CN119256110A - 压延铜箔、覆铜层叠板、覆铜层叠板的制造方法、柔性印刷线路板的制造方法以及电子部件的制造方法 - Google Patents
压延铜箔、覆铜层叠板、覆铜层叠板的制造方法、柔性印刷线路板的制造方法以及电子部件的制造方法 Download PDFInfo
- Publication number
- CN119256110A CN119256110A CN202380042735.8A CN202380042735A CN119256110A CN 119256110 A CN119256110 A CN 119256110A CN 202380042735 A CN202380042735 A CN 202380042735A CN 119256110 A CN119256110 A CN 119256110A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- rolled copper
- clad laminate
- rolled
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Metal Rolling (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-113456 | 2022-07-14 | ||
| JP2022113456 | 2022-07-14 | ||
| JP2022113460 | 2022-07-14 | ||
| JP2022-113460 | 2022-07-14 | ||
| JP2023-060962 | 2023-04-04 | ||
| JP2023060964 | 2023-04-04 | ||
| JP2023060962 | 2023-04-04 | ||
| JP2023060966 | 2023-04-04 | ||
| JP2023-060966 | 2023-04-04 | ||
| JP2023-060964 | 2023-04-04 | ||
| PCT/JP2023/020559 WO2024014170A1 (ja) | 2022-07-14 | 2023-06-01 | 圧延銅箔、銅張積層板、銅張積層板の製造方法、フレキシブルプリント配線板の製造方法及び電子部品の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN119256110A true CN119256110A (zh) | 2025-01-03 |
Family
ID=89536537
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202380042735.8A Pending CN119256110A (zh) | 2022-07-14 | 2023-06-01 | 压延铜箔、覆铜层叠板、覆铜层叠板的制造方法、柔性印刷线路板的制造方法以及电子部件的制造方法 |
| CN202380042762.5A Pending CN119677887A (zh) | 2022-07-14 | 2023-06-01 | 压延铜箔、覆铜层叠板、覆铜层叠板的制造方法、柔性印刷线路板的制造方法以及电子部件的制造方法 |
| CN202380042417.1A Pending CN119256103A (zh) | 2022-07-14 | 2023-06-01 | 压延铜箔、覆铜积层板、覆铜积层板的制造方法、柔性印刷配线板的制造方法及电子元件的制造方法 |
| CN202380042746.6A Pending CN119301290A (zh) | 2022-07-14 | 2023-06-01 | 压延铜箔、覆铜层叠板的制造方法、柔性印刷线路板的制造方法以及电子部件的制造方法 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202380042762.5A Pending CN119677887A (zh) | 2022-07-14 | 2023-06-01 | 压延铜箔、覆铜层叠板、覆铜层叠板的制造方法、柔性印刷线路板的制造方法以及电子部件的制造方法 |
| CN202380042417.1A Pending CN119256103A (zh) | 2022-07-14 | 2023-06-01 | 压延铜箔、覆铜积层板、覆铜积层板的制造方法、柔性印刷配线板的制造方法及电子元件的制造方法 |
| CN202380042746.6A Pending CN119301290A (zh) | 2022-07-14 | 2023-06-01 | 压延铜箔、覆铜层叠板的制造方法、柔性印刷线路板的制造方法以及电子部件的制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (4) | JPWO2024014168A1 (https=) |
| KR (4) | KR20250036062A (https=) |
| CN (4) | CN119256110A (https=) |
| WO (4) | WO2024014173A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02156032A (ja) * | 1988-12-09 | 1990-06-15 | Hitachi Cable Ltd | 電子機器用配線材料及びその製造方法 |
| JPH04228553A (ja) | 1990-06-22 | 1992-08-18 | Hitachi Cable Ltd | 耐屈曲性圧延銅箔 |
| JP3859384B2 (ja) * | 1999-03-08 | 2006-12-20 | 日鉱金属株式会社 | 屈曲性に優れるフレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
| JP2011094200A (ja) * | 2009-10-30 | 2011-05-12 | Jx Nippon Mining & Metals Corp | 銅又は銅合金箔、及びそれを用いた両面銅張積層板の製造方法 |
| JP5571616B2 (ja) * | 2011-05-17 | 2014-08-13 | Ｊｘ日鉱日石金属株式会社 | 圧延銅箔、並びにこれを用いた負極集電体、負極板及び二次電池 |
| WO2013021970A1 (ja) * | 2011-08-05 | 2013-02-14 | 古河電気工業株式会社 | 二次電池集電体用圧延銅箔およびその製造方法 |
| JP2013044005A (ja) * | 2011-08-23 | 2013-03-04 | Jx Nippon Mining & Metals Corp | 両面銅張積層板用圧延銅合金箔、及びそれを用いた両面銅張積層板の製造方法 |
| JP2014214376A (ja) * | 2013-04-30 | 2014-11-17 | 株式会社Ｓｈカッパープロダクツ | 圧延銅箔、フレキシブル銅張積層板及びフレキシブルプリント配線板 |
| WO2015182777A1 (ja) * | 2014-05-29 | 2015-12-03 | 古河電気工業株式会社 | 銅合金板材及びその製造方法、前記銅合金板材からなる電気電子部品 |
-
2023
- 2023-06-01 WO PCT/JP2023/020562 patent/WO2024014173A1/ja not_active Ceased
- 2023-06-01 WO PCT/JP2023/020559 patent/WO2024014170A1/ja not_active Ceased
- 2023-06-01 KR KR1020247038463A patent/KR20250036062A/ko active Pending
- 2023-06-01 CN CN202380042735.8A patent/CN119256110A/zh active Pending
- 2023-06-01 CN CN202380042762.5A patent/CN119677887A/zh active Pending
- 2023-06-01 JP JP2024533561A patent/JPWO2024014168A1/ja active Pending
- 2023-06-01 CN CN202380042417.1A patent/CN119256103A/zh active Pending
- 2023-06-01 KR KR1020247037957A patent/KR20250036056A/ko active Pending
- 2023-06-01 KR KR1020247038458A patent/KR20250036060A/ko active Pending
- 2023-06-01 WO PCT/JP2023/020557 patent/WO2024014168A1/ja not_active Ceased
- 2023-06-01 CN CN202380042746.6A patent/CN119301290A/zh active Pending
- 2023-06-01 JP JP2024533563A patent/JPWO2024014170A1/ja active Pending
- 2023-06-01 JP JP2024533566A patent/JPWO2024014173A1/ja active Pending
- 2023-06-01 JP JP2024533565A patent/JPWO2024014172A1/ja active Pending
- 2023-06-01 WO PCT/JP2023/020561 patent/WO2024014172A1/ja not_active Ceased
- 2023-06-01 KR KR1020247038441A patent/KR20250036059A/ko active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024014168A1 (ja) | 2024-01-18 |
| JPWO2024014168A1 (https=) | 2024-01-18 |
| CN119301290A (zh) | 2025-01-10 |
| CN119256103A (zh) | 2025-01-03 |
| WO2024014170A1 (ja) | 2024-01-18 |
| KR20250036056A (ko) | 2025-03-13 |
| WO2024014173A1 (ja) | 2024-01-18 |
| CN119677887A (zh) | 2025-03-21 |
| WO2024014172A1 (ja) | 2024-01-18 |
| JPWO2024014170A1 (https=) | 2024-01-18 |
| JPWO2024014173A1 (https=) | 2024-01-18 |
| JPWO2024014172A1 (https=) | 2024-01-18 |
| KR20250036062A (ko) | 2025-03-13 |
| KR20250036059A (ko) | 2025-03-13 |
| KR20250036060A (ko) | 2025-03-13 |
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