CN207965406U - Measurement jig and test system - Google Patents
Measurement jig and test system Download PDFInfo
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- CN207965406U CN207965406U CN201820318467.4U CN201820318467U CN207965406U CN 207965406 U CN207965406 U CN 207965406U CN 201820318467 U CN201820318467 U CN 201820318467U CN 207965406 U CN207965406 U CN 207965406U
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Abstract
A kind of measurement jig of the utility model offer and test system.The measurement jig includes fixed part and microscope carrier portion, and fixed part is set in microscope carrier portion, and the first detecting structure and the second detecting structure are provided on fixed part；The first end of first detecting structure is connect by the first connection structure with the first make contact on circuit board, and the first end of the second detecting structure is connect by the second connection structure with the second contact point on circuit board；Microscope carrier portion is for placing display module to be tested, display module includes the first substrate being oppositely arranged and second substrate and the flexible circuit board that is connect with second substrate, the first detection point contact in the second end and flexible circuit board of first detecting structure, the second detection point contact in the second end and first substrate of second detecting structure, so that circuit board is connect with the display module.The utility model realizes the silver paste conducting state of detection display module, avoids manually-operated unstability, effectively reduces the damage caused by display module.
Description
Technical field
The utility model is related to display technology field, more particularly to a kind of measurement jig and test system.
Background technology
In liquid crystal display industry, in the production process of display module, need to carry out a silver paste process to display module, if
When the resistance value of silver paste is excessive, silver paste will be made to fail, display module can not also be detected in lighting test checking process
The bad phenomenon.Therefore, it is necessary to the conducting states to silver paste to test, wherein the effect of silver paste is predominantly connected and shows mould
The color membrane substrates and array substrate of group.
In the test method of existing silver paste conducting state, generally use multimeter is aobvious by the way that test pencil to be overlapped on respectively
Show the color membrane substrates (CF) and flexible circuit board (Flexible Printed Circuit, abbreviation of module：FPC at leakage copper),
The measurement for carrying out resistance value, to detect the conducting state of silver paste.
The test method of existing silver paste conducting state, although test speed is fast, during manual operation it is uncontrollable because
Element is more, and manual operation has unstability, and easily causes to damage to display module.
Utility model content
The utility model aims to solve at least one of problems of the prior art, provides a kind of measurement jig and test
System avoids manually-operated unstability for realizing the silver paste conducting state of detection display module, effectively reduces to display
Damage caused by module.
To achieve the above object, the utility model provides a kind of measurement jig, which includes fixed part and microscope carrier
Portion, the fixed part are set in the microscope carrier portion, and the first detecting structure and the second detecting structure are provided on the fixed part；
The first end of first detecting structure is connect by the first connection structure with the first make contact on circuit board, and described second visits
The first end of geodesic structure is connect by the second connection structure with the second contact point on the circuit board；
For placing display module to be tested, the display module includes the first substrate being oppositely arranged in the microscope carrier portion
The flexible circuit board being connect with second substrate and with the second substrate, the second end of first detecting structure with it is described soft
Property wiring board on the first detection point contact, the second end of second detecting structure and the second detection on the first substrate
Point contact, so that the circuit board is connect with the display module.
Optionally, the microscope carrier portion includes fixed part region and display module region, and the fixed part region is for placing
The fixed part, the display module region is for placing the display module；The fixed part includes first clamp portion and
Two clip portions, the first clamp portion are set to the fixed part region in the microscope carrier portion, and the second clamp portion is located at described the
In one clip portion, first detecting structure and second detecting structure are set in the second clamp portion and described first
The second end of detecting structure and the second end of second detecting structure are stretched out from the second clamp portion.
Optionally, the circuit board includes the first sub-circuit board and the second sub-circuit board, first sub-circuit board and institute
The connection of the second sub-circuit board is stated, second sub-circuit board includes the first make contact and second contact point；
First sub-circuit board is set to the fixed part region in the microscope carrier portion, and first sub-circuit board is located at described
Between microscope carrier portion and the first clamp portion；
Second sub-circuit board is located in the second clamp portion and positioned at the second clamp portion far from the load
The side in platform portion.
Optionally, first sub-circuit board includes test circuit, and the test circuit includes the first connecting pin and second
Connecting pin；
First connection structure includes third detecting structure and the first connecting line, the first end of first detecting structure
It is connected with the first end of the third detecting structure by first connecting line, the second end of the third detecting structure and institute
First make contact contact is stated, the first make contact is connect with first connecting pin；
Second connection structure includes the 4th detecting structure and the second connecting line, the first end of second detecting structure
It is connected with the first end of the 4th detecting structure by the second connecting line, the second end of the 4th detecting structure and described the
Two contact point contacts, second contact point are connect with the second connection end.
Optionally, the 5th detecting structure and the 6th detecting structure, the second son electricity are provided in the first clamp portion
Road plate further includes third contact point and the 4th contact point, and the first make contact is connect with the third contact point, and described second
Contact point is connect with the 4th contact point；
The first end of 5th detecting structure is connect by third connection structure with the third contact point, and the described 5th
The second end of detecting structure is connect with first connecting pin, the second end of the 5th detecting structure court from first clamp portion
It is stretched out to first sub-circuit board；
The first end of 6th detecting structure is connect by the 4th connection structure with the 4th contact point, and the described 6th
The second end of detecting structure is connect with the second connection end, the second end of the 6th detecting structure court from first clamp portion
It is stretched out to first sub-circuit board.
Optionally, the first clamp portion is provided with bulge-structure, is provided in the second clamp portion and the protrusion
The through-hole structure that structure is correspondingly arranged, the bulge-structure are arranged in the through-hole structure.
Optionally, the third connection structure includes the 7th detecting structure and third connecting line, the 5th detecting structure
First end connect with the first end of the 7th detecting structure by the third connecting line, the of the 7th detecting structure
Two ends and the third contact point contact, the third connecting line and the 7th detecting structure be located in the bulge-structure and
The second end of 7th detecting structure is stretched out from the bulge-structure towards second sub-circuit board；
4th connection structure includes the 8th detecting structure and the 4th connecting line, the first end of the 6th detecting structure
It is connect with the first end of the 8th detecting structure by the 4th connecting line, the second end of the 8th detecting structure and institute
State the 4th contact point contact, the 4th connecting line and the 8th detecting structure are located in the bulge-structure and the described 8th
The second end of detecting structure is stretched out from the bulge-structure towards second sub-circuit board.
Optionally, further include：Connecting shaft is led between the edge in the first clamp portion and the edge in the second clamp portion
The connection axis connection is crossed, so that the second clamp portion is rotated by the connecting shaft relative to the first clamp portion.
Optionally, the other edge being oppositely arranged with the edge in the first clamp portion in the first clamp portion is provided with
First buckle structure, the other edge being oppositely arranged with the edge in the second clamp portion in the second clamp portion be provided with
Matched second buckle structure of buckle structure, second buckle structure are mutually clamped with first buckle structure.
Optionally, multiple location structures are provided in the microscope carrier portion, multiple location structures are located at the display mould
Group region, multiple location structures surround accommodation space, and the accommodation space is for accommodating the display module.
Optionally, first detecting structure and second detecting structure are pogo pin, the first detection knot
The shape of the second end of structure and the second end of second detecting structure is round end shape.
Optionally, the second clamp portion includes ontology and the protruding portion extended from ontology, and the ontology is located at institute
Fixed part region is stated, the protruding parts are in the display module region, first detecting structure and the second detection knot
Structure is set in the protruding portion, and orthographic projection of the protruding portion in the microscope carrier portion is with the flexible circuit board in the load
Orthographic projection of the edge of orthographic projection and the first substrate in platform portion in microscope carrier portion is least partially overlapped.
To achieve the above object, the utility model provides a kind of test system, which includes measurement jig and electricity
Road plate, the measurement jig include fixed part and microscope carrier portion, and the fixed part is set in the microscope carrier portion, on the fixed part
It is provided with the first detecting structure and the second detecting structure；The first end of first detecting structure passes through the first connection structure and electricity
First make contact contact on the plate of road, the first end of second detecting structure pass through in the second connection structure and the circuit board
Second contact point contact；
For placing display module to be tested, the display module includes the first substrate being oppositely arranged in the microscope carrier portion
The flexible circuit board being connect with second substrate and with the second substrate, the second end of first detecting structure with it is described soft
Property wiring board on the first detection point contact, the second end of second detecting structure and the second detection on the first substrate
Point contact, so that the circuit board is connect with the display module.
The utility model has the advantages that：
In the technical solution of measurement jig provided by the utility model and test system, the second end of the first detecting structure
With the first detection point contact in flexible circuit board, the second end of the second detecting structure and the second detection on the first substrate
Point contact, so that circuit board is connect with display module, by using the first test point of the first detecting structure and flexible circuit board
Contact, using the second detection point contact of the second detecting structure and first substrate, to realize through circuit board to display module
Point or the conducting state of line silver paste be detected, it is easy to operate, avoid manually-operated unstability, and in test process
It is not easy that display module is caused to damage.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram for measurement jig that the utility model embodiment one provides；
Fig. 2 is the structural schematic diagram of fixed part and circuit board in Fig. 1；
Fig. 3 is the structural schematic diagram in microscope carrier portion in Fig. 1；
Fig. 4 is the structural schematic diagram in first clamp portion in Fig. 2；
Fig. 5 is the structural schematic diagram in second clamp portion in Fig. 2；
Fig. 6 is the structural schematic diagram of the first detecting structure and the second detecting structure in second clamp portion in Fig. 5；
Fig. 7 is the circuit diagram of the test circuit of the first sub-circuit board in Fig. 2；
Fig. 8 is the structural schematic diagram of the 5th detecting structure and the 6th detecting structure in first clamp portion in Fig. 4.
Specific implementation mode
To make those skilled in the art more fully understand the technical solution of the utility model, below in conjunction with the accompanying drawings to this reality
It is described in detail with the measurement jig of novel offer and test system.
Fig. 1 is a kind of structural schematic diagram for measurement jig that the utility model embodiment one provides, and Fig. 2 is fixed in Fig. 1
The structural schematic diagram of portion and circuit board, Fig. 3 are the structural schematic diagram in microscope carrier portion in Fig. 1, as shown in Figure 1 to Figure 3, the measurement jig
Including fixed part 1 and microscope carrier portion 2, fixed part 1 is set in microscope carrier portion 2, and the first detecting structure is provided on fixed part 1 (in figure
It is not shown) and the second detecting structure (not shown)；The first end of first detecting structure by the first connection structure (in figure not
Show) it is connect with the first make contact 421 on circuit board 4, the first end of the second detecting structure is by the second connection structure (in figure
It is not shown) it is connect with the second contact point 422 on circuit board 4.
Microscope carrier portion 2 includes 31 He of first substrate being oppositely arranged for placing display module 3 to be tested, display module 3
Second substrate 32 and the flexible circuit board 33 being connect with second substrate 32, the second end and flexible circuit board of the first detecting structure
The first test point (not shown) contact on 33, the second end of the second detecting structure and the second detection on first substrate 31
Point (not shown) contact, so that circuit board 4 is connect with display module 3.
In the present embodiment, it is preferable that first substrate 31 is color membrane substrates, and second substrate 32 is array substrate, then shows mould
Group 3 is liquid crystal display die set.
In the present embodiment, the first test point in flexible circuit board 33 is the ground terminal in flexible circuit board 33.Wherein, soft
Property wiring board 33 on ground terminal be flexible circuit board 33 on leakage copper at.
In the present embodiment, first substrate 31 includes underlay substrate, and the side of the close second substrate 32 of underlay substrate is arranged
There are black matrix and colored color blocking figure, the side of the separate second substrate 32 of underlay substrate is provided with polarizing film.Preferably, first
The second test point on substrate 31 is located at the surface of the side of the separate second substrate 32 of underlay substrate.Specifically, first substrate
The second test point on 31 is located at the fringe region of a side surface of the separate second substrate 32 of underlay substrate, for example, the first base
The second test point on plate 31 is located at the fringe region except the polarizing film of underlay substrate.
Since the first end of the first detecting structure is connected by the first make contact 411 in the first connection structure and circuit board 4
It connects, the second end of the first detecting structure and the first detection point contact in flexible circuit board 33, the first end of the second detecting structure
It is connect with the second contact point 412 on circuit board 4 by the second connection structure, the second end and first substrate of the second detecting structure
The second detection point contact on 31, so that circuit board 4 and first substrate 31, the silver paste in display module 3, second substrate 32
And form closed circuit between flexible circuit board 33.In the present embodiment, circuit board 4 can be used for detecting silver paste in display module 3
Conducting state.
In the present embodiment, as shown in figure 3, microscope carrier portion 2 includes fixed part region M and display module region N.Wherein, such as Fig. 1
Shown in Fig. 3, fixed part region M is for placing fixed part 1, and display module region N is for placing display module 3.
Fig. 4 is the structural schematic diagram in first clamp portion in Fig. 2, and Fig. 5 is the structural schematic diagram in second clamp portion in Fig. 2, such as
Shown in Fig. 1 to Fig. 5, in the present embodiment, fixed part 1 includes first clamp portion 11 and second clamp portion 12, and first clamp portion 11 is set
It is placed in the fixed part region M in microscope carrier portion 2, second clamp portion 12 is located in first clamp portion 11.Fig. 6 is second clamp portion in Fig. 5
In the structural schematic diagram of the first detecting structure and the second detecting structure, as shown in fig. 6, the first detecting structure 5 and second detection knot
Structure 6 is set in second clamp portion 12 and the second end 52 of the first detecting structure 5 and the second end 62 of the second detecting structure 6 are from
It is stretched out in two clip portions 12.
As shown in Fig. 1, Fig. 3, Fig. 5 and Fig. 6, in the present embodiment, second clamp portion 12 includes ontology 121 and from ontology 121
In the protruding portion 122 that extends, ontology 121 is located at fixed part region M, and protruding portion 122 is located at display module region N, and first visits
Geodesic structure 5 and the second detecting structure 6 are set in protruding portion 122, orthographic projection and flexible wires of the protruding portion 122 in microscope carrier portion 2
Orthographic projection of the edge of orthographic projection and first substrate 31 of the road plate 33 in microscope carrier portion 2 in microscope carrier portion 2 is least partially overlapped.Such as
Shown in Fig. 5, the left-hand component of dotted line is ontology 121 in figure, and the right-hand component of dotted line is protruding portion 122.
As shown in Figure 1 to Figure 3, in the present embodiment, circuit board 4 includes the first sub-circuit board 41 and the second sub-circuit board 42,
First sub-circuit board 41 is connect with the second sub-circuit board 42.Wherein, the first sub-circuit board 41 is set to the fixed part area in microscope carrier portion 2
Domain M, the first sub-circuit board 41 is between microscope carrier portion 2 and first clamp portion 11.Second sub-circuit board 42 is located at second clamp portion
The side in the separate microscope carrier portion 2 on 12 and positioned at second clamp portion 12.
In the present embodiment, as shown in Fig. 2, the second sub-circuit board 42 includes first make contact 421 and second contact point
422.In other words, as shown in Figure 2 and Figure 6, the first end 51 of the first detecting structure 5 passes through the first connection structure and the second sub-circuit
First make contact 421 on plate 42 connects, so that the first detecting structure 5 is connect with first make contact 421；Second detecting structure 6
First end 61 connect with the second contact point 422 on the second sub-circuit board 42 by the second connection structure 8 so that second detection
Structure 6 is connect with the second contact point 422.
Specifically, as shown in Figure 2 and Figure 6, the first connection structure includes third detecting structure 71 and the first connecting line 72, and
The first end 51 of one detecting structure 5 is connected by the first end 711 of the first connecting line 72 and third detecting structure 71, third detection
The second end 712 of structure 71 is contacted with first make contact 421, so that the first detecting structure 5 is connect with first make contact 421.The
Two connection structures include the 4th detecting structure 81 and the second connecting line 82, and the first end 61 of the second detecting structure 6 connects by second
The first end 811 of wiring 82 and the 4th detecting structure 81 connects, the second end 812 and the second contact point of the 4th detecting structure 81
422 contacts, so that the second detecting structure 6 is connect with the second contact point 422.
In the present embodiment, the first sub-circuit board 41 includes test circuit, and Fig. 7 is the test electricity of the first sub-circuit board in Fig. 2
The circuit diagram on road, as shown in Figure 2 and Figure 7, test circuit include the first connecting pin and second connection end.In the present embodiment,
First make contact 421 on second sub-circuit board 42 is connect with the first connecting pin on the first sub-circuit board 41, the second sub-circuit
The second contact point 422 on plate 42 is connect with the second connection end on the first sub-circuit board 41.
Specifically, in the present embodiment, as shown in fig. 7, test circuit includes electric bridge Acquisition Circuit 411, voltage comparator electricity
Road 412, buzzer drive circuit 413 and LED drive circuit 414.Wherein, electric bridge Acquisition Circuit 411 includes connector J1, resistance
R2 and R5 and slide rheostat R6；Voltage comparator circuit 412 includes voltage comparator LM311D and resistance R3；Buzzer drives
Circuit 413 includes resistance R4 and R1, the first triode Q1, the first light emitting diode L1, the first diode D1 and buzzer LS1；
LED drive circuit 414 includes resistance R7 and R8, the second triode Q2 and the second light emitting diode L2.
Wherein, in electric bridge Acquisition Circuit 411, the first end of connector J1 is connected to first node 415, connector J1's
Second end is connect with the first end of resistance R5, and the first end of resistance R2 is connected to first node 415, the second end and cunning of resistance R2
The first end connection of dynamic rheostat R6, the second end of slide rheostat R6 and the second end of resistance R5 connect with ground terminal GND respectively
It connects, first node 415 is connect by switch element S1 with+5V power supplys.Wherein, the resistance value of resistance R2 is 50k, the resistance value of resistance R5
Maximum value for 150k Ω, slide rheostat R6 is 200k Ω, and the resistance value of slide rheostat R6 can be according in display module
The difference of resistance value specification (SPEC) of silver paste be adjusted so that the first sub-circuit board 41 can be suitable for detection different model
Silver paste conducting state.
In the present embodiment, the first connecting pin is the first end of connector J1, and second connection end is the second end of connector J1.
In voltage comparator circuit 412, the first end of voltage comparator LM311D and the 4th end respectively with ground terminal GND
Connection, the second end of voltage comparator LM311D are connect with the second end of the connector J1 in electric bridge Acquisition Circuit 411, voltage ratio
Third end compared with device LM311D is connect with the first end of slide rheostat R6, the power end U1 of voltage comparator LM311D∞Connection
To first node 415, the first end of resistance R3 and the power end U1 of voltage comparator LM311D∞Connection, the second end of resistance R3
It is connect with the output end of voltage comparator LM311D.Wherein, the resistance value of resistance R3 is 1k Ω.
In buzzer drive circuit 413, first end and the voltage comparator in voltage comparator circuit 412 of resistance R4
The output end of LM311D connects, and the second end of resistance R4 is connect with the control pole of the first triode Q1, and the of the first triode Q1
One pole is connect with the first end of buzzer LS1, and the second pole of the first triode Q1 is connect with ground terminal GND, and the first of resistance R1
End is connect with+5V power supplys, and the second end of resistance R1 is connect with the first end of the first light emitting diode L1, the first light emitting diode L1
Second end connect with the first pole of the first triode Q1, the second end of buzzer LS1 is connect with+5V power supplys, the first diode
The first end of D1 is connect with the first end of buzzer LS1, and the second end of the first diode D1 connects with the second end of buzzer LS1
It connects.Wherein, the resistance value of resistance R4 and R1 is equal 1k Ω, and the first diode D1 uses the diode of model 4148, the one or three pole
Pipe Q1 uses PNP type triode.
In LED drive circuit 414, first end and the voltage comparator in voltage comparator circuit 412 of resistance R7
The output end of LM311D connects, and the second end of resistance R7 is connect with the control pole of the second triode Q2, and the of the second triode Q2
Two poles are connect with+5V power supplys, the first end connection of the first electrode resistance R8 of the second triode Q2, the second end of resistance R8 and second
The first end of light emitting diode L2 connects, and the second end of the second light emitting diode L2 is connect with ground terminal GND.Wherein, resistance R7
Resistance value with R8 is 1k Ω, and the second triode Q2 uses NPN type triode.
In the present embodiment, test circuit is used to detect the conducting state of silver paste in display module, the first connecting pin and the
One contact point 421 connects, and second connection end is connect with the second contact point 422, and first make contact 421 passes through the first detecting structure
5 connect with the first test point of flexible circuit board 33, and the second contact point 422 passes through the second detecting structure 6 and first substrate 31
Second test point connects so that test circuit and silver paste, second substrate 32 and the flexible circuitry in first substrate 31, display module
Plate 33 forms closed circuit, so that test circuit can detect the conducting state of silver paste.When the conducting shape for detecting silver paste
When state is bad, driving buzzer LS1 makes a sound signal and the first light emitting diode L1 of driving sends out feux rouges (red)；Work as inspection
Measure silver paste conducting state it is preferable when, driving the second light emitting diode L2 send out green light (green).Therefore, people easy to operation
Member can tell the conducting state of silver paste by buzzer LS1, the first light emitting diode L1 and the second light emitting diode L2, from
And determine non-defective unit and defective products.
In the present embodiment, specifically, connect as shown in Fig. 2, the second sub-circuit board 42 further includes third contact point 423 and the 4th
Contact 424, first make contact 421 are connect with third contact point 423, and the second contact point 422 is connect with the 4th contact point 424.
It should be noted that in the present embodiment, first make contact 421, the second contact point 422, third contact point 423 and
Four contact points 424 are physically located in the side in the close second clamp portion 12 of the second sub-circuit board 42.In fig. 1 and 2 by first
Contact point 421, the second contact point 422, third contact point 423 and the 4th contact point 424 are shown, are for the ease of fairly setting out
The structure of two sub-circuit boards 42.
Fig. 8 is the structural schematic diagram of the 5th detecting structure and the 6th detecting structure in first clamp portion in Fig. 4, such as Fig. 8 and
Shown in Fig. 2, it is provided with the 5th detecting structure 13 and the 6th detecting structure 14 in first clamp portion 11, the of the 5th detecting structure 13
One end 131 is connect by third connection structure with third contact point 423, and the second end 132 and first of the 5th detecting structure 13 connects
End connection is connect, so that third contact point 423 is connect with the first connecting pin, the second end 132 of the 5th detecting structure 13 is pressed from both sides from first
It is stretched out towards the first sub-circuit board 41 in sub-portion 11；The first end 141 of 6th detecting structure 14 passes through the 4th connection structure and the
Four contact points 424 connect, and the second end 142 of the 6th detecting structure 14 connect with second connection end so that the 4th contact point 424 and
Second connection end connects, and the second end 142 of the 6th detecting structure 14 is stretched from first clamp portion 11 towards the first sub-circuit board 41
Go out.
Specifically, as shown in Fig. 8 and Fig. 2, third connection structure includes the 7th detecting structure 151 and third connecting line 152,
The first end 131 of 5th detecting structure 13 is connect by third connecting line 152 with the first end 1511 of the 7th detecting structure 151,
The second end 1512 of 7th detecting structure 151 is contacted with third contact point 423.4th connection structure includes the 8th detecting structure
161 and the 4th connecting line 162, the first end 141 of the 6th detecting structure 14 pass through the 4th connecting line 162 and the 8th detecting structure
161 first end 1611 connects, and the second end 1612 of the 8th detecting structure 161 is contacted with the 4th contact point 424.
In the present embodiment, as shown in figure 4, first clamp portion 11 is additionally provided with bulge-structure 111, as shown in figure 5, the second folder
The through-hole structure 123 being correspondingly arranged with bulge-structure 111 is additionally provided in sub-portion 12, wherein bulge-structure 111 is arranged in through-hole
Structure 123.In the present embodiment, as shown in Fig. 8 and Fig. 4, third connecting line 152 and the 7th detecting structure 151 are located at bulge-structure
In 111 and the second end 1512 of the 7th detecting structure 151 is stretched out from bulge-structure 111 towards the second sub-circuit board 42, and the 4th
Connecting line 162 and the 8th detecting structure 161 are located in bulge-structure 111 and the second end 1612 of the 8th detecting structure 161 is from convex
It rises in structure 111 and is stretched out towards the second sub-circuit board 42.
In the present embodiment, as shown in figure 4, the measurement jig further includes connecting shaft 17, the edge in first clamp portion 11 and
Connected by connecting shaft 17 between the edge in second clamp portion 12 so that second clamp portion 12 by connecting shaft 17 relative to first
Clip portion 11 rotates.Specifically, as shown in figure 4, the edge in first clamp portion 11 is provided with first through hole 112 and the second through-hole
113, as shown in figure 5, the edge in second clamp portion 12 is provided with third through-hole (not shown) and fourth hole 124.Wherein,
First through hole 112 and third through-hole are correspondingly arranged, and the second through-hole 113 and fourth hole 124 are correspondingly arranged, and connecting shaft 17 passes through the
One through-hole 112, the second through-hole 113, third through-hole and fourth hole 124 so that the edge and second clamp in first clamp portion 11
It is connected between the edge in portion 12.
In the present embodiment, as shown in figure 4, being oppositely arranged with the edge in first clamp portion 11 for first clamp portion 11 is another
Edge is provided with the first buckle structure 114；As shown in figure 5, the opposite with the edge in second clamp portion 12 of second clamp portion 12 sets
The other edge set is provided with and 114 matched second buckle structure 125 of the first buckle structure, the second buckle structure 125 and
One buckle structure 114 is mutually clamped.The present embodiment is by the first buckle structure 114 and the second buckle structure 125, in conjunction with connecting shaft
The folding between second clamp portion 12 and first clamp portion 11 may be implemented in 17 setting；In the present embodiment, pass through the first buckle
Structure 114 can control the folding between second clamp portion 12 and first clamp portion 11.As shown in Figure 1, Figure 2, shown in Fig. 4 and Fig. 5,
Test process is in fastening state between the second buckle structure 125 and the first buckle structure 114；Under fastening state, the second card
Buckle structure 125 is arranged in the first buckle structure 114；Under fastening state, second clamp portion 12 can not be revolved by connecting shaft 17
Turn；Under fastening state, the protruding portion 123 in second clamp portion 12 can be additionally used in locating and displaying module 3.It, can after the completion of test
Fastening state is released between second buckle structure 125 and the first buckle structure 114 to be controlled by the first buckle structure 114, is made
Second clamp portion 12 can be rotated by connecting shaft 17 relative to first clamp portion 11, so as to the display mould after testing
Under group 3 is dismantled from microscope carrier portion 2.
In the present embodiment, as shown in figure 3, being provided with multiple location structures 18 in microscope carrier portion 2, multiple location structures 18 are located at
Display module region N, multiple location structures 18 surround accommodation space T, and accommodation space T is for accommodating display module 3.Therefore, lead to
Crossing multiple location structures 18 can make display module 3 be positioned in accommodation space T.As shown in figure 3, the area that dotted line is irised out in figure
Domain is accommodation space T.Pass through 18 locating and displaying module 3 of location structure, it is ensured that stablizing for display module 3 is placed.This implementation
In example, the material in microscope carrier portion 2 is insulating materials, and the material in first clamp portion 11 and second clamp portion 12 is metal material.
In the present embodiment, it is preferable that the first detecting structure 5, the second detecting structure 6, third detecting structure the 71, the 4th detect
Structure 81, the 5th detecting structure 13, the 6th detecting structure 14, the 7th detecting structure 151, the 8th detecting structure 161 are flexible
Probe, the second end 52 of the first detecting structure 5, the second end 62 of the second detecting structure 6, the second end of third detecting structure 71
712, the second end 812 of the 4th detecting structure 81, the second end 132 of the 5th detecting structure 13, the 6th detecting structure 14 second
It is round end to hold second end 1512, the shape of the second end 1612 of the 8th detecting structure 161 of the 142, the 7th detecting structure 151
Shape.Therefore, during the test, it is not easy that display module is caused to damage.
In the technical solution for the measurement jig that the present embodiment is provided, the second end and flexible circuit board of the first detecting structure
On the first detection point contact, the second detection point contact on the second end of the second detecting structure and the first substrate so that
Circuit board is connect with display module, by using the first detection point contact of the first detecting structure and flexible circuit board, uses the
Second detection point contact of two detecting structures and first substrate, to realize point or line silver paste by circuit board to display module
Conducting state be detected, it is easy to operate, avoid manually-operated unstability, and be not easy in test process to show mould
Group causes to damage.
The utility model embodiment two provides a kind of test system, as shown in Figure 1, the test system include measurement jig and
Circuit board 4, measurement jig include fixed part 1 and microscope carrier portion 2, and fixed part 1 is set in microscope carrier portion 2, and is provided on fixed part 1
One detecting structure and the second detecting structure；The first end of first detecting structure passes through the on the first connection structure and circuit board 4
One contact point 421 contacts, and the first end of the second detecting structure is connect by the second connection structure and the second contact point on circuit board 4
Touch 422.
Microscope carrier portion 2 includes 31 He of first substrate being oppositely arranged for placing display module 3 to be tested, display module 3
Second substrate 32 and the flexible circuit board 33 being connect with second substrate 32, the second end and flexible circuit board of the first detecting structure
The first detection point contact on 33, the second end of the second detecting structure and the second detection point contact on first substrate 31, so that
Circuit board 4 is connect with display module 3.
In the present embodiment, measurement jig includes the measurement jig that above-described embodiment one provides, about other of measurement jig
It specifically describes and can be found in above-described embodiment one, details are not described herein again.
In the technical solution for the test system that the present embodiment is provided, the second end and flexible circuit board of the first detecting structure
On the first detection point contact, the second detection point contact on the second end of the second detecting structure and the first substrate so that
Circuit board is connect with display module, by using the first detection point contact of the first detecting structure and flexible circuit board, uses the
Second detection point contact of two detecting structures and first substrate, to realize point or line silver paste by circuit board to display module
Conducting state be detected, it is easy to operate, avoid manually-operated unstability, and be not easy in test process to show mould
Group causes to damage.
It is understood that embodiment of above is merely to illustrate that the principles of the present invention and uses exemplary
Embodiment, however the utility model is not limited thereto.For those skilled in the art, this is not being departed from
In the case of the spirit and essence of utility model, various changes and modifications can be made therein, these variations and modifications are also considered as this reality
With novel protection domain.
Claims (13)
1. a kind of measurement jig, which is characterized in that including fixed part and microscope carrier portion, the fixed part is set to the microscope carrier portion
On, the first detecting structure and the second detecting structure are provided on the fixed part；The first end of first detecting structure passes through
First connection structure is connect with the first make contact on circuit board, and the first end of second detecting structure is tied by the second connection
Structure is connect with the second contact point on the circuit board；
For placing display module to be tested, the display module includes the first substrate being oppositely arranged and the in the microscope carrier portion
Two substrates and the flexible circuit board being connect with the second substrate, second end and the flexible wires of first detecting structure
The first detection point contact on the plate of road, the second end of second detecting structure connect with the second test point on the first substrate
It touches, so that the circuit board is connect with the display module.
2. measurement jig according to claim 1, which is characterized in that the microscope carrier portion includes fixed part region and display mould
Group region, the fixed part region is for placing the fixed part, and the display module region is for placing the display module；
The fixed part includes first clamp portion and second clamp portion, and the first clamp portion is set to the fixed part area in the microscope carrier portion
Domain, the second clamp portion are located in the first clamp portion, first detecting structure and second detecting structure setting
In the second clamp portion and the second end of first detecting structure and the second end of second detecting structure are from described
Second clamp stretches out in portion.
3. measurement jig according to claim 2, which is characterized in that the circuit board includes the first sub-circuit board and second
Sub-circuit board, first sub-circuit board are connect with second sub-circuit board, and second sub-circuit board includes described first
Contact point and second contact point；
First sub-circuit board is set to the fixed part region in the microscope carrier portion, and first sub-circuit board is located at the microscope carrier
Between portion and the first clamp portion；
Second sub-circuit board is located in the second clamp portion and positioned at the second clamp portion far from the microscope carrier portion
Side.
4. measurement jig according to claim 3, which is characterized in that first sub-circuit board includes test circuit, institute
It includes the first connecting pin and second connection end to state test circuit；
First connection structure includes third detecting structure and the first connecting line, and the first end of first detecting structure passes through
First connecting line is connected with the first end of the third detecting structure, the second end of the third detecting structure and described the
One contact point contact, the first make contact are connect with first connecting pin；
Second connection structure includes the 4th detecting structure and the second connecting line, and the first end of second detecting structure passes through
Second connecting line is connected with the first end of the 4th detecting structure, and the second end of the 4th detecting structure connects with described second
Contact, second contact point are connect with the second connection end.
5. measurement jig according to claim 4, which is characterized in that be provided with the 5th detection knot in the first clamp portion
Structure and the 6th detecting structure, second sub-circuit board further include third contact point and the 4th contact point, the first make contact
It is connect with the third contact point, second contact point is connect with the 4th contact point；
The first end of 5th detecting structure is connect by third connection structure with the third contact point, the 5th detection
The second end of structure is connect with first connecting pin, and the second end of the 5th detecting structure is from first clamp portion towards institute
State the stretching of the first sub-circuit board；
The first end of 6th detecting structure is connect by the 4th connection structure with the 4th contact point, the 6th detection
The second end of structure is connect with the second connection end, and the second end of the 6th detecting structure is from first clamp portion towards institute
State the stretching of the first sub-circuit board.
6. measurement jig according to claim 5, which is characterized in that the first clamp portion is provided with bulge-structure, institute
The through-hole structure for being provided in second clamp portion and being correspondingly arranged with the bulge-structure is stated, the bulge-structure is arranged in described logical
Pore structure.
7. measurement jig according to claim 6, which is characterized in that the third connection structure includes the 7th detecting structure
With third connecting line, the first end of the 5th detecting structure pass through the third connecting line and the 7th detecting structure the
One end connects, and the second end of the 7th detecting structure and the third contact point contact, the third connecting line and described the
Seven detecting structures be located in the bulge-structure and the second end of the 7th detecting structure from the bulge-structure towards institute
State the stretching of the second sub-circuit board；
4th connection structure includes the 8th detecting structure and the 4th connecting line, and the first end of the 6th detecting structure passes through
4th connecting line is connect with the first end of the 8th detecting structure, the second end of the 8th detecting structure and described the
Four contact point contacts, the 4th connecting line and the 8th detecting structure are located in the bulge-structure and the 8th detection
The second end of structure is stretched out from the bulge-structure towards second sub-circuit board.
8. according to any measurement jig of claim 2 to 7, which is characterized in that further include：Connecting shaft, first folder
By the connection axis connection between the edge of sub-portion and the edge in the second clamp portion, so that the second clamp portion passes through
The connecting shaft is rotated relative to the first clamp portion.
9. measurement jig according to claim 8, which is characterized in that the first clamp portion with the first clamp portion
The other edge that is oppositely arranged of edge be provided with the first buckle structure, the second clamp portion with the second clamp portion
The other edge that edge is oppositely arranged is provided with and matched second buckle structure of the buckle structure, second buckle structure
It is mutually clamped with first buckle structure.
10. measurement jig according to claim 9, which is characterized in that multiple location structures are provided in the microscope carrier portion,
Multiple location structures are located at the display module region, and multiple location structures surround accommodation space, and the receiving is empty
Between for accommodating the display module.
11. measurement jig according to claim 10, which is characterized in that first detecting structure is detected with described second
Structure is pogo pin, and the shape of the second end of the second end of first detecting structure and second detecting structure is
Round end shape.
12. measurement jig according to claim 2, which is characterized in that the second clamp portion includes ontology and from ontology
In the protruding portion that extends, the ontology is located at the fixed part region, and the protruding parts are in the display module region, institute
It states the first detecting structure and second detecting structure is set in the protruding portion, the protruding portion is in the microscope carrier portion
The edge of orthographic projection and orthographic projection and the first substrate of the flexible circuit board in the microscope carrier portion is in microscope carrier portion
Orthographic projection is least partially overlapped.
13. a kind of test system, which is characterized in that including measurement jig and circuit board, the measurement jig include fixed part and
Microscope carrier portion, the fixed part are set in the microscope carrier portion, and the first detecting structure and the second detection are provided on the fixed part
Structure；The first end of first detecting structure is contacted by the first connection structure with the first make contact on circuit board, described
The first end of second detecting structure passes through the second contact point contact in the second connection structure and the circuit board；
For placing display module to be tested, the display module includes the first substrate being oppositely arranged and the in the microscope carrier portion
Two substrates and the flexible circuit board being connect with the second substrate, second end and the flexible wires of first detecting structure
The first detection point contact on the plate of road, the second end of second detecting structure connect with the second test point on the first substrate
It touches, so that the circuit board is connect with the display module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820318467.4U CN207965406U (en) | 2018-03-08 | 2018-03-08 | Measurement jig and test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820318467.4U CN207965406U (en) | 2018-03-08 | 2018-03-08 | Measurement jig and test system |
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| Publication Number | Publication Date |
|---|---|
| CN207965406U true CN207965406U (en) | 2018-10-12 |
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ID=63741689
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| CN201820318467.4U Active CN207965406U (en) | 2018-03-08 | 2018-03-08 | Measurement jig and test system |
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| CN (1) | CN207965406U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110780474A (en) * | 2019-11-07 | 2020-02-11 | 京东方科技集团股份有限公司 | Conductive adhesive attaching carrying platform, attaching device and attaching method |
| CN113365419A (en) * | 2021-06-04 | 2021-09-07 | 京东方科技集团股份有限公司 | Circuit board and display device |
-
2018
- 2018-03-08 CN CN201820318467.4U patent/CN207965406U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110780474A (en) * | 2019-11-07 | 2020-02-11 | 京东方科技集团股份有限公司 | Conductive adhesive attaching carrying platform, attaching device and attaching method |
| CN113365419A (en) * | 2021-06-04 | 2021-09-07 | 京东方科技集团股份有限公司 | Circuit board and display device |
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| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230118 Address after: 100015 No. 10, Jiuxianqiao Road, Beijing, Chaoyang District Patentee after: BOE TECHNOLOGY GROUP Co.,Ltd. Patentee after: Qingdao BOE Optoelectronic Technology Co.,Ltd. Address before: 100015 No. 10, Jiuxianqiao Road, Beijing, Chaoyang District Patentee before: BOE TECHNOLOGY GROUP Co.,Ltd. Patentee before: BOE (HEBEI) MOBILE DISPLAY TECHNOLOGY Co.,Ltd. |
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