CN1199041C - 光学检验系统 - Google Patents
光学检验系统 Download PDFInfo
- Publication number
- CN1199041C CN1199041C CNB018111912A CN01811191A CN1199041C CN 1199041 C CN1199041 C CN 1199041C CN B018111912 A CNB018111912 A CN B018111912A CN 01811191 A CN01811191 A CN 01811191A CN 1199041 C CN1199041 C CN 1199041C
- Authority
- CN
- China
- Prior art keywords
- camera
- circuit board
- cameras
- light illumination
- data
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95646—Soldering
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95661—Inspecting patterns on the surface of objects for PCB's for leads, e.g. position, curvature
- G01N2021/95669—Inspecting patterns on the surface of objects for PCB's for leads, e.g. position, curvature for solder coating, coverage
Abstract
Description
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/593,352 | 2000-06-14 | ||
US09/593,352 US7075565B1 (en) | 2000-06-14 | 2000-06-14 | Optical inspection system |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1436301A CN1436301A (zh) | 2003-08-13 |
CN1199041C true CN1199041C (zh) | 2005-04-27 |
Family
ID=24374382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB018111912A Expired - Fee Related CN1199041C (zh) | 2000-06-14 | 2001-06-11 | 光学检验系统 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7075565B1 (zh) |
CN (1) | CN1199041C (zh) |
AU (1) | AU2001268283A1 (zh) |
TW (1) | TW530155B (zh) |
WO (1) | WO2001096839A1 (zh) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3953988B2 (ja) * | 2003-07-29 | 2007-08-08 | Tdk株式会社 | 検査装置および検査方法 |
JP4220883B2 (ja) * | 2003-11-05 | 2009-02-04 | 本田技研工業株式会社 | フレームグラバ |
KR20060097250A (ko) * | 2005-03-04 | 2006-09-14 | 아주하이텍(주) | 자동 광학 검사 시스템 및 방법 |
KR101155816B1 (ko) * | 2005-06-17 | 2012-06-12 | 오므론 가부시키가이샤 | 3차원 계측을 행하는 화상 처리 장치 및 화상 처리 방법 |
US20080013823A1 (en) * | 2006-06-30 | 2008-01-17 | Behnke Merlin E | Overhead traveling camera inspection system |
DE102007060355A1 (de) * | 2007-12-12 | 2009-06-25 | Vistec Semiconductor Systems Gmbh | Verfahren und Vorrichtung zur Verarbeitung der von mindestens einer Kamera aufgenommenen Bilddaten der Oberfläche eines Wafers |
IL188825A0 (en) * | 2008-01-16 | 2008-11-03 | Orbotech Ltd | Inspection of a substrate using multiple cameras |
US20110175997A1 (en) * | 2008-01-23 | 2011-07-21 | Cyberoptics Corporation | High speed optical inspection system with multiple illumination imagery |
WO2009094489A1 (en) * | 2008-01-23 | 2009-07-30 | Cyberoptics Corporation | High speed optical inspection system with multiple illumination imagery |
US8872912B2 (en) * | 2009-09-22 | 2014-10-28 | Cyberoptics Corporation | High speed distributed optical sensor inspection system |
US8670031B2 (en) * | 2009-09-22 | 2014-03-11 | Cyberoptics Corporation | High speed optical inspection system with camera array and compact, integrated illuminator |
US8894259B2 (en) * | 2009-09-22 | 2014-11-25 | Cyberoptics Corporation | Dark field illuminator with large working area |
US8388204B2 (en) * | 2009-09-22 | 2013-03-05 | Cyberoptics Corporation | High speed, high resolution, three dimensional solar cell inspection system |
US8681211B2 (en) * | 2009-09-22 | 2014-03-25 | Cyberoptics Corporation | High speed optical inspection system with adaptive focusing |
FI20115241A0 (fi) * | 2011-03-10 | 2011-03-10 | Mapvision Ltd Oy | Konenäköjärjestelmä laadunvalvontaan |
US9417418B2 (en) | 2011-09-12 | 2016-08-16 | Commscope Technologies Llc | Flexible lensed optical interconnect device for signal distribution |
FI125320B (en) * | 2012-01-05 | 2015-08-31 | Helmee Imaging Oy | ORGANIZATION AND SIMILAR METHOD FOR OPTICAL MEASUREMENTS |
CN102788802A (zh) * | 2012-08-29 | 2012-11-21 | 苏州天准精密技术有限公司 | 一种多相机的工件质量检测方法 |
EP2901192B1 (en) | 2012-09-28 | 2020-04-01 | CommScope Connectivity UK Limited | Fiber optic cassette |
US9223094B2 (en) | 2012-10-05 | 2015-12-29 | Tyco Electronics Nederland Bv | Flexible optical circuit, cassettes, and methods |
US9123172B2 (en) | 2013-05-20 | 2015-09-01 | Steven Sebring | Systems and methods for producing visual representations of objects |
CN104422694A (zh) * | 2013-09-11 | 2015-03-18 | 法国圣戈班玻璃公司 | 测量数据的处理装置及处理方法、光学测量系统 |
JP5866673B2 (ja) * | 2014-01-22 | 2016-02-17 | トヨタ自動車株式会社 | 溶接部の画像検査装置及び画像検査方法 |
KR101705086B1 (ko) * | 2014-03-06 | 2017-02-13 | 주식회사 미르기술 | 비전 검사 장치의 영상 신호 제어 장치 |
KR101886947B1 (ko) * | 2014-05-05 | 2018-08-08 | 아르코닉 인코포레이티드 | 용접 측정을 위한 장치 및 방법 |
CN104483324B (zh) * | 2014-12-19 | 2017-10-20 | 核工业理化工程研究院华核新技术开发公司 | 基于多模式配准的在线检测装置 |
CN104483325B (zh) * | 2014-12-19 | 2017-12-15 | 华核(天津)新技术开发有限公司 | 基于多模式配准的在线检测装置及检测方法 |
CN104469118B (zh) * | 2014-12-26 | 2018-04-27 | 大族激光科技产业集团股份有限公司 | 一种相机阵列的视觉增强系统 |
CN104568985A (zh) * | 2014-12-30 | 2015-04-29 | 东莞市合易自动化科技有限公司 | 一种aoi光学检测设备 |
USD812671S1 (en) | 2015-12-03 | 2018-03-13 | Durst Sebring Revolution, Llc | 3D imaging system |
USD798936S1 (en) | 2015-12-03 | 2017-10-03 | Durst Sebring Revolution, Llc | Photo booth |
USD782559S1 (en) | 2015-12-03 | 2017-03-28 | Durst Sebring Revolution, Llc | Photo booth |
USD781948S1 (en) | 2015-12-03 | 2017-03-21 | Durst Sebring Revolution, Llc | Photographic imaging system |
USD822746S1 (en) | 2016-02-05 | 2018-07-10 | Durst Sebring Revolution, Llc | Photo booth |
MX2020002878A (es) | 2017-10-02 | 2020-07-22 | Commscope Technologies Llc | Circuito de fibra optica y metodo de preparacion. |
US11132787B2 (en) * | 2018-07-09 | 2021-09-28 | Instrumental, Inc. | Method for monitoring manufacture of assembly units |
JP7088874B2 (ja) * | 2019-04-09 | 2022-06-21 | 株式会社日立製作所 | 電子部品外観検査システム |
CN113064019A (zh) * | 2019-12-31 | 2021-07-02 | 技嘉科技股份有限公司 | 功能扩充卡测试平台 |
RU2727527C1 (ru) * | 2020-03-10 | 2020-07-22 | Вячеслав Михайлович Смелков | Телевизионная система для наблюдения за перемещением горячего проката |
CN112964723B (zh) * | 2021-02-01 | 2023-11-03 | 苏州百迈半导体技术有限公司 | 一种双面多目标等间距阵列视觉检测方法及检测系统 |
DE102021110149A1 (de) * | 2021-04-21 | 2022-10-27 | Genesys Elektronik Gmbh | Prüfvorrichtung zum Kontrollieren von Bauteiloberflächen und Verfahren dafür |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4896211A (en) * | 1988-04-26 | 1990-01-23 | Picker International, Inc. | Asynchronously triggered single field transfer video camera |
US5060065A (en) | 1990-02-23 | 1991-10-22 | Cimflex Teknowledge Corporation | Apparatus and method for illuminating a printed circuit board for inspection |
US5245421A (en) * | 1990-09-19 | 1993-09-14 | Control Automation, Incorporated | Apparatus for inspecting printed circuit boards with surface mounted components |
US5260779A (en) * | 1992-02-21 | 1993-11-09 | Control Automation, Inc. | Method and apparatus for inspecting a printed circuit board |
US5517234A (en) | 1993-10-26 | 1996-05-14 | Gerber Systems Corporation | Automatic optical inspection system having a weighted transition database |
US5550583A (en) | 1994-10-03 | 1996-08-27 | Lucent Technologies Inc. | Inspection apparatus and method |
BE1009814A5 (nl) * | 1995-11-06 | 1997-08-05 | Framatome Connectors Belgium | Werkwijze en inrichting voor het aanbrengen van elektronische onderdelen in een plaat met gedrukte schakelingen. |
US5974480A (en) * | 1996-10-18 | 1999-10-26 | Samsung Electronics Co., Ltd. | DMA controller which receives size data for each DMA channel |
US6064759A (en) * | 1996-11-08 | 2000-05-16 | Buckley; B. Shawn | Computer aided inspection machine |
DE69919059T2 (de) * | 1998-02-04 | 2005-01-27 | Texas Instruments Inc., Dallas | Datenverarbeitungssytem mit einem digitalen Signalprozessor und einem Koprozessor und Datenverarbeitungsverfahren |
US6260081B1 (en) * | 1998-11-24 | 2001-07-10 | Advanced Micro Devices, Inc. | Direct memory access engine for supporting multiple virtual direct memory access channels |
-
2000
- 2000-06-14 US US09/593,352 patent/US7075565B1/en not_active Expired - Fee Related
-
2001
- 2001-06-11 AU AU2001268283A patent/AU2001268283A1/en not_active Abandoned
- 2001-06-11 CN CNB018111912A patent/CN1199041C/zh not_active Expired - Fee Related
- 2001-06-11 WO PCT/US2001/018649 patent/WO2001096839A1/en active Application Filing
- 2001-06-19 TW TW090114386A patent/TW530155B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US7075565B1 (en) | 2006-07-11 |
AU2001268283A1 (en) | 2001-12-24 |
TW530155B (en) | 2003-05-01 |
CN1436301A (zh) | 2003-08-13 |
WO2001096839A1 (en) | 2001-12-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: LIANGRUI TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: TERADYNE, INC. Effective date: 20041022 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20041022 Address after: Taipei County of Taiwan Applicant after: Teradyne Inc. Address before: Massachusetts, USA Applicant before: Teradyne, INC. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050427 Termination date: 20170611 |