU, are provided with A/D modular converters in the CPU, the A/D turns
Mold changing block receives the analog signal of the measuring circuit and is converted into data signal and is sent to CPU, and the display is connected to institute
State on CPU.
3. it is as claimed in claim 2 to bind effect detection device, it is characterised in that the CPU is also associated with for storing survey
Measure the memory of data.
4. as claimed in claim 2 or claim 3 binding effect detection device, it is characterised in that the test lead be additionally provided with two groups with
The FOG test points of the conducting end electrical connection, the rotating detector is provided with two groups of FOG impedances being connected with the measuring circuit
Probe, the arrangement position of two groups of FOG impedance probes is identical with two groups of FOG test points respectively；The rotating detector can turn to
FPC wiring boards top, two groups of COG impedance probes are contacted with two groups of COG test points, two groups of FOG impedance probes and two
Group FOG test point contacts.
5. it is as claimed in claim 2 to bind effect detection device, it is characterised in that button group, institute are additionally provided with the base
State button group comprising power switch, for switching display display result on open pass and under open pass, the power switch
Be connected with the power supply module, it is described on open pass and under open connection and be connected on the CPU.
6. it is a kind of it is as claimed in claim 4 binding effect detection device detection method, it is characterised in that comprise the following steps：
Electricity in step 1, Measurement and Control System, sets the default impedance values of COG and the default impedance values of FOG of CPU；
Step 2, AMOLED products are placed on test section；
Step 3, rotate rotating detector, two groups of COG impedance probes is contacted with two groups of COG test points, two groups of FOG impedance probes and
Two groups of FOG test points contacts, measuring circuit collection COG impedance signals and FOG impedance signals；
COG impedance signals are converted into COG detection impedance values by step 4, CPU, and FOG impedance signals are converted into FOG detection impedance values,
COG detection impedance values are contrasted respectively with the default impedance values of COG, FOG detection impedance values and the default impedance values of FOG again, two
Group detection impedance value carries out step 5 when reaching default impedance value, and step 6 is carried out when not up to；
Step 5, CPU will detect that impedance value is stored in memory, and CPU control displays show qualified information, the AMOLED products
Test terminates；
Step 6, CPU control displays show unqualified information, and the AMOLED product tests terminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710203315.XA CN106932643A (en) | 2017-03-30 | 2017-03-30 | A kind of binding effect detection device and detection method for AMOLED products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710203315.XA CN106932643A (en) | 2017-03-30 | 2017-03-30 | A kind of binding effect detection device and detection method for AMOLED products |
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| Publication Number | Publication Date |
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| CN106932643A true CN106932643A (en) | 2017-07-07 |
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ID=59426628
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710203315.XA Pending CN106932643A (en) | 2017-03-30 | 2017-03-30 | A kind of binding effect detection device and detection method for AMOLED products |
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Cited By (6)
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| CN107464522A (en) * | 2017-08-01 | 2017-12-12 | 武汉华星光电半导体显示技术有限公司 | A kind of display module and display device |
| CN107656191A (en) * | 2017-09-25 | 2018-02-02 | 京东方科技集团股份有限公司 | This pressure condition detection components, system and method |
| CN108519515A (en) * | 2018-03-30 | 2018-09-11 | 蚌埠国显科技有限公司 | Impedance detection device after a kind of LCD points silver paste |
| CN109493799A (en) * | 2018-11-29 | 2019-03-19 | 昆山国显光电有限公司 | The householder method and device that display panel OTP is adjusted |
| CN109613355A (en) * | 2018-11-30 | 2019-04-12 | 苏州市运泰利自动化设备有限公司 | The Auto-Test System and method of antenna product |
| CN113866678A (en) * | 2020-06-30 | 2021-12-31 | 北京小米移动软件有限公司 | Detection jig, detection method, terminal and storage medium |
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