KR20250036061A - 압연 동박, 동장 적층판, 동장 적층판의 제조 방법, 플렉시블 프린트 배선판의 제조 방법 및 전자 부품의 제조 방법 - Google Patents

압연 동박, 동장 적층판, 동장 적층판의 제조 방법, 플렉시블 프린트 배선판의 제조 방법 및 전자 부품의 제조 방법 Download PDF

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Publication number
KR20250036061A
KR20250036061A KR1020247038461A KR20247038461A KR20250036061A KR 20250036061 A KR20250036061 A KR 20250036061A KR 1020247038461 A KR1020247038461 A KR 1020247038461A KR 20247038461 A KR20247038461 A KR 20247038461A KR 20250036061 A KR20250036061 A KR 20250036061A
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KR
South Korea
Prior art keywords
copper foil
rolled copper
manufacturing
clad laminate
rolled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247038461A
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English (en)
Korean (ko)
Inventor
고타로 나카가와
슌스케 초
šœ스케 초
아키미츠 오타
Original Assignee
제이엑스금속주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제이엑스금속주식회사 filed Critical 제이엑스금속주식회사
Publication of KR20250036061A publication Critical patent/KR20250036061A/ko
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metal Rolling (AREA)
KR1020247038461A 2022-07-14 2023-06-01 압연 동박, 동장 적층판, 동장 적층판의 제조 방법, 플렉시블 프린트 배선판의 제조 방법 및 전자 부품의 제조 방법 Pending KR20250036061A (ko)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
JP2022113456 2022-07-14
JPJP-P-2022-113456 2022-07-14
JP2022113457 2022-07-14
JPJP-P-2022-113457 2022-07-14
JP2022113460 2022-07-14
JPJP-P-2022-113460 2022-07-14
JP2023060966 2023-04-04
JPJP-P-2023-060966 2023-04-04
JPJP-P-2023-060964 2023-04-04
JPJP-P-2023-060962 2023-04-04
JP2023060964 2023-04-04
JP2023060962 2023-04-04
PCT/JP2023/020560 WO2024014171A1 (ja) 2022-07-14 2023-06-01 圧延銅箔、銅張積層板、銅張積層板の製造方法、フレキシブルプリント配線板の製造方法及び電子部品の製造方法

Publications (1)

Publication Number Publication Date
KR20250036061A true KR20250036061A (ko) 2025-03-13

Family

ID=89536538

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247038461A Pending KR20250036061A (ko) 2022-07-14 2023-06-01 압연 동박, 동장 적층판, 동장 적층판의 제조 방법, 플렉시블 프린트 배선판의 제조 방법 및 전자 부품의 제조 방법

Country Status (4)

Country Link
JP (1) JPWO2024014171A1 (https=)
KR (1) KR20250036061A (https=)
CN (1) CN119256109A (https=)
WO (1) WO2024014171A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04228553A (ja) 1990-06-22 1992-08-18 Hitachi Cable Ltd 耐屈曲性圧延銅箔

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3859384B2 (ja) * 1999-03-08 2006-12-20 日鉱金属株式会社 屈曲性に優れるフレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2011094200A (ja) * 2009-10-30 2011-05-12 Jx Nippon Mining & Metals Corp 銅又は銅合金箔、及びそれを用いた両面銅張積層板の製造方法
JP5571616B2 (ja) * 2011-05-17 2014-08-13 Ｊｘ日鉱日石金属株式会社 圧延銅箔、並びにこれを用いた負極集電体、負極板及び二次電池
JP2013044005A (ja) * 2011-08-23 2013-03-04 Jx Nippon Mining & Metals Corp 両面銅張積層板用圧延銅合金箔、及びそれを用いた両面銅張積層板の製造方法
JP2014214376A (ja) * 2013-04-30 2014-11-17 株式会社Ｓｈカッパープロダクツ 圧延銅箔、フレキシブル銅張積層板及びフレキシブルプリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04228553A (ja) 1990-06-22 1992-08-18 Hitachi Cable Ltd 耐屈曲性圧延銅箔

Also Published As

Publication number Publication date
WO2024014171A1 (ja) 2024-01-18
JPWO2024014171A1 (https=) 2024-01-18
CN119256109A (zh) 2025-01-03

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