CN113573474A

CN113573474A - Circuit board structure and display device

Info

Publication number: CN113573474A
Application number: CN202110829786.8A
Authority: CN
Inventors: 刘育存
Original assignee: Interface Optoelectronics Shenzhen Co Ltd; Interface Technology Chengdu Co Ltd; General Interface Solution Ltd
Current assignee: Interface Optoelectronics Shenzhen Co Ltd; Interface Technology Chengdu Co Ltd; General Interface Solution Ltd
Priority date: 2021-07-22
Filing date: 2021-07-22
Publication date: 2021-10-29
Anticipated expiration: 2041-07-22
Also published as: CN113573474B

Abstract

The utility model relates to a show technical field, in the circuit board structure that this application embodiment provided and the display device who has this circuit board structure, circuit board structure includes circuit hardboard and flexible circuit board, the circuit hardboard includes first gold finger group and a plurality of first magnetic structure, flexible circuit board includes second gold finger group and a plurality of second magnetic structure, when tying up circuit hardboard and flexible circuit board, first gold finger group and second gold finger group counterpoint, a plurality of first magnetic structure and a plurality of second magnetic structure counterpoint one by one, cooperate through first magnetic structure and second magnetic structure, can realize quick just counterpoint, have the function of preventing staying, avoid binding the direction mistake, and simultaneously, can also improve the situation that the circuit hardboard takes place the warpage in binding process, prevent to bind the skew.

Description

Circuit board structure and display device

Technical Field

The present disclosure relates to display technologies, and particularly to a circuit board structure and a display device having the same.

Background

Compared with the conventional backlight technology, the Mini LED (tiny Light Emitting Diode) backlight technology can greatly improve the contrast ratio and the resolution of the picture, and can enable the liquid crystal display to show better display effect. In the related art, the Mini LED backlight substrate is usually made of an ultra-light, ultra-thin and soft material with toughness, so as to meet the requirement of light and thin overall liquid crystal display.

In the process, because the Mini LED backlight substrate is made of the soft material, when the flexible circuit board is bound with the Mini LED backlight substrate, the Mini LED backlight substrate is easily warped, so that binding deviation is caused.

Disclosure of Invention

Accordingly, there is a need to provide a circuit board structure and a display device having the same, so as to improve the binding offset when the circuit board structures are bound together.

According to a first aspect of the present application, an embodiment of the present application provides a circuit board structure, including:

the circuit hard board is provided with a first binding area, a first golden finger group is arranged in the first binding area, and a plurality of first magnetic structures are arranged in the first binding area around the first golden finger group; and

the flexible circuit board is provided with a second binding area, a second golden finger group aligned with the first golden finger group is arranged in the second binding area, and a plurality of second magnetic structures aligned with the first magnetic structures one by one are arranged in the second binding area around the second golden finger group;

wherein the magnetism of the first magnetic structure is opposite to the magnetism of the second magnetic structure in alignment.

In one embodiment, a magnetic material is arranged on the surface of the first magnetic structure, or the material of the first magnetic structure is a magnetic material;

and a magnetic material is arranged on the surface of the second magnetic structure, or the second magnetic structure is made of a magnetic material.

In one embodiment, the circuit hard board is provided with a first guide structure;

a second guide structure corresponding to the first guide structure is arranged on the flexible circuit board;

the first guide structure is aligned with the second guide structure.

According to a second aspect of the present application, based on the same inventive concept, an embodiment of the present application further provides a circuit board structure, including:

the circuit hard board is provided with a first binding area, a first golden finger group is arranged in the first binding area, and a plurality of magnetic first guide structures are arranged in the first binding area and surround the first golden finger group; and

the flexible circuit board is provided with a second binding area, a second golden finger group which is aligned with the first golden finger group is arranged in the second binding area, a plurality of magnetic second guide structures are arranged in the second binding area around the second golden finger group, and the plurality of second guide structures are aligned with the plurality of first guide structures one by one;

wherein the magnetism of the first guide structure is opposite to that of the second guide structure in alignment

In one embodiment, the first guide structure is a guide hole, and the second guide structure is a guide post;

or, the first guide structure is a guide post, and the second guide structure is a guide hole.

In one embodiment, a first magnetic layer is coated on the inner wall of the guide hole, and a second magnetic layer is coated on the outer wall of the guide column;

the magnetic properties of the first magnetic layer are opposite to those of the second magnetic layer in the para position.

In one embodiment, a first magnetic layer is arranged on the inner wall of the guide hole, and the guide column is made of a magnetic material;

the magnetism of the first magnetic layer is opposite to that of the alignment guide pillar.

In one embodiment, the guide hole is a through hole or a blind hole.

In one embodiment, a conductive adhesive is arranged between the circuit hard board and the flexible circuit board, so that the circuit hard board and the flexible circuit board can be bound by the conductive adhesive.

In one embodiment, the conductive adhesive is an anisotropic conductive adhesive.

In one embodiment, the conductive paste includes N conductive particles, where N is a natural number greater than or equal to 10.

In one embodiment, the conductive particles have a particle size in a range of 3 microns to 8 microns.

In one embodiment, the first gold finger group and the second gold finger group are connected through soldering tin, so that the circuit hard board and the flexible circuit board can be bound through the soldering tin.

In one embodiment, the circuit hard board is a Mini LED backlight substrate.

According to a third aspect of the present application, based on the same inventive concept, an embodiment of the present application further provides a display device, including the above-mentioned circuit board structure.

In the circuit board structure that above-mentioned provided and the display device who has this circuit board structure, circuit board structure includes circuit hardboard and flexible circuit board, the circuit hardboard includes first gold finger group and a plurality of first magnetic structure, the flexible circuit board includes second gold finger group and a plurality of second magnetic structure, when tying up circuit hardboard and flexible circuit board, first gold finger group and second gold finger group counterpoint, a plurality of first magnetic structure and a plurality of second magnetic structure counterpoint one by one, cooperate through first magnetic structure and second magnetic structure, can realize quick just counterpoint, have the function of preventing slow-witted, avoid binding the direction mistake, and simultaneously, can also improve the circuit hardboard and take place the warpage's situation at the in-process of binding, prevent to bind the skew.

Drawings

FIG. 1 is a schematic structural diagram of a circuit board structure before lamination in the related art;

FIG. 2 is a schematic bottom view of the flexible printed circuit board of FIG. 1;

FIG. 3 is a schematic top view of the circuit board of FIG. 1;

FIG. 4 is a schematic structural diagram of a circuit board structure after being pressed in the related art;

FIG. 5 is a schematic structural diagram of a circuit board structure before lamination in an embodiment of the present application;

FIG. 6 is a schematic bottom view of the flexible printed circuit board of FIG. 5;

FIG. 7 is a schematic top view of the circuit board of FIG. 5;

FIG. 8 is a schematic structural diagram of a circuit board structure before lamination in another embodiment of the present application;

FIG. 9 is a schematic structural diagram of a circuit board structure before lamination according to yet another embodiment of the present application;

fig. 10 is a schematic structural diagram of a circuit board structure after being laminated according to an embodiment of the present application;

FIG. 11 is a schematic structural diagram of a circuit board structure after being bonded in another embodiment of the present application;

notation of elements for simplicity:

100: circuit hard board 200: flexible circuit board

300: soldering 400: conductive adhesive

101: bonding pad 102: first CCD alignment mark

110: first gold finger set 120: first magnetic structure

130: first guide structure 131: second magnetic layer

201: bond pad via 202: second CCD alignment mark

210: second gold finger set 220: second magnetic structure

230: second guide structure 231: first magnetic layer

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, specific embodiments of the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth to provide a thorough understanding of embodiments of the present application. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application. The embodiments of this application can be implemented in many different ways than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the invention and therefore the embodiments of this application are not limited to the specific embodiments disclosed below.

It is to be understood that the terms "first," "second," and the like as used herein may be used herein to describe various terms of art, and are not to be construed as indicating or implying relative importance or implicit ly indicating a number of technical features being indicated. However, these terms are not intended to be limiting unless specifically stated. These terms are only used to distinguish one term from another. For example, the first binding region and the second binding region are different binding regions, the first gold finger group and the second gold finger group are different gold finger groups, the first magnetic structure and the second magnetic structure are different magnetic structures, and the first guiding structure and the second guiding structure are different guiding structures without departing from the scope of the present application. In the description of the embodiments of the present application, "a plurality" or "a plurality" means at least two, e.g., two, three, etc., unless specifically defined otherwise.

In the description of the embodiments of the present application, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

In the description of the embodiments of the present application, unless otherwise explicitly specified or limited, a first feature "on" or "under" a second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "above," and "over" a second feature may mean that the first feature is directly above or obliquely above the second feature, or that only the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely below the second feature, or may simply mean that the first feature is at a lesser level than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application in the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

To facilitate understanding of technical solutions of the embodiments of the present application, before describing specific embodiments of the present application, some technical terms in the technical field to which the embodiments of the present application belong are briefly explained.

Mini LEDs, i.e., LED scaling and matrixing, refer to an array of high-density, micro-sized LEDs integrated on a driving substrate, e.g., each pixel is addressable and individually driven to illuminate for display. Mini LED, also known as sub-millimeter light emitting diode, refers to an LED having a die size of about 100 microns or more, with the Mini LED typically having a size of between 100 microns and 300 microns.

ESD (Electro-Static Discharge), also known as electrostatic Discharge, can cause damage to electronic devices or integrated circuit systems due to Electrical Over Stress (EOS). Static electricity is usually generated in the processes of production, assembly, testing, storage, transportation and use, and is accumulated in human bodies, instruments or equipment, even static electricity is accumulated in electronic components, and the static electricity is usually very high in instantaneous voltage (more than several kilovolts), so that the electronic components or an integrated circuit system are damaged by static electricity discharge instantaneously.

As described in the background art, compared with the conventional backlight technology, the Mini LED backlight technology can greatly improve the contrast and resolution of the image, and can make the lcd display a better display effect. In the related art, the Mini LED backlight substrate is usually made of an ultra-light, ultra-thin and soft material with toughness, so as to meet the requirement of light and thin overall liquid crystal display.

Fig. 1 is a schematic structural diagram illustrating a circuit board structure before bonding in the related art; fig. 2 is a schematic bottom view of the flexible circuit board 200 of fig. 1; FIG. 3 is a schematic diagram illustrating a top view of the circuit hardboard 100 of FIG. 1; fig. 4 is a schematic structural diagram illustrating a circuit board structure after being pressed in the related art.

Specifically, as shown in fig. 1 to 4, a circuit board structure in an embodiment of the related art includes a circuit hard board 100 and a flexible circuit board 200, a bonding pad 101 is disposed on the circuit hard board 100, a through hole of the bonding pad 101 aligned with the bonding pad 101 is disposed on the flexible circuit board 200, and the circuit hard board 100 and the flexible circuit board 200 are bonded together by means of a thermal compression solder 300. The inventors of the present application have found that, in this embodiment, since the circuit hard board 100 is made of an ultra-light, ultra-thin material with a soft toughness, the circuit hard board 100 is likely to warp when the thermal compression soldering 300 is performed. Meanwhile, since the circuit hard board 100 is generally made of opaque material, CCD (Charge coupled Device) alignment can only be provided from the hot pressing direction, i.e. above the circuit hard board 100, and since the circuit hard board 100 is warped, when coaxial light of the CCD strikes the warped portion of the circuit hard board 100, light reflection or darkening occurs, which affects the accuracy of the CCD for obtaining the first CCD alignment mark 102 and the second CCD alignment mark 202, and binding offset is easily caused. Besides, the circuit board 100 is provided with solder mask ink at the locations other than the locations where the circuit board is to be soldered and the test points to prevent the corresponding areas from being oxidized and corroded, so that when the bonding deviation occurs, the effective bonding contact area is reduced, which easily results in insufficient bonding force of the solder 300, and further the solder 300 is peeled off from the bonding pad 101, thereby causing an open circuit phenomenon. Further research by the inventors of the present application shows that, in this embodiment, since the through hole of the bonding pad 101 is formed on the flexible circuit board 200 to be bonded with the circuit hard board 100, after the bonding, a conductive metal is formed on the periphery of the through hole of the bonding pad 101, and the exposed conductive metal is likely to cause electrostatic damage.

Typically, these conventional reference designs show the design skills associated with the structure and application of the circuit board of the conventional display backlight device. If the circuit board structure of the backlight device is re-designed and the structure is different from the conventional structure, a mechanism for achieving the desired effects of preventing the deviation and increasing the bonding stability under the condition of simple assembly can be provided. Therefore, there is a need for a circuit board structure that at least partially solves the above mentioned problems.

FIG. 5 is a schematic structural diagram of a circuit board structure before bonding in an embodiment of the present application; fig. 6 is a schematic bottom view of the flexible circuit board 200 of fig. 5; fig. 7 is a schematic diagram illustrating a top view of the circuit hard board 100 in fig. 5.

Referring to fig. 5 to 7, in an embodiment of the present application, a circuit board structure is provided, which includes a circuit hard board 100 and a flexible circuit board 200. The circuit hard board 100 is provided with a first binding region, the first binding region is provided with a first gold finger group 110, and the first binding region is provided with a plurality of first magnetic structures 120 surrounding the first gold finger group 110. The flexible circuit board 200 is provided with a second binding region, a second gold finger group 210 aligned with the first gold finger group 110 is arranged in the second binding region, a plurality of second magnetic structures 220 aligned with the first magnetic structures 120 one by one are arranged in the second binding region around the second gold finger group 210, and the magnetism of the first magnetic structures 120 is opposite to that of the aligned second magnetic structures 220.

In some embodiments, the surface of the first magnetic structure 120 is provided with a magnetic material, or the material of the first magnetic structure 120 is a magnetic material, and the surface of the second magnetic structure 220 is provided with a magnetic material, or the material of the second magnetic structure 220 is a magnetic material.

It should be noted that, as shown in fig. 6, a plurality of second magnetic structures 220 are disposed around the second golden finger group 210, that is, the second magnetic structures 220 are disposed around the second golden finger group 210, and in some embodiments, the second magnetic structures 220 may be disposed on the left side, the right side, the upper side, and the lower side of the second golden finger group 210 shown in fig. 6. Accordingly, as shown in fig. 7, a plurality of first magnetic structures 120 are disposed around the first golden finger group 110, that is, the first magnetic structures 120 are disposed around the first golden finger group 110, and in some embodiments, the first magnetic structures 120 may be disposed on the left side, the right side, the upper side, and the lower side of the first golden finger group 110 as shown in fig. 7. Meanwhile, the magnetism of the first magnetic structure 120 is opposite to that of the second magnetic structure 220, so that when the first magnetic structure 120 and the second magnetic structure 220 are aligned, the warped areas of the circuit hard board 100 and the flexible circuit board 200 can be leveled by the magnetic force.

It should be noted that the magnetism of the first magnetic structure 120 is opposite to that of the second magnetic structure 220 in the alignment position, that is, the magnetism of the plurality of first magnetic structures 120 may be the same or not identical, and the magnetism of the plurality of second magnetic structures 220 may be the same or not identical, as long as the magnetism of the first magnetic structure 120 is opposite to that of the second magnetic structure 220 in the alignment position, which is not specifically limited in the embodiment of the present application.

In addition, in other embodiments, at least one first gold finger with magnetism may be disposed in the first gold finger group 110, and at least one second gold finger with magnetism may be disposed in the second gold finger group 210, where the first gold finger corresponds to the second gold finger, that is, in this embodiment, the first gold finger with magnetism is a first magnetic structure, and the second gold finger with magnetism is a second magnetic structure. It should be noted that, correspondingly, a magnetic material may be disposed on the surface of the first gold finger, or the first gold finger may be made of a magnetic material, and the second gold finger may be made of a magnetic material, or the second gold finger may be made of a magnetic material, as long as the first gold finger and the second gold finger can be attracted to each other, which is not specifically limited in this embodiment of the application.

Therefore, the first magnetic structure 120 and the second magnetic structure 220 are matched, so that quick initial alignment can be realized, a fool-proof function is realized, binding direction errors are avoided, meanwhile, the situation that the circuit hard board 100 is warped in the binding process can be improved, and binding deviation is prevented. By arranging the first golden finger group 110 on the circuit hard board 100 and the second golden finger group 210 on the flexible circuit board 200, the first golden finger group 110 and the second golden finger group 210 are used for binding, and the situation that electrostatic shock occurs at the through hole of the binding pad 101 in the related art is avoided.

With reference to fig. 5 to 7, in some embodiments, the first guide structure 130 is disposed on the circuit hard board 100, the second guide structure 230 corresponding to the first guide structure 130 is disposed on the flexible circuit board 200, the first guide structure 130 and the second guide structure 230 are aligned, and the first guide structure 130 and the second guide structure 230 are disposed in a matching manner to generate a fixing force, so that the alignment accuracy is further improved under the action of the fixing force, a more smooth binding area is obtained, the binding deviation is prevented, and the secondary warpage of the circuit hard board 100 can be prevented. Specifically, in some embodiments, the first guide structure 130 is a guide hole, and the second guide structure 230 is a guide post, or the first guide structure 130 is a guide post, and the second guide structure 230 is a guide hole, and in some embodiments, the guide hole is a through hole or a blind hole, and fig. 5 exemplarily shows an embodiment in which the first guide structure 130 is a guide post, the second guide structure 230 is a guide hole, and the guide hole is a through hole. In particular, in some other embodiments, a plurality of first guide structures 130 may be disposed around first gold finger set 110, that is, the first guide structure 130 may be disposed around the first gold finger group 110, and accordingly, a plurality of second guide structures 230 may be disposed around the second gold finger group 210, that is, the second guiding structure 230 may be arranged around the second gold finger group 210, please refer to fig. 6 and 7, fig. 6 exemplarily shows a case where two second guide structures 230 are provided, fig. 7 exemplarily shows a case where two first guide structures 130 are provided, that is, the two first guide structures 130 are respectively disposed on the left and right sides of the first golden finger group 110, and the two second guide structures 230 are respectively disposed on the left and right sides of the second golden finger group 210.

FIG. 8 is a schematic structural diagram of a circuit board structure before bonding in another embodiment of the present application; fig. 9 is a schematic structural diagram of a circuit board structure before bonding in another embodiment of the present application.

In order to further ensure accurate alignment precision and facilitate alignment, the first guide structure 130 and the second guide structure 230 may be configured to have magnetic guide structures to achieve a function of fast positioning. In some embodiments, referring to fig. 8, the inner wall of the guiding hole is covered with a first magnetic layer 231, the outer wall of the guiding post is covered with a second magnetic layer 131, the second magnetic layer 131 may be covered on the entire outer wall of the guiding post, or may be covered on a part of the surface of the guiding post that is matched with the guiding hole, the magnetism of the first magnetic layer 231 is opposite to that of the second magnetic layer 131 that is aligned, and fig. 8 exemplarily illustrates a case where the guiding hole is a blind hole. In other embodiments, the inner wall of the guiding hole may be further provided with a first magnetic layer 231, the guiding pillar is made of a magnetic material, and the magnetism of the first magnetic layer is opposite to that of the guiding pillar in alignment.

Based on the same inventive concept, in other embodiments, please refer to fig. 9, a magnetic guiding structure may be directly used to replace the first magnetic structure and the second magnetic structure for structural design, and at this time, the first guiding structure 130 and the second guiding structure 230 may both perform a guiding function and perform fast positioning by using the magnetic structures. And in particular to some embodiments, accordingly, as in some of the previous embodiments, the first guide structure 130 is a guide hole and the second guide structure 230 is a guide post, or the first guide structure 130 is a guide post and the second guide structure 230 is a guide hole, and in some embodiments, the guide hole is a through hole or a blind hole, and fig. 9 exemplarily illustrates a case that the guide hole is a blind hole. It should be noted that, the design manner of the magnetic first guiding structure and the magnetic second guiding structure may adopt the manner in the foregoing embodiments, for example, the inner wall of the guiding hole is covered with the first magnetic layer 231, the outer wall of the guiding post is covered with the second magnetic layer 131, the second magnetic layer 131 may be covered on the entire outer wall of the guiding post, or may be covered on a part of the surface of the guiding post that is matched with the guiding hole, the magnetism of the first magnetic layer 231 is opposite to that of the second magnetic layer 131 that is aligned, for example, the inner wall of the guiding hole is provided with the first magnetic layer 231, the material of the guiding post is a magnetic material, and the magnetism of the first magnetic layer is opposite to that of the guiding post that is aligned, which is not limited in this embodiment. Of course, in other embodiments, the first guide structure 130 and the second guide structure 230 having magnetism may also be used together with the first magnetic structure 120 and the second magnetic structure 220 separately provided in the foregoing embodiments, which are not specifically limited by the embodiments of the present application.

Fig. 10 is a schematic structural diagram illustrating a circuit board structure after being bonded in an embodiment of the present application.

Referring to fig. 10, in some embodiments, in order to improve the electrostatic protection capability at the bonding position of the circuit board structure, a conductive adhesive 400 is disposed between the circuit hard board 100 and the flexible circuit board 200, so that the circuit hard board 100 and the flexible circuit board 200 can be bonded by the conductive adhesive 400. Specifically, in some embodiments, the Conductive adhesive 400 is an Anisotropic Conductive adhesive, that is, an ACF (Anisotropic Conductive Film) is used for bonding, so that Conductive particles in the ACF are broken in the pressing process, thereby implementing a vertical conduction and lateral insulation structure. More specifically, since the first gold finger group 110 of the circuit hard board 100 is large in size, the conductive paste 400 including N conductive particles, N being a natural number greater than or equal to 10, may be used, and accordingly, conductive particles having a particle diameter ranging from 3 micrometers to 8 micrometers may be used. Due to the fact that the conductive adhesive 400 is used for binding, the binding strength of the binding area is increased, the connection strength between the circuit hard board 100 and the flexible circuit board 200 is also made to be larger, and therefore the situation that the binding pad 101 is peeled off is improved. Meanwhile, the conductive metal which is not exposed at the hot pressing part can be ensured, and the electrostatic protection capability at the hot pressing part is further improved.

Fig. 11 is a schematic structural diagram of a circuit board structure after being pressed in another embodiment of the present application.

Referring to fig. 11, in some embodiments, the first gold finger group 110 and the second gold finger group 210 are connected by solder 300, so that the circuit hard board 100 and the flexible circuit board 200 can be bonded by the solder 300. In some embodiments, as shown in fig. 11, a situation of performing thermocompression solder bonding using solder balls is exemplarily shown, and more specifically, a plurality of solder balls may be disposed, each of which is disposed on an upper surface of a corresponding first gold finger group 110, and of course, a solder layer may be disposed on the first gold finger group 110 or the second gold finger group 210, which is not specifically limited in this embodiment.

It should be noted that, in some embodiments, the circuit hard board 100 and the flexible circuit board 200 are bound by the conductive adhesive 400 or bound by the solder 300, and of course, the circuit hard board 100 and the flexible circuit board 200 may not be limited to be electrically connected in the above manner, and this is not limited in this application embodiment.

In some embodiments, particularly for some application scenarios, the circuit hard board 100 is a Mini LED backlight substrate, which can be used at least in the backlight technology of Mini LEDs.

Based on the same inventive concept, an embodiment of the present application further provides a display device, including the circuit board structure as described above.

The display device can be applied to the fields of mobile phone terminals, bionic electronics, electronic skins, wearable equipment, vehicle-mounted equipment, Internet of things equipment, artificial intelligence equipment and the like. For example, the display device may be a mobile phone terminal, a tablet, a palmtop, an ipod, a smart watch, a laptop computer, a television, a monitor, or the like.

To sum up, this application embodiment is counterpointed through design magnetism, has realized quick just counterpointing, can prevent staying in order to avoid binding the direction mistake and with the effect that the warpage part in the circuit board structure is levelled, has the through-hole counterpoint of guide function through the design, has ensured the counterpoint precision and has prevented that the secondary warpage's condition from appearing in the part region in the circuit board structure, has solved because of using super light ultra-thin and have the material of toughness and lead to producing the warpage and because of the warpage problem leads to binding the emergence of the circumstances such as skew, air-welding, even tin.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A circuit board structure, comprising:

2. The circuit board structure according to claim 1, wherein a surface of the first magnetic structure is provided with a magnetic material, or the material of the first magnetic structure is a magnetic material;

3. The circuit board structure of claim 1, wherein the circuit board has a first guiding structure;

the first guide structure is aligned with the second guide structure.

4. A circuit board structure, comprising:

wherein the magnetism of the first guide structure is opposite to the magnetism of the second guide structure in alignment.

5. Circuit board structure according to claim 3 or 4, characterised in that the first guiding structures are guiding holes and the second guiding structures are guiding posts;

6. The circuit board structure according to claim 5, wherein the inner wall of the guiding hole is covered with a first magnetic layer, and the outer wall of the guiding post is covered with a second magnetic layer;

7. The circuit board structure according to claim 5, wherein the inner wall of the guiding hole is provided with a first magnetic layer, and the guiding pillar is made of a magnetic material;

8. Circuit-board structure according to claim 5, characterised in that the guide holes are through holes or blind holes.

9. The circuit board structure according to claim 1 or 4, wherein a conductive adhesive is disposed between the circuit hard board and the flexible circuit board, so that the circuit hard board and the flexible circuit board can be bound by the conductive adhesive.

10. The circuit board structure of claim 9, wherein the conductive adhesive is an anisotropic conductive adhesive.

11. The circuit board structure of claim 10, wherein the conductive paste comprises N conductive particles, N being a natural number greater than or equal to 10.

12. The circuit board structure of claim 11, wherein the conductive particles have a particle size in a range of 3 to 8 microns.

13. The circuit board structure of claim 1 or 4, wherein the first gold finger group and the second gold finger group are connected by solder so that the circuit hard board and the flexible circuit board can be bonded by the solder.

14. The circuit board structure according to claim 1 or 4, wherein the circuit board is a Mini LED backlight substrate.

15. A display device, characterized in that it comprises a circuit-board structure according to any one of claims 1-14.