CN106443192A - Detection device and detection method for binding impedance of display screen - Google Patents
Detection device and detection method for binding impedance of display screen Download PDFInfo
- Publication number
- CN106443192A CN106443192A CN201610985070.6A CN201610985070A CN106443192A CN 106443192 A CN106443192 A CN 106443192A CN 201610985070 A CN201610985070 A CN 201610985070A CN 106443192 A CN106443192 A CN 106443192A
- Authority
- CN
- China
- Prior art keywords
- impedance
- processing module
- signal processing
- test port
- display screen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/16—Measuring impedance of element or network through which a current is passing from another source, e.g. cable, power line
Abstract
The invention discloses a detection device and a detection method for binding impedance of a display screen. The device comprises test ports, an impedance test circuit and a signal processing module, wherein the test ports are preset at the binding end of a screen body; the number of the test ports is greater than or equal to three; the impedance test circuit is connected with the test ports and the signal processing module; impedance among the test ports is converted into an electrical signal, and the electrical signal is transmitted to the signal processing module; the signal processing module receives the electrical signal, and whether the binding impedance is uniform or not is judged according to the electrical signal. By using the device and the method disclosed by the invention, the impedances at all the positions can be automatically detected and compared, and further whether the binding impedance is uniform or not is judged. Compared with a method for manually testing the binding impedance in the prior art, the detection method disclosed by the invention has the advantages that a large amount of human and material resources are saved, and the binding output yield is also improved.
Description
Technical field
The application is related to electronic device field, more particularly to the binding impedance detection method of a kind of electronic equipment display screen and
Device.
Background technology
With expanding economy, various electronic equipments are increasingly common in life.Most of electronic equipments can all be furnished with
Display screen, such as mobile phone screen, display, electronic bill-board etc..In order to obtain more preferable display effect, to the performance of display screen and
The requirement of quality also more and more higher.
The material used by display screen is to determine the performance of display screen and the key factor of quality, conventional display screen material
There are liquid crystal, glass etc..In recent years, occur in that a kind of using active-matrix organic light emitting diode (Active-matrix
Organic light emitting diode, abbreviation AMOLED) as material display screen, referred to as AMOLED display screen.By
Have the advantages that response speed is very fast, contrast is higher, visual angle is wider in AMOLED display screen, obtaining more and more extensive
Application.
The AMOLED display module used by AMOLED display screen is by AMOLED display screen body, drive integrated circult
(Integrated Circuit, abbreviation IC) and module flexible PCB (Flexible Printed Circuit, abbreviation FPC)
Constitute, wherein drive IC and FPC with screen body connected mode have mainly have chip be located at glass on (Chip On Glass, referred to as
COG), chip is located at (Chip On FPC, abbreviation COF) and flexible PCB on flexible PCB and is located at (FPC On on glass
Glass, abbreviation FOG) three kinds.These three connected modes are realized by binding (Bonding) technique, using bonding
Technique can be realized shielding body and low-impedance electric connection between IC and FPC.
If however, bonding is bad, it is excessive to be possible to impedance between screen body and IC, screen body and FPC, causes to shield body picture
Face shows abnormal.This problem is especially prominent in the IC being connected to using COG mode on screen body.The size of current COG IC is not
Disconnected increase, the pressure of bonding technique is difficult to control, and causes module bonding bad, thus causes bonding impedance inequality
Even, so as to easily cause bonding impedance excessive, cause picture to show further abnormal.
Experiment finds, bonding impedance is excessive, and AMOLED display screen picture can be caused the pictures such as glimmer line, bright line occur
Abnormal phenomena, has had a strong impact on the display quality of picture and the yield of output module.
In the prior art, production line test bonding impedance is all by the way of manual test, and manual test is not only difficult
Degree is big, and efficiency is low, and the error in data that tests is larger, when needing a large amount of statistical datas, then need to put into more manpowers and
Equipment, causes serious cost pressure.
Content of the invention
In view of this, the invention provides a kind of display screen binding impedance detection apparatus and method, which can be fast automatic
Detect and compare the impedance for binding each position, when the impedance differences of diverse location exceed preset value, judge binding impedance inequality
Even, the method that middle manual test binds impedance compared to existing technology, save a large amount of manpower and materials.
The embodiment of the present application provides a kind of display screen and binds impedance detection device, including:
The test port that screen body binds end is preset in, the test port quantity is more than or equal to three;
Testing impedance circuit;
Signal processing module;
Wherein,
Testing impedance circuit connects the test port and the signal processing module, and by between the test port
Impedance conversion is the signal of telecommunication and sends it to the signal processing module;
Signal processing module receives the signal of telecommunication, and judges whether binding impedance is uniform according to the signal of telecommunication.
Preferably, the testing impedance circuit includes:
Current source, the current source connects the test port;
Voltage tester end, the voltage tester end connects the test port, and tests the test port voltage, by institute
State voltage to send to signal processing module;
Preferably, the testing impedance circuit includes switch-mode metal-oxide semiconductor field effect transistor, the switch
Break-make and current source that Metal-Oxide Semiconductor field-effect transistor control voltage test lead is connected with test port
The break-make being connected with test port.
Preferably, the signal processing module compare voltage that the different test ports of testing impedance circuit connection are obtained it
Between difference, when the difference more than preset value when, judge binding impedance uneven.
Preferably, the current source is constant-current source.
Preferably, the test port is uniformly distributed in screen body binding end.
Preferably, the display screen is active matrix/organic light emitting diode (AMOLED) display screen.
Preferably, display screen binding impedance detection device also includes analog-to-digital conversion device, for by testing impedance circuit
The signal of telecommunication of transmission is converted into digital signal and is sent to signal processing module.
The embodiment of the present application also provides a kind of display screen binding impedance detection method, including:
Test port is preset at screen body binding end, the test port quantity is more than or equal to three;
Using the impedance described in testing impedance circuit test between test port, and impedance test results are converted into telecommunications
Number, send it to signal processing module;
The signal of telecommunication is received using signal processing module, and judge whether binding impedance is uniform according to the signal of telecommunication.
Presetting test port by end being bound in screen body, coordinates impedance measuring circuit and signal processing module, can be quick
Measurement many places binding resistance, and it is uniform to judge whether binding according to the difference between binding resistance.This process is without the need for people
Work operate, substantial amounts of saved human cost, also improve binding output yield.
Description of the drawings
Accompanying drawing described herein is used for providing further understanding of the present application, constitutes the part of the application, this Shen
Schematic description and description please is used for explaining the application, does not constitute the improper restriction to the application.In the accompanying drawings:
Fig. 1 is the application first embodiment schematic device;
Fig. 2 is one middle impedance test circuit schematic diagram of embodiment;
Fig. 3 is method flow schematic diagram in embodiment two.
Specific embodiment
Purpose, technical scheme and advantage for making the application is clearer, below in conjunction with the application specific embodiment and
Corresponding accompanying drawing is clearly and completely described to technical scheme.Obviously, described embodiment is only the application one
Section Example, rather than whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not doing
The every other embodiment for being obtained under the premise of going out creative work, belongs to the scope of the application protection.
Below in conjunction with accompanying drawing, the technical scheme that each embodiment of the application is provided is described in detail.
Embodiment 1
Fig. 1 is the schematic diagram of the present embodiment device.As shown in figure 1, the device includes:
Test port.Test port is preset in screen body binding end, and the impedance between two test ports is exactly two
Binding impedance between test port.Test port is preferably evenly distributed through screen body binding end, adjacent two test port groups
Test port in a pair;When binding impedance and being uniform, it is also uniform per the impedance between a pair of test port.
Due to impedance to be compared, three test ports are at least needed, could provide at least two impedance test results is used for
Relatively.
The device also includes:
Testing impedance circuit.Testing impedance circuit is used for the impedance that tests between test port, and the impedance conversion is
The signal of telecommunication simultaneously sends it to the signal processing module.
One typical testing impedance circuit is as shown in Fig. 2 including current source, voltage tester end and switch-mode metal-oxidation
Thing semiconductor field effect transistor (Metal Oxide Semiconductor Filed Effect Transistor, referred to as
MOSFET).The connection of the connection of switch MOSFET control electric current source and impedance Z to be measured and voltage tester end and impedance Z to be measured, its
That middle control electric current source is connected with impedance Z to be measured is M1, M2, what control voltage test lead was connected with impedance Z to be measured be M3,
M4, the impedance Z for noting here is the equiva lent impedance between two test ports.Control signal (Ctrl) control M1, M2, M3,
The open and close of this four switch MOSFET of M4.When MOSFET unlatching is switched, the electric current that current source is provided passes through impedance Z,
A voltage U0, the voltage U0 of voltage tester end Impedance measurement Z is produced, and the voltage is sent to signal processing module.
Obviously, according to U0, and the size of current that current source is provided, the size of impedance Z can be obtained according to Ohm's law.
Preferably, current source can be set to constant-current source.Due to constant-current source provide electric current be known and constant,
Convenient during computing impedance Z.
The device also includes:
Signal processing module.Signal processing module receives the signal of telecommunication that testing impedance circuit sends, and according to the telecommunications
Whether uniform number judge to bind impedance.
In the present embodiment, what testing impedance circuit sent is voltage signal, and signal processing module is by the voltage divided by electricity
The electric current that stream source provides, it is possible to draw the impedance between corresponding test port.A resistance can all be provided per a pair of test port
Anti- value, signal processing module compares these resistance values, if the difference between resistance value is more than preset value, then it is assumed that binding impedance
Uneven.
As the voltage signal that the present embodiment middle impedance test circuit sends is a kind of analogue signal, this signal is not easy to
Numerical operation is carried out, when comparing resistance value so as to signal processing module, can be relatively difficult.So as to, it is preferred that in the present embodiment
In, analog-digital converter can be increased, the voltage signal for sending testing impedance circuit is converted into digital signal and is sent to
Signal processing module.According to these digital signals, signal processing module judges whether binding impedance is uniform.
Method by using proposing in the present embodiment, can quickly test and compare the binding impedance of diverse location,
Find to bind the uneven display screen module of impedance so as to rapid.Also, this process is without the need for manual hand manipulation, low cost
Honest and clean.
Embodiment 2
Based on above-mentioned labor, embodiment of the present invention also proposed a kind of display screen binding impedance detection method as schemed
Shown in 3, the method includes:
Test port is preset at screen body binding end, the test port quantity is more than or equal to three (steps S1);
Using the impedance described in testing impedance circuit test between test port, and impedance test results are converted into telecommunications
Number, send it to signal processing module (step S2);
The signal of telecommunication is received using signal processing module, and judge whether binding impedance is uniform according to the signal of telecommunication
(step S3).
Preferably, in the present embodiment, the impedance with the following method to test between the test port is made, and impedance is surveyed
Test result is converted into the signal of telecommunication, sends it to signal processing module:
Current source is provided, the current source connects the test port;
Voltage tester end is provided, the voltage tester end connects the test port, and the test port voltage is tested,
The voltage is sent to signal processing module.
Preferably, in the present embodiment, make with the following method receiving the signal of telecommunication, and judge to tie up according to the signal of telecommunication
Whether constant impedance is uniform:
Compared between the voltage obtained by the different test ports of testing impedance circuit connection using the signal processing module
Difference, when the difference more than preset value when, judge binding impedance uneven.
Presetting test port by end being bound in screen body, can quickly and easily test test port with testing impedance circuit
Between binding impedance, and judge whether impedance uniform using signal processing module.This process is without the need for manual operations.
Claims (10)
1. a kind of display screen binds impedance detection device, it is characterised in that the device includes:
The test port that screen body binds end is preset in, the test port quantity is more than or equal to three;
Testing impedance circuit;
Signal processing module;
Wherein,
Testing impedance circuit connects the test port and the signal processing module, and the impedance between the test port is turned
Turn to the signal of telecommunication and send it to the signal processing module;
Signal processing module receives the signal of telecommunication, and judges whether binding impedance is uniform according to the signal of telecommunication.
2. display screen as claimed in claim 1 binds impedance detection device, it is characterised in that the testing impedance circuit bag
Include:
Current source, the current source connects the test port;
Voltage tester end, the voltage tester end connects the test port, and tests the test port voltage, by the electricity
Signal processing module is delivered in pressure.
3. display screen as claimed in claim 2 binds impedance detection device, it is characterised in that the testing impedance circuit includes
Switch-mode metal-oxide semiconductor field effect transistor, the switch-mode metal-oxide semiconductor field effect transistor control electricity
The break-make that pressure test lead is connected with test port and the break-make that current source is connected with test port.
4. display screen as claimed in claim 2 binds impedance detection device, it is characterised in that the signal processing module compares
The voltage obtained by the different test ports of testing impedance circuit connection, when the difference between the voltage is more than preset value, sentences
Surely binding impedance is uneven.
5. display screen as claimed in claim 2 binds impedance detection device, it is characterised in that the current source is constant-current source.
6. display screen as claimed in claim 1 binds impedance detection device, it is characterised in that the test port is uniformly distributed
End is bound in the screen body.
7. display screen as claimed in claim 1 binds impedance detection device, it is characterised in that the display screen is active-matrix
Organic light emitting diode display screen.
8. display screen as claimed in claim 1 binds impedance detection device, it is characterised in that also include analog-to-digital conversion device, uses
It is converted into digital signal and is sent to signal processing module in the signal of telecommunication for sending testing impedance circuit.
9. a kind of display screen binds impedance detection method, it is characterised in that the method includes:
Test port is preset at screen body binding end, the test port quantity is more than or equal to three;
Using the impedance described in testing impedance circuit test between test port, and impedance test results are converted into the signal of telecommunication send out
Deliver to signal processing module;
The signal of telecommunication is received using signal processing module, and judge whether binding impedance is uniform according to the signal of telecommunication.
10. display screen as claimed in claim 9 binds impedance detection method, it is characterised in that
Impedance described in the use testing impedance circuit test between test port, and impedance test results are converted into telecommunications
Number, signal processing module is sent it to, including:
Current source is provided, the current source connects the test port;
Voltage tester end is provided, the voltage tester end connects the test port, and the test port voltage is tested, by institute
State voltage to send to signal processing module;
The use signal processing module receives the signal of telecommunication, and judges whether uniformly to bind impedance according to the signal of telecommunication,
Including:
Compare the difference between the voltage obtained by the different test ports of testing impedance circuit connection using the signal processing module
Value, when the difference is more than preset value, judges that binding impedance is uneven.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610985070.6A CN106443192A (en) | 2016-10-31 | 2016-10-31 | Detection device and detection method for binding impedance of display screen |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610985070.6A CN106443192A (en) | 2016-10-31 | 2016-10-31 | Detection device and detection method for binding impedance of display screen |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106443192A true CN106443192A (en) | 2017-02-22 |
Family
ID=58208148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610985070.6A Pending CN106443192A (en) | 2016-10-31 | 2016-10-31 | Detection device and detection method for binding impedance of display screen |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106443192A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106932643A (en) * | 2017-03-30 | 2017-07-07 | 深圳市立德通讯器材有限公司 | A kind of binding effect detection device and detection method for AMOLED products |
CN107610625A (en) * | 2017-08-31 | 2018-01-19 | 昆山国显光电有限公司 | Bind impedance test device and binding impedance detecting method |
CN107656191A (en) * | 2017-09-25 | 2018-02-02 | 京东方科技集团股份有限公司 | This pressure condition detection components, system and method |
CN108519515A (en) * | 2018-03-30 | 2018-09-11 | 蚌埠国显科技有限公司 | Impedance detection device after a kind of LCD points silver paste |
CN108828391A (en) * | 2018-07-04 | 2018-11-16 | 京东方科技集团股份有限公司 | The binding detection device of display device |
CN110618088A (en) * | 2019-08-12 | 2019-12-27 | 中车青岛四方机车车辆股份有限公司 | Metal material surface passive film testing device |
CN112782238A (en) * | 2021-01-18 | 2021-05-11 | Oppo广东移动通信有限公司 | Binding exception testing and repairing method and device, electronic equipment and storage medium |
CN113516934A (en) * | 2021-03-17 | 2021-10-19 | 合肥维信诺科技有限公司 | Screen body, circuit board and display device |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003273181A (en) * | 2002-03-12 | 2003-09-26 | Matsushita Electric Ind Co Ltd | Circuit and method for measuring contact resistance of probe |
CN101377528A (en) * | 2007-08-27 | 2009-03-04 | 富士通株式会社 | High-sensitive resistance measuring device and monitoring method of solder bump |
CN101571560A (en) * | 2009-06-03 | 2009-11-04 | 深圳华映显示科技有限公司 | Impedance measurement device, display panel and bonding impedance measurement method |
TW201042269A (en) * | 2009-05-19 | 2010-12-01 | Chunghwa Picture Tubes Ltd | Resistance measuring device, display panel, and measuring method of bonding resistance |
TW201218143A (en) * | 2010-10-28 | 2012-05-01 | Au Optronics Corp | Display device and system for inspecting bonding resistance and inpsecting method thereof |
CN103779251A (en) * | 2014-01-07 | 2014-05-07 | 上海众人网络安全技术有限公司 | COB binding line test method |
CN104201167A (en) * | 2014-07-31 | 2014-12-10 | 京东方科技集团股份有限公司 | Welding pad structure and display device |
CN104730341A (en) * | 2015-03-10 | 2015-06-24 | 昆山龙腾光电有限公司 | Impedance detection circuit and displayer detection device and method |
CN104779238A (en) * | 2014-01-10 | 2015-07-15 | 中芯国际集成电路制造(上海)有限公司 | Detection structure and detection method for detecting the quality of wafer bonding |
CN104777365A (en) * | 2014-01-10 | 2015-07-15 | 法国大陆汽车公司 | Measurement of bonding resistances |
CN105702188A (en) * | 2016-02-05 | 2016-06-22 | 昆山龙腾光电有限公司 | Liquid crystal display device and testing method therefor |
CN205487266U (en) * | 2016-03-31 | 2016-08-17 | 上海天马微电子有限公司 | Display panel and display device |
-
2016
- 2016-10-31 CN CN201610985070.6A patent/CN106443192A/en active Pending
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003273181A (en) * | 2002-03-12 | 2003-09-26 | Matsushita Electric Ind Co Ltd | Circuit and method for measuring contact resistance of probe |
CN101377528A (en) * | 2007-08-27 | 2009-03-04 | 富士通株式会社 | High-sensitive resistance measuring device and monitoring method of solder bump |
TW201042269A (en) * | 2009-05-19 | 2010-12-01 | Chunghwa Picture Tubes Ltd | Resistance measuring device, display panel, and measuring method of bonding resistance |
CN101571560A (en) * | 2009-06-03 | 2009-11-04 | 深圳华映显示科技有限公司 | Impedance measurement device, display panel and bonding impedance measurement method |
TW201218143A (en) * | 2010-10-28 | 2012-05-01 | Au Optronics Corp | Display device and system for inspecting bonding resistance and inpsecting method thereof |
CN103779251A (en) * | 2014-01-07 | 2014-05-07 | 上海众人网络安全技术有限公司 | COB binding line test method |
CN104779238A (en) * | 2014-01-10 | 2015-07-15 | 中芯国际集成电路制造(上海)有限公司 | Detection structure and detection method for detecting the quality of wafer bonding |
CN104777365A (en) * | 2014-01-10 | 2015-07-15 | 法国大陆汽车公司 | Measurement of bonding resistances |
CN104201167A (en) * | 2014-07-31 | 2014-12-10 | 京东方科技集团股份有限公司 | Welding pad structure and display device |
CN104730341A (en) * | 2015-03-10 | 2015-06-24 | 昆山龙腾光电有限公司 | Impedance detection circuit and displayer detection device and method |
CN105702188A (en) * | 2016-02-05 | 2016-06-22 | 昆山龙腾光电有限公司 | Liquid crystal display device and testing method therefor |
CN205487266U (en) * | 2016-03-31 | 2016-08-17 | 上海天马微电子有限公司 | Display panel and display device |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106932643A (en) * | 2017-03-30 | 2017-07-07 | 深圳市立德通讯器材有限公司 | A kind of binding effect detection device and detection method for AMOLED products |
CN107610625A (en) * | 2017-08-31 | 2018-01-19 | 昆山国显光电有限公司 | Bind impedance test device and binding impedance detecting method |
CN107610625B (en) * | 2017-08-31 | 2020-10-27 | 昆山国显光电有限公司 | Bound impedance testing device and bound impedance testing method |
CN107656191B (en) * | 2017-09-25 | 2020-07-21 | 京东方科技集团股份有限公司 | Local pressure state detection assembly, system and method |
CN107656191A (en) * | 2017-09-25 | 2018-02-02 | 京东方科技集团股份有限公司 | This pressure condition detection components, system and method |
CN108519515A (en) * | 2018-03-30 | 2018-09-11 | 蚌埠国显科技有限公司 | Impedance detection device after a kind of LCD points silver paste |
CN108828391A (en) * | 2018-07-04 | 2018-11-16 | 京东方科技集团股份有限公司 | The binding detection device of display device |
CN108828391B (en) * | 2018-07-04 | 2020-12-08 | 京东方科技集团股份有限公司 | Binding detection device of display device |
CN110618088A (en) * | 2019-08-12 | 2019-12-27 | 中车青岛四方机车车辆股份有限公司 | Metal material surface passive film testing device |
CN110618088B (en) * | 2019-08-12 | 2021-11-12 | 中车青岛四方机车车辆股份有限公司 | Metal material surface passive film testing device |
CN112782238A (en) * | 2021-01-18 | 2021-05-11 | Oppo广东移动通信有限公司 | Binding exception testing and repairing method and device, electronic equipment and storage medium |
CN113516934A (en) * | 2021-03-17 | 2021-10-19 | 合肥维信诺科技有限公司 | Screen body, circuit board and display device |
CN113516934B (en) * | 2021-03-17 | 2023-09-29 | 合肥维信诺科技有限公司 | Screen body, circuit board and display device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106443192A (en) | Detection device and detection method for binding impedance of display screen | |
US9443456B2 (en) | Liquid crystal alignment test apparatus and method | |
CN107065247A (en) | A kind of display panel testing method, apparatus and system | |
KR101934439B1 (en) | Display device for deteting bonding defect | |
CN106908971B (en) | The binding blocking apparatus and its binding hold-up interception method of liquid crystal display panel | |
CN107610625B (en) | Bound impedance testing device and bound impedance testing method | |
WO2017197979A1 (en) | Organic electroluminescent display panel, ageing test device and method, and display device | |
US11600806B2 (en) | Auxiliary method and device for OTP adjustment of display panel | |
CN105096781A (en) | Panel detection circuit and method | |
CN110910800B (en) | Source driver | |
CN106872881A (en) | A kind of circuit board testing device, method and system | |
CN107452305A (en) | A kind of current sensing means detected for screen, system and method | |
CN108305577A (en) | A kind of detection device and detection method of display panel | |
CN106409199A (en) | Display panel test system and method | |
CN105629602A (en) | Liquid crystal device | |
CN104916243A (en) | Detection method and device for scan driving circuit and liquid crystal panel | |
CN104299549B (en) | Alignment device and its method are surveyed in screen health check-up | |
US20120059611A1 (en) | Test circuit for testing flexible printed circuit | |
CN204463780U (en) | Short bar tool | |
CN101593480A (en) | The inspection method of display panel | |
CN205506989U (en) | Point screen tool | |
CN107481678A (en) | Backlight drive current monitoring circuit, method and the display device of backlight module | |
CN104297614A (en) | Short-circuit testing device and method for segment code type liquid crystal display module | |
TW200803628A (en) | Lamp current feedback and broken protecting circuit | |
CN207651150U (en) | A kind of current sensing means and system for screen detection |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170222 |