CN119213365A - 转印膜、层叠体的制造方法、电路配线基板的制造方法、电路配线基板及半导体封装 - Google Patents

转印膜、层叠体的制造方法、电路配线基板的制造方法、电路配线基板及半导体封装 Download PDF

Info

Publication number
CN119213365A
CN119213365A CN202380035895.XA CN202380035895A CN119213365A CN 119213365 A CN119213365 A CN 119213365A CN 202380035895 A CN202380035895 A CN 202380035895A CN 119213365 A CN119213365 A CN 119213365A
Authority
CN
China
Prior art keywords
transfer film
temporary support
layer
intermediate layer
surfactant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380035895.XA
Other languages
English (en)
Chinese (zh)
Inventor
鬼冢悠
两角一真
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN119213365A publication Critical patent/CN119213365A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Laminated Bodies (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CN202380035895.XA 2022-04-28 2023-04-27 转印膜、层叠体的制造方法、电路配线基板的制造方法、电路配线基板及半导体封装 Pending CN119213365A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2022075452 2022-04-28
JP2022-075452 2022-04-28
JP2023000711 2023-01-05
JP2023-000711 2023-01-05
PCT/JP2023/016746 WO2023210777A1 (ja) 2022-04-28 2023-04-27 転写フィルム、積層体の製造方法、回路配線基板の製造方法、回路配線基板及び半導体パッケージ

Publications (1)

Publication Number Publication Date
CN119213365A true CN119213365A (zh) 2024-12-27

Family

ID=88518843

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380035895.XA Pending CN119213365A (zh) 2022-04-28 2023-04-27 转印膜、层叠体的制造方法、电路配线基板的制造方法、电路配线基板及半导体封装

Country Status (5)

Country Link
JP (1) JPWO2023210777A1 (https=)
KR (1) KR102931325B1 (https=)
CN (1) CN119213365A (https=)
TW (1) TW202402531A (https=)
WO (1) WO2023210777A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102654084B1 (ko) * 2015-07-08 2024-04-04 가부시끼가이샤 레조낙 감광성 엘리먼트, 적층체, 레지스터 패턴의 형성 방법 및 프린트 배선판의 제조 방법
JP7074776B2 (ja) 2018-01-24 2022-05-24 富士フイルム株式会社 感光性転写材料及びその製造方法、樹脂パターンの製造方法、並びに、回路配線の製造方法
JP7649746B2 (ja) 2019-08-22 2025-03-21 富士フイルム株式会社 感光性転写部材、回路配線の製造方法、タッチパネルの製造方法

Also Published As

Publication number Publication date
JPWO2023210777A1 (https=) 2023-11-02
TW202402531A (zh) 2024-01-16
WO2023210777A1 (ja) 2023-11-02
KR102931325B1 (ko) 2026-02-26
KR20240168384A (ko) 2024-11-29

Similar Documents

Publication Publication Date Title
TWI668514B (zh) 觸控面板電極保護膜形成用組成物、轉印膜、積層體、觸控面板用電極的保護膜及其形成方法、靜電電容型輸入裝置及圖像顯示裝置
KR20150095193A (ko) 감광성 엘리먼트
TW201922815A (zh) 電路配線的製造方法、觸控面板的製造方法及附圖案基材的製造方法
KR102078112B1 (ko) 전사 필름, 정전 용량형 입력 장치의 전극 보호막, 적층체 및 정전 용량형 입력 장치
WO2020158316A1 (ja) 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法、タッチパネルの製造方法、並びに、フィルム及びその製造方法
TW202024150A (zh) 附圖案的基材的製造方法、電路基板的製造方法及觸控面板的製造方法
JP2009145613A (ja) フォトレジストフィルム、感光性樹脂組成物層およびレジストパターンの形成方法
WO2000079344A1 (fr) Element photosensible, rouleau d'element photosensible, procede de fabrication d'un motif de resine, motif de resine, substrat avec motif de resine sus-jacent, procede de fabrication d'un motif de cablage et motif de cablage associe
TW201837674A (zh) 觸控感測器以及觸控感測器的製造方法
JPWO2019077891A1 (ja) 転写材料、タッチセンサー及びその製造方法、並びに画像表示装置
CN119213365A (zh) 转印膜、层叠体的制造方法、电路配线基板的制造方法、电路配线基板及半导体封装
CN114450633A (zh) 感光性转印部件、树脂图案的制造方法、电路布线的制造方法及触摸面板的制造方法
TW202239606A (zh) 積層體及其製造方法
CN121620735A (zh) 转印膜、层叠体的制造方法及电路配线基板的制造方法
TW202243907A (zh) 積層體之製造方法、電路配線之製造方法
JP2025154334A (ja) 感光性転写材料及びその製造方法
JP2023020450A (ja) タッチパネルセンサー、及び、タッチパネルセンサーの製造方法
JP4360769B2 (ja) 感光性樹脂積層体
CN113994262B (zh) 感光性转印部件、树脂图案的制造方法、电路布线的制造方法及触摸面板的制造方法
CN113474728A (zh) 带图案的基板的制造方法、电路基板的制造方法、触控面板的制造方法及层叠体
JP2006053352A (ja) 感光性樹脂積層体
CN119535895A (zh) 层叠体的制造方法及层叠体
WO2021166652A1 (ja) 導電パターンの形成方法、導電パターン、転写フィルム及びタッチパネル
CN117471851A (zh) 包含导电图案的层叠体的制造方法、触摸面板的制造方法
CN116868125A (zh) 层叠体的制造方法、电路布线的制造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination