CN119855852A - 树脂组合物、硬化物、半导体元件及干膜抗蚀剂 - Google Patents

树脂组合物、硬化物、半导体元件及干膜抗蚀剂 Download PDF

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Publication number
CN119855852A
CN119855852A CN202380065030.8A CN202380065030A CN119855852A CN 119855852 A CN119855852 A CN 119855852A CN 202380065030 A CN202380065030 A CN 202380065030A CN 119855852 A CN119855852 A CN 119855852A
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CN
China
Prior art keywords
resin composition
group
compound
resin
meth
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Pending
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CN202380065030.8A
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English (en)
Chinese (zh)
Inventor
竹田麻央
锷本麻衣
山本和义
饭冢真之
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Nippon Kayaku Co Ltd
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Nippon Kayaku Co Ltd
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Publication of CN119855852A publication Critical patent/CN119855852A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/36—Amides or imides
    • C08F222/40—Imides, e.g. cyclic imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C08F283/045—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides on to unsaturated polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Pyrrole Compounds (AREA)
  • Materials For Photolithography (AREA)
CN202380065030.8A 2022-10-14 2023-03-30 树脂组合物、硬化物、半导体元件及干膜抗蚀剂 Pending CN119855852A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-165849 2022-10-14
JP2022165849 2022-10-14
PCT/JP2023/013231 WO2024079926A1 (ja) 2022-10-14 2023-03-30 樹脂組成物、硬化物、半導体素子およびドライフィルムレジスト

Publications (1)

Publication Number Publication Date
CN119855852A true CN119855852A (zh) 2025-04-18

Family

ID=90669249

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CN202380065030.8A Pending CN119855852A (zh) 2022-10-14 2023-03-30 树脂组合物、硬化物、半导体元件及干膜抗蚀剂

Country Status (5)

Country Link
JP (1) JPWO2024079926A1 (https=)
KR (1) KR20250087531A (https=)
CN (1) CN119855852A (https=)
TW (1) TW202415707A (https=)
WO (1) WO2024079926A1 (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10195195A (ja) * 1996-12-27 1998-07-28 New Japan Chem Co Ltd オリゴイミド、樹脂改質剤組成物及びこれを用いた熱可塑性樹脂組成物
JPH1124271A (ja) 1997-06-30 1999-01-29 Kurarianto Japan Kk 高耐熱性放射線感応性レジスト組成物
JP5598041B2 (ja) 2010-03-19 2014-10-01 ソニー株式会社 画像処理装置および画像処理方法
US8686162B2 (en) * 2010-08-25 2014-04-01 Designer Molecules Inc, Inc. Maleimide-functional monomers in amorphous form
JP2013083958A (ja) * 2011-09-26 2013-05-09 Nippon Steel & Sumikin Chemical Co Ltd 感光性樹脂組成物、それを用いた硬化物及び半導体素子
JP6635403B2 (ja) 2014-12-26 2020-01-22 荒川化学工業株式会社 樹脂付銅箔、銅張積層板、プリント配線板及び多層配線板
TWI761375B (zh) 2016-09-26 2022-04-21 日商昭和電工材料股份有限公司 樹脂組成物、半導體用配線層積層體及半導體裝置
JP2019104843A (ja) 2017-12-13 2019-06-27 Ａｇｃ株式会社 樹脂組成物、積層体、金属積層板及びプリント配線板
JP2021031530A (ja) * 2019-08-20 2021-03-01 信越化学工業株式会社 熱硬化性樹脂組成物、並びにこれを用いた接着剤、フィルム、プリプレグ、積層板、回路基板及びプリント配線板
JP7283409B2 (ja) 2020-02-07 2023-05-30 信越化学工業株式会社 ビスマレイミド化合物及びその製造方法
JP2021181532A (ja) * 2020-05-19 2021-11-25 信越化学工業株式会社 ビスマレイミド樹脂組成物
JP7455475B2 (ja) * 2020-05-19 2024-03-26 信越化学工業株式会社 熱硬化性マレイミド樹脂組成物並びにこれを用いた接着剤、基板材料、プライマー、コーティング材及び半導体装置

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WO2024079926A1 (ja) 2024-04-18
KR20250087531A (ko) 2025-06-16
TW202415707A (zh) 2024-04-16
JPWO2024079926A1 (https=) 2024-04-18

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