JP5347258B2 - Functional inspection equipment for electronic devices - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a function inspection device for an electronic device capable of bringing a probe into conductive contact with a contact terminal of high-definition pitches stably and accurately, and executing easily highly-accurate function inspection approximately in the same condition as an actual driving time without loading a driving circuit element thereon. <P>SOLUTION: An inspection frame 15 on which a pair of a driver chip 2 for function inspection and an inspection probe 3 is installed movably is rotated toward an inspection object liquid crystal display panel 1, and the inspection probe 3 is brought into conductive contact with input wiring corresponding thereto. Then, the driver chip 2 for function inspection which is the same as a driver chip used for actual driving is brought into conductive contact with each connection terminal corresponding to a gate line, a data line and the input wiring through conductive particles fixed to the tip face of a projecting electrode 202, and an inspection signal supplied from an inspection signal supply device 4 through a flexible wiring substrate 7 is input from the inspection probe 3 into a liquid crystal display panel 1 through the driver chip 2 for function inspection. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a function inspection apparatus for a device on which an integrated circuit element (IC chip) as a drive circuit element is directly mounted.

  As a device in which an integrated circuit element (IC chip) as a drive circuit element is directly mounted, a liquid crystal display panel in which a driver chip is mounted on COG (Chip On Glass) is known. In this COG type liquid crystal display panel, as shown in Patent Document 1, a driver chip as a drive circuit element is directly mounted on one of a pair of glass substrates sandwiching liquid crystal via an anisotropic conductive adhesive or the like. ing.

Conventionally, in order to inspect the display function of the above-mentioned COG type liquid crystal display panel, in order to avoid wasteful disposal of the driver chip, the driver chip is not mounted on the liquid crystal display panel, and the output bump of the driver chip is electrically connected. The inspection probe is brought into conductive contact with the output terminal of the lead wiring to be joined, and inspection signals corresponding to each inspection item such as open, short, and halftone display unevenness are input through the inspection probe.
JP 2006-278442 A

  In recent years, high definition of the liquid crystal display panel has been remarkably promoted, and the pitch of the connection terminals of the lead wirings has been highly refined. When the inspection method is applied, it is extremely difficult to stably and accurately bring the inspection probe into contact with the connection terminals having a fine pitch.

  Further, in the case of the above function inspection method, since the inspection signal is directly input to the output terminal to which the output bump of the driver chip is conductively connected, the driver chip is different from the case where the liquid crystal display panel is actually driven with the COG mounted. Since the conduction contact resistance and internal impedance between the connection terminals corresponding to the bumps of the chip are omitted, it is not possible to evaluate display unevenness during actual driving.

  An object of the present invention is to provide an electronic device function inspection apparatus capable of performing a function inspection of a liquid crystal display panel with high accuracy.

According to a first aspect of the present invention, there is provided a functional testing apparatus for an electronic device that is manufactured in the same manner as a base that supports an electronic device to be tested and an actual driving integrated circuit element mounted on the electronic device. Function testing integrated circuit element having terminal electrodes that are in conductive contact with corresponding connection terminals of the device, an inspection probe that is in conductive contact with an input wiring to which a drive control signal is input from the outside of the electronic device, and a function of the inspection probe The function test signal supply means for inputting the test signal, the function test integrated circuit element, and the test probe are brought into conductive contact with the terminal electrode of the function test integrated circuit element to the corresponding connection terminal of the electronic device. The contact position where the inspection probe is brought into conductive contact with the corresponding input wiring and the terminal electrode are separated from the connection terminal and the inspection is performed. A probe between the spaced positions is spaced apart from the input lines, possess an inspection drive means for reciprocating,
The functional test integrated circuit element includes a main body containing an integrated circuit, a terminal electrode protruding from the main body, a plurality of conductive particles disposed on a protruding end surface of the terminal electrode, and the conductive particles. It consists of a binder resin that makes conductive contact with the projecting end face and at least exposes the surface opposite to the conductive contact face and holds it adhered,
The binder resin is provided so as to be thinner than a binder resin of an anisotropic conductive adhesive used for mounting on an actual machine .

According to a second aspect of the present invention, there is provided the electronic device functional inspection apparatus according to the first aspect, wherein the binder resin has a thickness smaller than a height of the terminal electrode. , Is characterized by.

According to a third aspect of the present invention, there is provided the electronic device functional test apparatus according to the first or second aspect, wherein the functional test integrated circuit element is mounted on a corresponding connection terminal of the electronic device. Conductive particles that are the same as the conductive particles dispersed in the anisotropic conductive adhesive for electrically connecting the terminal electrodes of the driving integrated circuit element, and the same binder resin as the binder resin of the anisotropic conductive adhesive It is characterized by comprising.

The electronic device function inspection apparatus according to claim 4 is the electronic device function inspection apparatus according to any one of claims 1 to 3 , wherein the inspection drive means includes the function. A holding mechanism for holding the inspection integrated circuit element and the inspection probe so as to be movable toward and away from the contact position is provided.

The electronic device function inspection apparatus according to claim 5 is the electronic device function inspection apparatus according to any one of claims 1 to 4 , wherein the electronic device is between a pair of substrates. And a liquid crystal display panel in which the actual driving integrated circuit element is directly mounted on at least one of the pair of substrates.

  According to the electronic device functional inspection apparatus to which the present invention is applied, the functional inspection can be performed under substantially the same conditions as in actual driving, and the inspection accuracy is improved.

  FIG. 1A is a schematic plan view showing a liquid crystal display panel which is a device to be inspected of a functional inspection apparatus for a liquid crystal display panel as one embodiment of the present invention, and FIG. 1B is implemented by the functional inspection apparatus. It is a conceptual diagram which shows the outline of a function test | inspection method.

  The liquid crystal display panel 1 to be inspected is an active matrix type liquid crystal display panel, and a pair of glass substrates 101 and 102 are joined together with a frame-shaped sealing material 103 while maintaining a predetermined gap, and surrounded by the frame-shaped sealing material 103. A liquid crystal (not shown) is sealed between the pair of glass substrates 101 and 102. One end of one glass substrate 101 of the pair of glass substrates 101, 102 protrudes a predetermined length from the corresponding end surface of the other glass substrate 102, and a plurality of opposing surfaces (inner surfaces) of the glass substrate 101 have a plurality of surfaces. A gate line 104 and a data line 105 are arranged in parallel in a direction orthogonal to each other, and a pixel electrode (not shown) and a thin film transistor as a switching element are provided in each section surrounded by the adjacent gate line 104 and data line 105. (Not shown) are respectively provided.

  A single-film common electrode (not shown) is provided on the inner surface of the other glass substrate 102. A common wiring 106 is electrically connected to the common electrode. The common wiring 106 is routed from the glass substrate 102 to the glass substrate 101 side through an inter-substrate conducting member (not shown).

  One pixel electrode forms one pixel so as to face the common electrode with the liquid crystal interposed therebetween, and accordingly, a display unit in which pixels are arranged in a matrix corresponding to the pixel electrodes arranged in a matrix is formed.

  One end of each of the gate lines 104 and the data lines 105 is extended to the substrate protruding portion 101a and is routed, and the connection terminals 104a and 105a at the leading ends are rectangular chips on which a driver chip is mounted COG. Arranged in a zigzag arrangement in two rows along the inner side of the display section side long side in the mounting area A. Further, the connection terminal 106a of the common wiring 16 routed across the substrate is also arranged in the chip mounting area A.

  With respect to the above-described COG type liquid crystal display panel 1, as shown in FIG. 1B, an open, short, and halftone display is performed by the function inspection apparatus for a COG type liquid crystal display panel as one embodiment of the present invention. Perform functional inspection over unevenness items. The functional inspection device of this embodiment is generally composed of a functional inspection driver chip 2, an inspection probe 3, and an inspection signal supply device 4.

  In the function test driver chip 2, as shown in FIG. 3C, a plurality of conductive particles 501 are fixed to the surface of the protruding electrode 202 protruding from the chip body 201 with a binder resin 502. Among these conductive particles 501, at least the conductive particles 501 fixed to the tip surface of the protruding electrode 202 are surely brought into conductive contact with a part of the peripheral surface of the conductive particle 501 and connected to the tip surface of the protruding electrode 202. It is bonded and fixed by a binder resin 502 with the surface opposite to the contact surface exposed. Note that conductive particles 501 are dispersed and attached to the side surfaces of each protruding electrode 202 and the surface of the chip main body 201 between the protruding electrodes 202 at a density lower than that of the tip surface, and adjacent protruding electrodes 202 are electrically connected to each other. There is no risk of short circuit via 501.

In the function test, the tip surface of the protruding electrode 202 to which the semi-exposed conductive particles 501 are fixed is brought into conductive contact with the corresponding connection terminal on the test target liquid crystal display panel side. At this time, in order to obtain a reliable conductive contact state with sufficiently small contact resistance, when the average particle diameter of the conductive particles is 5 μm, the distribution density of the conductive particles 401 on the tip surface of each protruding electrode 202, that is, The number of fixings N per square μm is
(1/400) <N <(1/80) (1)
It is set to satisfy. Therefore, for example, when the area of the tip end surface of the protruding electrode 202 is 1600 square μm, the proper number of fixings is in the range of more than 4 and less than 20.

Next, a method for manufacturing the function testing driver chip 2 will be described with reference to FIGS. 2 (a) to 2 (d) and FIGS. 3 (a) to 3 (c).
First, as a first step, as shown in FIG. 2A, the same driver chip 2 as that used for actual driving is prepared.

  Next, as a second step, as shown in FIG. 2B, the anisotropic conductive adhesive 5 is pressed against the surface of the functional test driver chip 2 on which the protruding electrodes 202 are provided so as to be covered (hereinafter referred to as provisional pressure bonding). Say). The anisotropic conductive adhesive 5 is obtained by dispersing and mixing conductive particles 501 in a thermosetting binder resin 502 and molding the sheet into a sheet shape. The anisotropic conductive adhesive 5 used in the present embodiment is a conductive material having an average particle diameter of about 5 μm formed by plating an alloy made of nickel (Ni) and gold (Au) around resin beads as a core. A material obtained by dispersing and mixing particles 501 in an epoxy resin as a binder resin 502 is formed into a strip-like sheet corresponding to the planar shape of the driver chip 2. The conductive particles 501 in which the Ni—Au film is plated on the resin beads are less rigid than the conductive particles made of Ni particles or Ni—Au particles, and are sandwiched between the projecting electrodes 202 and the corresponding connection terminals. Therefore, the contact resistance can be reduced by securing a wider conductive contact area.

  In addition, the thickness of the anisotropic conductive adhesive 5 to be temporarily pressed is set to a dimension smaller than the height H of the protruding electrode 202, which is thinner than the anisotropic conductive adhesive used for mounting on the actual machine. Is the thickness. For example, if the height H of the protruding electrode 202 of the present embodiment is 12 to 15 μm, the anisotropic conductive adhesive 5 is formed into a sheet having a thickness of about 10 μm.

  Temporary pressure bonding conditions in this case include a heating temperature of 50 to 70 ° C., a pressing force of 3 to 4 MPa which is the same as the pressure when a normal driver chip is COG mounted, and a pressing time of 1 to 2 seconds. Is preferred.

  In the anisotropically conductive adhesive 5 that has been preliminarily pressure-bonded, most of the conductive particles 501 are buried in the binder resin 502 as shown in FIG. 2 (c) showing the Q portion in FIG. 2 (b) in detail. Held in a state.

  In the next third step, as shown in FIG. 2 (d), the thickness of the driver chip 2 on which the above-mentioned anisotropic conductive adhesive material 5 is temporarily bonded is set on the glass table 6 is about 3 μm. The fluorine coating sheet layer 7 is subjected to thermocompression bonding (hereinafter referred to as main compression bonding). As the main press-bonding conditions, it is preferable that the conditions during normal COG mounting, that is, the heating temperature is 160 to 170 ° C., the applied pressure is 3 to 4 MPa, and the pressing time is about 20 seconds.

  In the subsequent fourth step, as shown in FIG. 3A, the function inspection driver chip 2 pressed against the fluorine coating sheet layer 7 is parallel to the surface of the fluorine coating sheet layer 7 indicated by the white arrow P. The function test driver chip 2 is peeled from the fluorine coating sheet layer 7 by pressing in the lateral direction. At this time, the driver chip 2 is smoothly peeled off from the surface of the fluorine coating sheet layer 7 due to the releasing effect of the fluorine coating sheet layer 7.

  FIG. 3B shows a finished product of the function inspection driver chip 2 peeled from the fluorine coating sheet layer 7, and each protruding electrode is shown in FIG. Each of the conductive particles 501 is in a conductive contact with the tip surface of the protruding electrode 202 reliably on the front end surface of 202 and at least a surface opposite to the conductive contact surface is exposed from the binder resin 502. In the state, it is fixed by a cured binder resin 502. The distribution density of the conductive particles 501 fixedly installed satisfies the above formula (1).

  The conductive particles 501 are also fixed between the protruding electrodes 202. Since the anisotropic conductive adhesive 5 is thinner than the height H of the protruding electrodes 202, The distribution density of the conductive particles 501 is smaller than that of the electrode front end surface, and there is no possibility that the adjacent protruding electrodes 202 are short-circuited.

  The inspection probe 3 is formed by arranging the same number of probes as the input wiring 107 of the inspection target liquid crystal display panel 1 shown in FIG.

  FIG. 4 is a structural explanatory view showing, in an enlarged manner, a main part of the function inspection apparatus according to the present embodiment in which the function inspection driver chip 2 and the inspection probe 3 manufactured as described above are incorporated.

  The function inspection driver chip 2 is sucked and held by the vacuum suction block 8, the inspection probe 3 is electrically connected to the flexible wiring board 9 and held by the probe block 11, and each block 8, 11 moves to the moving unit 12 as a single body. It is installed as possible. The moving unit 12 is provided with a position adjusting screw 13 for the inspection probe 3. By operating this, the inspection probe 3 is moved via the block 11 in the X-axis (paper surface parallel plane) direction parallel to the contact target surface. And the Y-axis (perpendicular to the paper surface) direction. The moving unit 12 is configured to reciprocate in the Z-axis direction perpendicular to the XY plane and adjust the position of the function inspection driver chip 2 and the inspection probe 3 in the Z-axis direction. The moving unit 12 is installed so as to be integrally rotatable on an inspection frame 15 that is rotatably supported by a shaft 14. The inspection frame 15 is provided with a window 16 for observing the display on the inspection target liquid crystal display panel 1.

  The liquid crystal display panel 1 to be inspected is held so that the back side thereof can be adjusted and moved by the base 17. Vertical and horizontal position regulating plates 171 and 172 are installed on the base 17, and the vertical and horizontal end face positions of the inspection target liquid crystal display panel 1 are regulated by these.

  In addition, an inspection backlight 18 and an image recognition camera 19 are installed on the base 17 so as to face the back of the display unit and the chip mounting area A (see FIG. 1A), respectively. The image recognition camera 19 is connected to the connection terminals 104a and 105a in the chip mounting area A and the connection terminal portion of the input wiring 107 through the glass substrate 101, and the protrusion on the function test driver chip 2 side connected to these. The electrode 201 is imaged. The image recognition camera 19 is electrically connected to inspection drive control means 21 that controls the drive of the entire functional inspection apparatus.

  The inspection drive control means 21 drives the longitudinal and lateral position restricting plates 171 and 172 via a drive mechanism 22 (not shown) such as a ball screw in accordance with image data from the image recognition camera 19, and the function inspection driver chip 2 and the inspection drive control unit 21. The target liquid crystal display panel 1 is aligned. Further, the driving motor 23 connected to the shaft 14 is driven to reciprocate the inspection frame 15.

  Next, an LCD function inspection procedure and its operation by the function inspection apparatus of the present embodiment will be described based on the step-by-step explanatory diagrams of FIGS.

  First, the inspection target liquid crystal display panel 1 is set on the base 17. As shown in the figure, the base 17 is installed to be inclined at an angle suitable for an inspection operator to observe the display surface of the liquid crystal display panel 1.

  Next, the function inspection driver chip 2 is sucked and held by the vacuum suction block 8, and the inspection frame 15 is separated from the inspection target liquid crystal display panel 1 shown in FIG. The tip of the protruding electrode 2 of the function test driver chip 2 shown in (b) is rotated to a position (contact position) where the corresponding connection terminal to be conductively connected via the conductive particles is brought into contact (contact position). The chip 2 is placed in the chip mounting area A (see FIG. 1A).

  In a state where the function inspection driver chip 2 is placed on the chip mounting area, the image recognition camera 19 captures the conductive contact state and causes the inspection drive control means 21 to output the image data. The inspection drive control means 21 adjusts the position of the liquid crystal display panel 1 by moving the vertical and horizontal position restricting plates 171 and 172 based on the input image data, and the tip surface of the protruding electrode 202 of the function inspection driver chip 2 is Align so that it properly overlaps the corresponding connection terminal.

  In parallel with the above positioning, the position adjusting screw 13 is operated to bring the contact tips of the inspection probes 3 into contact with the appropriate positions of the connection terminals of the corresponding input wiring. In this case, since the parallel pitch of the input wiring is larger than the parallel pitch of the connection terminals on the output wiring (gate line or data line) side, the contact of the inspection probe 3 is accurately placed on the connection terminal portion of the corresponding input wiring. In addition, it can be easily brought into conductive contact.

  When the alignment between the inspection probe 3 and the function inspection driver chip 2 is completed, the inspection frame 15 is pressed toward the liquid crystal display panel 1 with a specified pressure, and an inspection signal is input to the inspection probe 3 in this pressed connection state. To do. The inspection operator observes the display corresponding to the input of the inspection signal through the window 16 and determines the presence or absence of display unevenness in the open, short, and halftone of the wiring.

  As described above, according to the COG type liquid crystal display panel function testing device of the present embodiment, the same driver chip as the driver chip used for actual driving is used as the function testing driver chip 2, and the test probe is used for the input wiring of the driver chip. Since the inspection signal is supplied through the functional inspection driver chip 2 by bringing the inspection probe 3 into conductive contact, the inspection probe 3 is brought into conductive contact with the connection terminal of the output wiring without passing through the driver chip. Unlike the actual driving, the function inspection can be performed under the driving condition with almost the same contact resistance and internal impedance as the actual driving. As a result, not only the inspection items of open and short, but also the display unevenness in the actual driving properly Can be evaluated.

  Further, the inspection probe 3 is brought into conductive contact with the connection terminal portion of the input wiring having a large parallel pitch, and the inspection probe 3 and the function inspection driver chip 2 are unitized by the inspection frame 15 to form the inspection target liquid crystal display panel 1. Since it is configured such that it can be pivoted and separated, a high-precision function inspection for the COG type liquid crystal display panel can always be performed accurately and easily.

  Furthermore, since the function inspection driver chip 2 is formed by thermocompression bonding of the same anisotropic conductive adhesive material used for mounting on the same driver chip as that mounted on the actual machine by the COG method, it is closer to the actual driving time. Since the functional test can be performed under the conditions, and the conductive particles 501 are made of Ni-Au plated on the resin bead surface, a larger conductive contact area is secured by being compressed and deformed during the pressure welding. As a result, it is possible to easily obtain a reliable conductive contact state by reducing the contact resistance.

  Furthermore, since the anisotropic conductive adhesive is thinly thermocompression-bonded to the function test driver chip 2 to expose the conductive particles 51 at the tip end surface of the protruding electrode 21 with a distribution density in an appropriate range, the adjacent protruding electrodes 21 are connected to each other. The projecting electrode 21 and the corresponding connection terminal can always be brought into conductive contact without being short-circuited, and the function test driver chip 2 is commonly used for the same type of liquid crystal display panel. Even if the liquid crystal display panel is discarded, the driver chip is not discarded and wasted.

In addition, this invention is not limited to said embodiment.
For example, the integrated circuit element for function inspection is not limited to the function inspection driver chip 2 in which the conductive particles 51 are fixedly installed on the front end surface of the protruding electrode 21 with the binder resin 52 as in the above embodiment. If the driver chip to be mounted is soldered, a solder ball may be placed on the tip end surface of the protruding electrode of the function testing driver chip. In other words, as an integrated circuit element for function inspection, a material that is the same as or close to that of a conductive connection material used in mounting on an actual device may be installed on the tip surface of the protruding electrode.

  In addition, the functional test integrated circuit element and the test probe do not have to be in conductive contact with the corresponding connection terminal portions at the same time. For example, after the functional test integrated circuit element and the corresponding connection terminal are in conductive contact, The corresponding connection terminal portion may be brought into conductive contact, or conversely, the test probe may be brought into conductive contact and then the function test integrated circuit element may be brought into conductive contact. When performing, the inspection probe and the function inspection integrated circuit element may be surely brought into conductive contact with the corresponding connection terminal portions.

  Further, the present invention can be widely applied not only to a function inspection apparatus for a COG type liquid crystal display panel but also to a function inspection apparatus for various electronic devices directly mounted with a driver chip.

(A) is a typical top view which shows the COG type | mold liquid crystal display panel test | inspected with the function test | inspection apparatus for COG type | mold liquid crystal display panels as one Embodiment of this invention, (b) is implemented by the said function test | inspection apparatus. It is a conceptual diagram which shows the outline of an inspection method. (A) to (d) are details of the Q part in the first, second and second steps in the method of manufacturing the function testing driver chip used in the function testing device for the COG type liquid crystal display panel, respectively. It is each explanatory drawing which shows 3 steps. (A)-(c) is each explanatory drawing which shows the Q section detail in the 4th, 5th step, and 5th step in the manufacturing method of the driver chip for function inspection, respectively. FIG. 4 is an explanatory diagram illustrating an enlarged configuration of a main part of the COG type liquid crystal display panel function testing device. (A), (b) is explanatory drawing according to each step | level which shows operation | movement of the said function test | inspection apparatus for COG type | mold liquid crystal display panels, respectively.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 101,102 Front and back glass board | substrate 101a Protrusion part 2 Driver chip | tip 201 for function test | inspection Chip body 202 Protrusion electrode 3 Inspection probe 4 Inspection signal supply apparatus 5 Anisotropic conductive adhesive 501 Conductive particle 502 Binder resin 6 Glass base 7 Fluorine coating sheet layer 8 Suction block 9 Flexible wiring board 11 Probe block 12 Moving unit 13 Position adjusting screw 14 Shaft 15 Inspection frame 16 Window 17 Bases 171 and 172 Position control plate 18 Backlight for inspection 19 Image recognition camera 21 Inspection drive control means 22 Drive mechanism 23 Drive motor

Claims (5)

A base supporting the electronic device to be inspected;
An integrated circuit element for function testing, which is manufactured in the same manner as the actual driving integrated circuit element mounted on the electronic device, and includes a terminal electrode which is brought into conductive contact with a corresponding connection terminal of the electronic device;
An inspection probe for conducting contact with an input wiring to which a drive control signal is input from the outside of the electronic device;
A function test signal supply means for inputting a function test signal to the test probe;
The functional test integrated circuit element and the test probe are brought into conductive contact with the terminal electrodes of the functional test integrated circuit element with the corresponding connection terminals of the electronic device, and the test probe is brought into conductive contact with the corresponding input wiring. a contact location, between the allowed the separation position spaced the test probe from the input lines causes separating the said terminal electrode from said connecting terminal, and a test drive means for reciprocating, possess,
The functional test integrated circuit element includes a main body containing an integrated circuit, a terminal electrode protruding from the main body, a plurality of conductive particles disposed on a protruding end surface of the terminal electrode, and the conductive particles. It consists of a binder resin that makes conductive contact with the projecting end face and at least exposes the surface opposite to the conductive contact face and holds it adhered,
The electronic device function inspection apparatus , wherein the binder resin is provided so as to be thinner than a binder resin of an anisotropic conductive adhesive used for mounting on an actual machine . 2. The electronic device functional inspection apparatus according to claim 1, wherein the binder resin is provided so that a thickness of the binder resin is smaller than a height of the terminal electrode. The functional test integrated circuit element has the same conductivity as the conductive particles dispersed in the anisotropic conductive adhesive for electrically connecting the terminal electrode of the actual drive integrated circuit element to the corresponding connection terminal of the electronic device. particles and, further comprising the same binder resin as the binder resin of the anisotropic conductive adhesive, the electronic device for function testing device according to claim 1 or 2, characterized in. 2. The inspection driving means includes a holding mechanism that holds the functional inspection integrated circuit element and the inspection probe so as to be movable toward and away from the contact position. any electronic device for function testing device of claim of claim 3. The electronic device is a liquid crystal display panel in which liquid crystal is sandwiched between a pair of substrates, and the actual driving integrated circuit element is directly mounted on at least one of the pair of substrates. function testing device according to claim one of claims 1 to 4.

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