KR20250053888A - 온도 제어 장치, 기판 처리 장치 및 온도 제어 방법 - Google Patents

온도 제어 장치, 기판 처리 장치 및 온도 제어 방법 Download PDF

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Publication number
KR20250053888A
KR20250053888A KR1020257008802A KR20257008802A KR20250053888A KR 20250053888 A KR20250053888 A KR 20250053888A KR 1020257008802 A KR1020257008802 A KR 1020257008802A KR 20257008802 A KR20257008802 A KR 20257008802A KR 20250053888 A KR20250053888 A KR 20250053888A
Authority
KR
South Korea
Prior art keywords
temperature control
control unit
temperature
fluid
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257008802A
Other languages
English (en)
Korean (ko)
Inventor
마사루 이사고
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20250053888A publication Critical patent/KR20250053888A/ko
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/185—Control of temperature with auxiliary non-electric power
    • G05D23/1858—Control of temperature with auxiliary non-electric power by varying the mixing ratio of fluids having different temperatures
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1902—Control of temperature characterised by the use of electric means characterised by the use of a variable reference value
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
    • G05D23/193—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
    • G05D23/1935—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces using sequential control
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Power Engineering (AREA)
  • Remote Sensing (AREA)
  • Control Of Temperature (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020257008802A 2022-09-01 2023-08-25 온도 제어 장치, 기판 처리 장치 및 온도 제어 방법 Pending KR20250053888A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-139488 2022-09-01
JP2022139488 2022-09-01
PCT/JP2023/030779 WO2024048461A1 (ja) 2022-09-01 2023-08-25 温度制御装置、基板処理装置及び温度制御方法

Publications (1)

Publication Number Publication Date
KR20250053888A true KR20250053888A (ko) 2025-04-22

Family

ID=90099779

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257008802A Pending KR20250053888A (ko) 2022-09-01 2023-08-25 온도 제어 장치, 기판 처리 장치 및 온도 제어 방법

Country Status (6)

Country Link
US (1) US20250181087A1 (https=)
JP (1) JPWO2024048461A1 (https=)
KR (1) KR20250053888A (https=)
CN (1) CN119731610A (https=)
TW (1) TW202427089A (https=)
WO (1) WO2024048461A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008276439A (ja) 2007-04-27 2008-11-13 Ckd Corp 温度制御装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5932419B2 (ja) * 2012-03-21 2016-06-08 株式会社東芝 熱回収プラントシステム、熱回収プラント制御装置および熱回収プラント制御方法
JP2021009590A (ja) * 2019-07-02 2021-01-28 株式会社Kelk 温度制御システム及び温度制御方法
JP7541841B2 (ja) * 2020-03-18 2024-08-29 株式会社Kelk 温度制御システム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008276439A (ja) 2007-04-27 2008-11-13 Ckd Corp 温度制御装置

Also Published As

Publication number Publication date
WO2024048461A1 (ja) 2024-03-07
TW202427089A (zh) 2024-07-01
CN119731610A (zh) 2025-03-28
US20250181087A1 (en) 2025-06-05
JPWO2024048461A1 (https=) 2024-03-07

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20250318

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application