CN101713808B - Probe-type detecting method for authenticating bonding effect of flexible circuit board - Google Patents
Probe-type detecting method for authenticating bonding effect of flexible circuit board Download PDFInfo
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- CN101713808B CN101713808B CN2009102001309A CN200910200130A CN101713808B CN 101713808 B CN101713808 B CN 101713808B CN 2009102001309 A CN2009102001309 A CN 2009102001309A CN 200910200130 A CN200910200130 A CN 200910200130A CN 101713808 B CN101713808 B CN 101713808B
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Abstract
The invention discloses a probe-type detecting method for authenticating the bonding effect of a flexible circuit board, relating to the detection technical field of panel displays. The prior art has the defect of incorrect judgment, the probe-type detecting method is used for carrying out a waveform test on a data drive signal output by a display screen circuit through using an oscilloscope, and an accurate position where a vertical line occurs and the reason of the correctness are judged correctly in comparison with the normal waveform so that the poor reason can be correctly analyzed, a measure can be considered and applied in time, the production cost is reduced, and the product quality is improved.
Description
Technical field
The present invention relates to the detection technique field of flat-panel monitor, especially, be applicable to the bad analysis of vertical line of flat pannel display at the detection method of a kind of evaluation flexible PCB (FPC) nation fixed (Bonding) effect of plasma display.
Background technology
At present, in the flat pannel display industry, the Quality Inspector to the inspection of FPC Bonding process product, technician to Bonding effect and the bad analysis of vertical line, generally all adopt traditional visual means or be aided with instruments such as magnifier, electron microscope and detect, and check projects such as FPC off normal, electrode broken string, foreign matter are sneaked into, ACF build-up of particles according to product specification, whether qualified product made judgement and further analyzed.Owing to judge that the specification tolerance is less, usually reach the dozens of micron order, it is that the IC loop that COF (Chipon FPC) mode is carried again might be by electrostatic breakdown that part FPC is arranged in addition, use classic method to cause error in judgement or poor prognostic cause to fail to understand easily, influence product quality, increased maintenance cost.
Summary of the invention
In order to solve problems of the prior art, the invention provides a kind of probe-type detecting method of identifying bonding effect of flexible circuit board, by adopting oscillograph to carry out the waveform comparative analysis, this method can not only directly judge the short circuit that produces or open circuit and an exact position between screen electrode and FPC electrode, and can judge the short circuit that the IC loop electrostatic breakdown on the FPC causes or open circuit and the exact position.
For this reason, the present invention is by the following technical solutions: identify the probe-type detecting method of bonding effect of flexible circuit board, it is characterized in that it may further comprise the steps:
1) housing of the bad display screen of dismounting vertical line, the used circuit of retention point screen test is removed the encapsulant on the vertical line generation area screen electrode, and the screen electrode of display screen is exposed; This zone is definite substantially according to screen electrode trend.
2) with one in oscillograph two probes scan drive circuit that connects display screen, detect the screen data drive signal with another root probe;
3) start is carried out monochrome according to the vertical line color and is lighted, and contacts successively in the vertical line generation area with probe and respectively shields electrode, according to data signal waveforms shown in the oscillograph, determines the vertical line occurrence positions, and judges that occurrence cause is for opening circuit or short circuit.
4) the vertical line occurrence positions place of Que Dinging, remove the cuticular layer of flexible PCB, expose the flexible circuit plate electrode, again with probe contact flexible circuit plate electrode, the waveform of oscillograph demonstration this moment and the waveform of step 3) are compared, can judge to have or not between screen electrode and the flexible circuit plate electrode and open circuit or short circuit, thereby confirm bonding effect.
As to the improving and replenishing of technique scheme, the present invention further takes the following technical measures or the combination in any of these measures:
The width of described probe tip is less than the width of screen electrode and flexible circuit plate electrode, and general tens of microns needle point can meet the demands substantially.
In the step 4), when the flexible circuit plate electrode is exposed, remove the cuticular layer of flexible PCB Fei Bangding face.
In the step 4), if the waveform that oscillograph shows is consistent with the waveform of step 3), then nation is good surely between explanation screen electrode and the flexible circuit plate electrode; If the waveform that oscillograph shows and the waveform of step 3) are inconsistent, then the nation between explanation screen electrode and the flexible circuit plate electrode has problems surely.
Beneficial effect: the data drive signal that the present invention uses oscillograph that the display screen circuit is exported is carried out waveform measurement, according to the contrast of normal waveform, accurately judge exact position that vertical line takes place and reason accurately, thereby can correctly analyze poor prognostic cause, so that in time consider and implement countermeasure, reduce production cost, improve the quality of products.
Description of drawings
Fig. 1 is a schematic flow sheet of the present invention;
Fig. 2 is the synoptic diagram of each surveyed area of the present invention;
Fig. 3 connects the synoptic diagram of PDP display screen for oscillograph of the present invention;
Fig. 4 is the structural representation in the fixed zone of nation of the present invention;
Fig. 5 removes the structural representation in the fixed zone of nation behind the cuticular layer for FPC of the present invention;
Fig. 6 is the normal waveform synoptic diagram of full grey scale signal of data drive signal of the present invention;
Fig. 7 is the full gray scale chopping signal waveform synoptic diagram of data drive signal of the present invention;
Fig. 8 is the normal waveform synoptic diagram of zero grey scale signal of data drive signal of the present invention;
Fig. 9 is the zero gray scale chopping signal waveform synoptic diagram of data drive signal of the present invention.
Among the figure: 1. screen electrode test zone, 2.FPC electrode test zone, 3.Bonding portion, 4. screen electrode, 5.FPC copper electrode, 6. sheet glass, 7.ACF (Anisotropically conductive film), 8.FPC polyester rete, 9.FPC ink lay.
Embodiment
The probe-type detecting method of evaluation bonding effect of flexible circuit board as shown in Figure 1, key step is as follows:
Peel off encapsulants such as UV resin on the FPC with cutter, the screen electrode (silver electrode) of screen is exposed, and making probe of oscillograph connect scan drive circuit, oscillographic probe is judged its occurrence positions and reason at the inswept successively screen electrode of vertical line generation area according to waveform; Re-use cutter and peel off polyester film on the electrode position that FPC under the vertical line takes place, expose copper electrode, use to survey and detect its waveform, to judge the effect of Bonding.
As shown in Figure 2,, roughly can find out test zone 1, expose silver electrode after peelling off encapsulant, connect after the oscillograph start single color point screen by shown in Figure 3 according to the trend of vertical line occurrence positions and electrode pattern.Light required single color of planting according to the vertical line color: if the black vertical line occurs under monochromatic, use the inswept screen electrode test of probe zone 1, Fig. 7 or Fig. 9 waveform appear if original waveform should be the electrode of Fig. 6 or Fig. 8, can judge vertical line cause for opening circuit with and the position; If monochromatic other color vertical lines occur down, then the waveform of Fig. 6 has appearred in the waveform electrode that should be Fig. 8 originally, can judge vertical line and be short circuit cause with and the position.
Determined that occurrence positions is the bonding effect that needs to confirm again Bonding portion 3 behind screen electrode 4 places.Fig. 4 is the xsect enlarged drawing of Bonding portion, the IC output that signal is carried by FPC, and via FPC copper electrode 5 input Anisotropically conductive films 7, the metallics that contains in the Anisotropically conductive film 7 enters signal input screen electrode 4 in the screen afterwards.Wherein, cuticular layer comprises FPC polyester rete 8 and FPC ink lay 9, and the effect of insulation protection is all arranged, and the polyester film 8 in copper electrode 5 places is struck off, and exposes copper electrode surface 10, re-uses probe and records its waveform.If the waveform that records at 10 places, copper electrode surface is consistent with the waveform that records at screen electrode 4 places, then shielding the Anisotropically conductive film 7 that uses between electrode 4 and the FPC copper electrode 5 is electrically connected functional, and the IC before FPC copper electrode 5 or the FPC copper electrode 5 has produced problem, illustrates that bonding is respond well; Survey different if the waveform that 10 places, copper electrode surface record is normal waveform with screen electrode 4 places, then being electrically connected between explanation screen electrode 4 and the FPC copper electrode 5 made mistakes, and sneaked into foreign matter among the out of joint or Anisotropically conductive film 7 of material Anisotropically conductive film in the Bonding portion 7.
Compare traditional visual or be aided with the visual judgement of instrument, the method more can detect it and be electrically connected performance, more can illustrate its IC loop whether by electrostatic breakdown, each to conducting film whether gone wrong, sneaked into can not be visual foreign matter or the like reason, effect is comparatively desirable.
Should be pointed out that present embodiment just lists expressivity principle of the present invention and effect are described, but not be used to limit the present invention.Any personnel that are familiar with this technology all can make amendment to the foregoing description under spirit of the present invention and scope.Therefore, the scope of the present invention should be listed as claims.
Claims (3)
1. identify the probe-type detecting method of bonding effect of flexible circuit board, it is characterized in that it may further comprise the steps:
1) housing of the bad display screen of dismounting vertical line, the used circuit of retention point screen test is removed the encapsulant on the vertical line generation area screen electrode, and the screen electrode of display screen is exposed;
2) with scan drive circuit that connects display screen in two probes of oscillograph, detect the screen data drive signal with another root;
3) start is carried out monochrome according to the vertical line color and is lighted, and contacts successively in the vertical line generation area with probe and respectively shields electrode, according to data signal waveforms shown in the oscillograph, determines the vertical line occurrence positions, and judges that occurrence cause is for opening circuit or short circuit;
4) the vertical line occurrence positions place of Que Dinging, remove the cuticular layer of flexible PCB, expose the flexible circuit plate electrode, again with probe contact flexible circuit plate electrode, the waveform of oscillograph demonstration this moment and the waveform of step 3) are compared, if the waveform that oscillograph shows is consistent with the waveform of step 3), it is good surely then to shield between electrode and the flexible circuit plate electrode nation; If the waveform that oscillograph shows and the waveform of step 3) are inconsistent, the nation of then shielding between electrode and the flexible circuit plate electrode has problems surely.
2. the probe-type detecting method of evaluation bonding effect of flexible circuit board according to claim 1 is characterized in that: the width of described probe tip is less than the width of screen electrode and flexible circuit plate electrode.
3. the probe-type detecting method of evaluation bonding effect of flexible circuit board according to claim 1 is characterized in that: in the step 4), when the flexible circuit plate electrode is exposed, remove the cuticular layer of flexible PCB Fei Bangding face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2009102001309A CN101713808B (en) | 2009-12-08 | 2009-12-08 | Probe-type detecting method for authenticating bonding effect of flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009102001309A CN101713808B (en) | 2009-12-08 | 2009-12-08 | Probe-type detecting method for authenticating bonding effect of flexible circuit board |
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| CN101713808A CN101713808A (en) | 2010-05-26 |
| CN101713808B true CN101713808B (en) | 2011-08-17 |
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| CN2009102001309A Expired - Fee Related CN101713808B (en) | 2009-12-08 | 2009-12-08 | Probe-type detecting method for authenticating bonding effect of flexible circuit board |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105911453B (en) * | 2016-04-15 | 2019-03-22 | 南京工程学院 | Universal circuit debugging system and method based on virtual instrument technology |
| CN109632800A (en) * | 2019-01-23 | 2019-04-16 | 深圳市骏达光电股份有限公司 | The detection method of FOB class product bonding effect |
| CN110161090B (en) * | 2019-05-23 | 2021-11-02 | 京东方科技集团股份有限公司 | Chip on multilayer film, method for detecting bonding state of chip and display device |
| CN110827729B (en) * | 2019-11-26 | 2022-09-27 | 京东方科技集团股份有限公司 | Detection structure, display panel, manufacturing method and detection method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101071150A (en) * | 2006-05-12 | 2007-11-14 | 上海华仕德电路技术有限公司 | Flexible circuit board circuit on-off detecting method |
| CN101173973A (en) * | 2006-10-30 | 2008-05-07 | 上海华仕德电路技术有限公司 | Method for detecting circuit make-and-break of flexible circuit board |
| CN101488432A (en) * | 2009-03-03 | 2009-07-22 | 南京华显高科有限公司 | Method for improving binding alignment accuracy of shadow mask type plasma display screen |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101071150A (en) * | 2006-05-12 | 2007-11-14 | 上海华仕德电路技术有限公司 | Flexible circuit board circuit on-off detecting method |
| CN101173973A (en) * | 2006-10-30 | 2008-05-07 | 上海华仕德电路技术有限公司 | Method for detecting circuit make-and-break of flexible circuit board |
| CN101488432A (en) * | 2009-03-03 | 2009-07-22 | 南京华显高科有限公司 | Method for improving binding alignment accuracy of shadow mask type plasma display screen |
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