CN118922899A - 层叠陶瓷电容器、层叠陶瓷电容器的制造方法以及层叠陶瓷电容器的安装构造 - Google Patents

层叠陶瓷电容器、层叠陶瓷电容器的制造方法以及层叠陶瓷电容器的安装构造 Download PDF

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Publication number
CN118922899A
CN118922899A CN202380026469.XA CN202380026469A CN118922899A CN 118922899 A CN118922899 A CN 118922899A CN 202380026469 A CN202380026469 A CN 202380026469A CN 118922899 A CN118922899 A CN 118922899A
Authority
CN
China
Prior art keywords
electrode
electrode layer
plated
main surface
end surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380026469.XA
Other languages
English (en)
Chinese (zh)
Inventor
中村俊之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN118922899A publication Critical patent/CN118922899A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
CN202380026469.XA 2022-04-01 2023-03-12 层叠陶瓷电容器、层叠陶瓷电容器的制造方法以及层叠陶瓷电容器的安装构造 Pending CN118922899A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-062105 2022-04-01
JP2022062105 2022-04-01
PCT/JP2023/009471 WO2023189448A1 (ja) 2022-04-01 2023-03-12 積層セラミックコンデンサ、積層セラミックコンデンサの製造方法および積層セラミックコンデンサの実装構造

Publications (1)

Publication Number Publication Date
CN118922899A true CN118922899A (zh) 2024-11-08

Family

ID=88200774

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380026469.XA Pending CN118922899A (zh) 2022-04-01 2023-03-12 层叠陶瓷电容器、层叠陶瓷电容器的制造方法以及层叠陶瓷电容器的安装构造

Country Status (4)

Country Link
US (1) US20240387112A1 (https=)
JP (1) JP7740521B2 (https=)
CN (1) CN118922899A (https=)
WO (1) WO2023189448A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025204851A1 (ja) * 2024-03-27 2025-10-02 パナソニックＩｐマネジメント株式会社 セラミック部品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3903757B2 (ja) * 2001-09-05 2007-04-11 株式会社村田製作所 チップ状電子部品の製造方法およびチップ状電子部品
JP2012156315A (ja) * 2011-01-26 2012-08-16 Murata Mfg Co Ltd 積層セラミック電子部品
JP7196732B2 (ja) * 2019-03-28 2022-12-27 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法

Also Published As

Publication number Publication date
JPWO2023189448A1 (https=) 2023-10-05
JP7740521B2 (ja) 2025-09-17
WO2023189448A1 (ja) 2023-10-05
US20240387112A1 (en) 2024-11-21

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