CN119677887A - 压延铜箔、覆铜层叠板、覆铜层叠板的制造方法、柔性印刷线路板的制造方法以及电子部件的制造方法 - Google Patents

压延铜箔、覆铜层叠板、覆铜层叠板的制造方法、柔性印刷线路板的制造方法以及电子部件的制造方法 Download PDF

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Publication number
CN119677887A
CN119677887A CN202380042762.5A CN202380042762A CN119677887A CN 119677887 A CN119677887 A CN 119677887A CN 202380042762 A CN202380042762 A CN 202380042762A CN 119677887 A CN119677887 A CN 119677887A
Authority
CN
China
Prior art keywords
copper foil
rolled copper
grain boundary
clad laminate
rolled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380042762.5A
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English (en)
Chinese (zh)
Inventor
长俊介
太田明光
中川康太朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of CN119677887A publication Critical patent/CN119677887A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metal Rolling (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN202380042762.5A 2022-07-14 2023-06-01 压延铜箔、覆铜层叠板、覆铜层叠板的制造方法、柔性印刷线路板的制造方法以及电子部件的制造方法 Pending CN119677887A (zh)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP2022-113460 2022-07-14
JP2022113456 2022-07-14
JP2022113460 2022-07-14
JP2022-113456 2022-07-14
JP2023-060964 2023-04-04
JP2023060966 2023-04-04
JP2023-060962 2023-04-04
JP2023-060966 2023-04-04
JP2023060964 2023-04-04
JP2023060962 2023-04-04
PCT/JP2023/020562 WO2024014173A1 (ja) 2022-07-14 2023-06-01 圧延銅箔、銅張積層板、銅張積層板の製造方法、フレキシブルプリント配線板の製造方法及び電子部品の製造方法

Publications (1)

Publication Number Publication Date
CN119677887A true CN119677887A (zh) 2025-03-21

Family

ID=89536537

Family Applications (4)

Application Number Title Priority Date Filing Date
CN202380042762.5A Pending CN119677887A (zh) 2022-07-14 2023-06-01 压延铜箔、覆铜层叠板、覆铜层叠板的制造方法、柔性印刷线路板的制造方法以及电子部件的制造方法
CN202380042417.1A Pending CN119256103A (zh) 2022-07-14 2023-06-01 压延铜箔、覆铜积层板、覆铜积层板的制造方法、柔性印刷配线板的制造方法及电子元件的制造方法
CN202380042746.6A Pending CN119301290A (zh) 2022-07-14 2023-06-01 压延铜箔、覆铜层叠板的制造方法、柔性印刷线路板的制造方法以及电子部件的制造方法
CN202380042735.8A Pending CN119256110A (zh) 2022-07-14 2023-06-01 压延铜箔、覆铜层叠板、覆铜层叠板的制造方法、柔性印刷线路板的制造方法以及电子部件的制造方法

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN202380042417.1A Pending CN119256103A (zh) 2022-07-14 2023-06-01 压延铜箔、覆铜积层板、覆铜积层板的制造方法、柔性印刷配线板的制造方法及电子元件的制造方法
CN202380042746.6A Pending CN119301290A (zh) 2022-07-14 2023-06-01 压延铜箔、覆铜层叠板的制造方法、柔性印刷线路板的制造方法以及电子部件的制造方法
CN202380042735.8A Pending CN119256110A (zh) 2022-07-14 2023-06-01 压延铜箔、覆铜层叠板、覆铜层叠板的制造方法、柔性印刷线路板的制造方法以及电子部件的制造方法

Country Status (4)

Country Link
JP (4) JPWO2024014170A1 (https=)
KR (4) KR20250036062A (https=)
CN (4) CN119677887A (https=)
WO (4) WO2024014173A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02156032A (ja) * 1988-12-09 1990-06-15 Hitachi Cable Ltd 電子機器用配線材料及びその製造方法
JPH04228553A (ja) 1990-06-22 1992-08-18 Hitachi Cable Ltd 耐屈曲性圧延銅箔
JP3859384B2 (ja) * 1999-03-08 2006-12-20 日鉱金属株式会社 屈曲性に優れるフレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2011094200A (ja) * 2009-10-30 2011-05-12 Jx Nippon Mining & Metals Corp 銅又は銅合金箔、及びそれを用いた両面銅張積層板の製造方法
JP5571616B2 (ja) * 2011-05-17 2014-08-13 Ｊｘ日鉱日石金属株式会社 圧延銅箔、並びにこれを用いた負極集電体、負極板及び二次電池
WO2013021970A1 (ja) * 2011-08-05 2013-02-14 古河電気工業株式会社 二次電池集電体用圧延銅箔およびその製造方法
JP2013044005A (ja) * 2011-08-23 2013-03-04 Jx Nippon Mining & Metals Corp 両面銅張積層板用圧延銅合金箔、及びそれを用いた両面銅張積層板の製造方法
JP2014214376A (ja) * 2013-04-30 2014-11-17 株式会社Ｓｈカッパープロダクツ 圧延銅箔、フレキシブル銅張積層板及びフレキシブルプリント配線板
CN106460095B (zh) * 2014-05-29 2018-10-16 古河电气工业株式会社 铜合金板材及其制造方法、由所述铜合金板材构成的电气电子部件

Also Published As

Publication number Publication date
KR20250036056A (ko) 2025-03-13
JPWO2024014170A1 (https=) 2024-01-18
JPWO2024014172A1 (https=) 2024-01-18
CN119256103A (zh) 2025-01-03
KR20250036060A (ko) 2025-03-13
WO2024014170A1 (ja) 2024-01-18
WO2024014172A1 (ja) 2024-01-18
JPWO2024014173A1 (https=) 2024-01-18
KR20250036062A (ko) 2025-03-13
JPWO2024014168A1 (https=) 2024-01-18
WO2024014168A1 (ja) 2024-01-18
KR20250036059A (ko) 2025-03-13
CN119256110A (zh) 2025-01-03
WO2024014173A1 (ja) 2024-01-18
CN119301290A (zh) 2025-01-10

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