JPWO2024014171A1 - - Google Patents
Info
- Publication number
- JPWO2024014171A1 JPWO2024014171A1 JP2024533564A JP2024533564A JPWO2024014171A1 JP WO2024014171 A1 JPWO2024014171 A1 JP WO2024014171A1 JP 2024533564 A JP2024533564 A JP 2024533564A JP 2024533564 A JP2024533564 A JP 2024533564A JP WO2024014171 A1 JPWO2024014171 A1 JP WO2024014171A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Metal Rolling (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022113457 | 2022-07-14 | ||
| JP2022113456 | 2022-07-14 | ||
| JP2022113460 | 2022-07-14 | ||
| JP2023060966 | 2023-04-04 | ||
| JP2023060964 | 2023-04-04 | ||
| JP2023060962 | 2023-04-04 | ||
| PCT/JP2023/020560 WO2024014171A1 (ja) | 2022-07-14 | 2023-06-01 | 圧延銅箔、銅張積層板、銅張積層板の製造方法、フレキシブルプリント配線板の製造方法及び電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024014171A1 true JPWO2024014171A1 (https=) | 2024-01-18 |
| JPWO2024014171A5 JPWO2024014171A5 (https=) | 2026-03-11 |
Family
ID=89536538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024533564A Pending JPWO2024014171A1 (https=) | 2022-07-14 | 2023-06-01 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024014171A1 (https=) |
| KR (1) | KR20250036061A (https=) |
| CN (1) | CN119256109A (https=) |
| WO (1) | WO2024014171A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04228553A (ja) | 1990-06-22 | 1992-08-18 | Hitachi Cable Ltd | 耐屈曲性圧延銅箔 |
| JP3859384B2 (ja) * | 1999-03-08 | 2006-12-20 | 日鉱金属株式会社 | 屈曲性に優れるフレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
| JP2011094200A (ja) * | 2009-10-30 | 2011-05-12 | Jx Nippon Mining & Metals Corp | 銅又は銅合金箔、及びそれを用いた両面銅張積層板の製造方法 |
| JP5571616B2 (ja) * | 2011-05-17 | 2014-08-13 | Ｊｘ日鉱日石金属株式会社 | 圧延銅箔、並びにこれを用いた負極集電体、負極板及び二次電池 |
| JP2013044005A (ja) * | 2011-08-23 | 2013-03-04 | Jx Nippon Mining & Metals Corp | 両面銅張積層板用圧延銅合金箔、及びそれを用いた両面銅張積層板の製造方法 |
| JP2014214376A (ja) * | 2013-04-30 | 2014-11-17 | 株式会社Ｓｈカッパープロダクツ | 圧延銅箔、フレキシブル銅張積層板及びフレキシブルプリント配線板 |
-
2023
- 2023-06-01 WO PCT/JP2023/020560 patent/WO2024014171A1/ja not_active Ceased
- 2023-06-01 JP JP2024533564A patent/JPWO2024014171A1/ja active Pending
- 2023-06-01 CN CN202380042414.8A patent/CN119256109A/zh active Pending
- 2023-06-01 KR KR1020247038461A patent/KR20250036061A/ko active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024014171A1 (ja) | 2024-01-18 |
| KR20250036061A (ko) | 2025-03-13 |
| CN119256109A (zh) | 2025-01-03 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260303 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260303 |