JPWO2024014173A1 - - Google Patents

Info

Publication number
JPWO2024014173A1
JPWO2024014173A1 JP2024533566A JP2024533566A JPWO2024014173A1 JP WO2024014173 A1 JPWO2024014173 A1 JP WO2024014173A1 JP 2024533566 A JP2024533566 A JP 2024533566A JP 2024533566 A JP2024533566 A JP 2024533566A JP WO2024014173 A1 JPWO2024014173 A1 JP WO2024014173A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024533566A
Other languages
Japanese (ja)
Other versions
JPWO2024014173A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024014173A1 publication Critical patent/JPWO2024014173A1/ja
Publication of JPWO2024014173A5 publication Critical patent/JPWO2024014173A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metal Rolling (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2024533566A 2022-07-14 2023-06-01 Pending JPWO2024014173A1 (https=)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2022113456 2022-07-14
JP2022113460 2022-07-14
JP2023060966 2023-04-04
JP2023060964 2023-04-04
JP2023060962 2023-04-04
PCT/JP2023/020562 WO2024014173A1 (ja) 2022-07-14 2023-06-01 圧延銅箔、銅張積層板、銅張積層板の製造方法、フレキシブルプリント配線板の製造方法及び電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024014173A1 true JPWO2024014173A1 (https=) 2024-01-18
JPWO2024014173A5 JPWO2024014173A5 (https=) 2026-03-11

Family

ID=89536537

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2024533563A Pending JPWO2024014170A1 (https=) 2022-07-14 2023-06-01
JP2024533566A Pending JPWO2024014173A1 (https=) 2022-07-14 2023-06-01
JP2024533565A Pending JPWO2024014172A1 (https=) 2022-07-14 2023-06-01
JP2024533561A Pending JPWO2024014168A1 (https=) 2022-07-14 2023-06-01

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2024533563A Pending JPWO2024014170A1 (https=) 2022-07-14 2023-06-01

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2024533565A Pending JPWO2024014172A1 (https=) 2022-07-14 2023-06-01
JP2024533561A Pending JPWO2024014168A1 (https=) 2022-07-14 2023-06-01

Country Status (4)

Country Link
JP (4) JPWO2024014170A1 (https=)
KR (4) KR20250036062A (https=)
CN (4) CN119677887A (https=)
WO (4) WO2024014173A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02156032A (ja) * 1988-12-09 1990-06-15 Hitachi Cable Ltd 電子機器用配線材料及びその製造方法
JPH04228553A (ja) 1990-06-22 1992-08-18 Hitachi Cable Ltd 耐屈曲性圧延銅箔
JP3859384B2 (ja) * 1999-03-08 2006-12-20 日鉱金属株式会社 屈曲性に優れるフレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2011094200A (ja) * 2009-10-30 2011-05-12 Jx Nippon Mining & Metals Corp 銅又は銅合金箔、及びそれを用いた両面銅張積層板の製造方法
JP5571616B2 (ja) * 2011-05-17 2014-08-13 Ｊｘ日鉱日石金属株式会社 圧延銅箔、並びにこれを用いた負極集電体、負極板及び二次電池
WO2013021970A1 (ja) * 2011-08-05 2013-02-14 古河電気工業株式会社 二次電池集電体用圧延銅箔およびその製造方法
JP2013044005A (ja) * 2011-08-23 2013-03-04 Jx Nippon Mining & Metals Corp 両面銅張積層板用圧延銅合金箔、及びそれを用いた両面銅張積層板の製造方法
JP2014214376A (ja) * 2013-04-30 2014-11-17 株式会社Ｓｈカッパープロダクツ 圧延銅箔、フレキシブル銅張積層板及びフレキシブルプリント配線板
CN106460095B (zh) * 2014-05-29 2018-10-16 古河电气工业株式会社 铜合金板材及其制造方法、由所述铜合金板材构成的电气电子部件

Also Published As

Publication number Publication date
KR20250036056A (ko) 2025-03-13
JPWO2024014170A1 (https=) 2024-01-18
JPWO2024014172A1 (https=) 2024-01-18
CN119256103A (zh) 2025-01-03
KR20250036060A (ko) 2025-03-13
WO2024014170A1 (ja) 2024-01-18
WO2024014172A1 (ja) 2024-01-18
KR20250036062A (ko) 2025-03-13
JPWO2024014168A1 (https=) 2024-01-18
WO2024014168A1 (ja) 2024-01-18
KR20250036059A (ko) 2025-03-13
CN119256110A (zh) 2025-01-03
CN119677887A (zh) 2025-03-21
WO2024014173A1 (ja) 2024-01-18
CN119301290A (zh) 2025-01-10

Similar Documents

Publication Publication Date Title
CL2026000463A1 (es) Composiciones de emulsión alimenticia con proteínas de lenteja y salvado de cereal
JPWO2024014170A1 (https=)
JPWO2024014171A1 (https=)
BR102023001877A2 (https=)
BR202022009269U2 (https=)
BY13160U (https=)
BY13158U (https=)
CN307049512S (https=)
BY13167U (https=)
BY13166U (https=)
BY13165U (https=)
BY13164U (https=)
BY13163U (https=)
CN307049510S (https=)
CN307049106S (https=)
CN307048984S (https=)
CN307048246S (https=)
CN307048119S (https=)
CN307047803S (https=)
CN307046976S (https=)
CN307046705S (https=)
BY13162U (https=)
BY13161U (https=)
BY13169U (https=)
CN307046322S (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20260303

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20260303