JPWO2024048461A1 - - Google Patents
Info
- Publication number
- JPWO2024048461A1 JPWO2024048461A1 JP2024544206A JP2024544206A JPWO2024048461A1 JP WO2024048461 A1 JPWO2024048461 A1 JP WO2024048461A1 JP 2024544206 A JP2024544206 A JP 2024544206A JP 2024544206 A JP2024544206 A JP 2024544206A JP WO2024048461 A1 JPWO2024048461 A1 JP WO2024048461A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/185—Control of temperature with auxiliary non-electric power
- G05D23/1858—Control of temperature with auxiliary non-electric power by varying the mixing ratio of fluids having different temperatures
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1902—Control of temperature characterised by the use of electric means characterised by the use of a variable reference value
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
- G05D23/193—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
- G05D23/1935—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces using sequential control
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0602—Temperature monitoring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Power Engineering (AREA)
- Remote Sensing (AREA)
- Control Of Temperature (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022139488 | 2022-09-01 | ||
| PCT/JP2023/030779 WO2024048461A1 (ja) | 2022-09-01 | 2023-08-25 | 温度制御装置、基板処理装置及び温度制御方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024048461A1 true JPWO2024048461A1 (https=) | 2024-03-07 |
| JPWO2024048461A5 JPWO2024048461A5 (https=) | 2025-05-15 |
Family
ID=90099779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024544206A Pending JPWO2024048461A1 (https=) | 2022-09-01 | 2023-08-25 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250181087A1 (https=) |
| JP (1) | JPWO2024048461A1 (https=) |
| KR (1) | KR20250053888A (https=) |
| CN (1) | CN119731610A (https=) |
| TW (1) | TW202427089A (https=) |
| WO (1) | WO2024048461A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4978928B2 (ja) | 2007-04-27 | 2012-07-18 | シーケーディ株式会社 | 温度制御装置 |
| JP5932419B2 (ja) * | 2012-03-21 | 2016-06-08 | 株式会社東芝 | 熱回収プラントシステム、熱回収プラント制御装置および熱回収プラント制御方法 |
| JP2021009590A (ja) * | 2019-07-02 | 2021-01-28 | 株式会社Kelk | 温度制御システム及び温度制御方法 |
| JP7541841B2 (ja) * | 2020-03-18 | 2024-08-29 | 株式会社Kelk | 温度制御システム |
-
2023
- 2023-08-23 TW TW112131642A patent/TW202427089A/zh unknown
- 2023-08-25 KR KR1020257008802A patent/KR20250053888A/ko active Pending
- 2023-08-25 WO PCT/JP2023/030779 patent/WO2024048461A1/ja not_active Ceased
- 2023-08-25 CN CN202380060828.3A patent/CN119731610A/zh active Pending
- 2023-08-25 JP JP2024544206A patent/JPWO2024048461A1/ja active Pending
-
2025
- 2025-02-12 US US19/051,263 patent/US20250181087A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024048461A1 (ja) | 2024-03-07 |
| TW202427089A (zh) | 2024-07-01 |
| CN119731610A (zh) | 2025-03-28 |
| US20250181087A1 (en) | 2025-06-05 |
| KR20250053888A (ko) | 2025-04-22 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250220 |