CN119731610A - 温度控制装置、基板处理装置以及温度控制方法 - Google Patents

温度控制装置、基板处理装置以及温度控制方法 Download PDF

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Publication number
CN119731610A
CN119731610A CN202380060828.3A CN202380060828A CN119731610A CN 119731610 A CN119731610 A CN 119731610A CN 202380060828 A CN202380060828 A CN 202380060828A CN 119731610 A CN119731610 A CN 119731610A
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CN
China
Prior art keywords
temperature
flow path
temperature adjustment
fluid
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380060828.3A
Other languages
English (en)
Chinese (zh)
Inventor
砂金优
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN119731610A publication Critical patent/CN119731610A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/185—Control of temperature with auxiliary non-electric power
    • G05D23/1858—Control of temperature with auxiliary non-electric power by varying the mixing ratio of fluids having different temperatures
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1902—Control of temperature characterised by the use of electric means characterised by the use of a variable reference value
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
    • G05D23/193—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
    • G05D23/1935—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces using sequential control
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Power Engineering (AREA)
  • Remote Sensing (AREA)
  • Control Of Temperature (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202380060828.3A 2022-09-01 2023-08-25 温度控制装置、基板处理装置以及温度控制方法 Pending CN119731610A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-139488 2022-09-01
JP2022139488 2022-09-01
PCT/JP2023/030779 WO2024048461A1 (ja) 2022-09-01 2023-08-25 温度制御装置、基板処理装置及び温度制御方法

Publications (1)

Publication Number Publication Date
CN119731610A true CN119731610A (zh) 2025-03-28

Family

ID=90099779

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380060828.3A Pending CN119731610A (zh) 2022-09-01 2023-08-25 温度控制装置、基板处理装置以及温度控制方法

Country Status (6)

Country Link
US (1) US20250181087A1 (https=)
JP (1) JPWO2024048461A1 (https=)
KR (1) KR20250053888A (https=)
CN (1) CN119731610A (https=)
TW (1) TW202427089A (https=)
WO (1) WO2024048461A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4978928B2 (ja) 2007-04-27 2012-07-18 シーケーディ株式会社 温度制御装置
JP5932419B2 (ja) * 2012-03-21 2016-06-08 株式会社東芝 熱回収プラントシステム、熱回収プラント制御装置および熱回収プラント制御方法
JP2021009590A (ja) * 2019-07-02 2021-01-28 株式会社Kelk 温度制御システム及び温度制御方法
JP7541841B2 (ja) * 2020-03-18 2024-08-29 株式会社Kelk 温度制御システム

Also Published As

Publication number Publication date
WO2024048461A1 (ja) 2024-03-07
TW202427089A (zh) 2024-07-01
US20250181087A1 (en) 2025-06-05
KR20250053888A (ko) 2025-04-22
JPWO2024048461A1 (https=) 2024-03-07

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