JPWO2023189448A1 - - Google Patents

Info

Publication number
JPWO2023189448A1
JPWO2023189448A1 JP2024511676A JP2024511676A JPWO2023189448A1 JP WO2023189448 A1 JPWO2023189448 A1 JP WO2023189448A1 JP 2024511676 A JP2024511676 A JP 2024511676A JP 2024511676 A JP2024511676 A JP 2024511676A JP WO2023189448 A1 JPWO2023189448 A1 JP WO2023189448A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024511676A
Other languages
Japanese (ja)
Other versions
JPWO2023189448A5 (https=
JP7740521B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023189448A1 publication Critical patent/JPWO2023189448A1/ja
Publication of JPWO2023189448A5 publication Critical patent/JPWO2023189448A5/ja
Application granted granted Critical
Publication of JP7740521B2 publication Critical patent/JP7740521B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
JP2024511676A 2022-04-01 2023-03-12 積層セラミックコンデンサ、積層セラミックコンデンサの製造方法および積層セラミックコンデンサの実装構造 Active JP7740521B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022062105 2022-04-01
JP2022062105 2022-04-01
PCT/JP2023/009471 WO2023189448A1 (ja) 2022-04-01 2023-03-12 積層セラミックコンデンサ、積層セラミックコンデンサの製造方法および積層セラミックコンデンサの実装構造

Publications (3)

Publication Number Publication Date
JPWO2023189448A1 true JPWO2023189448A1 (https=) 2023-10-05
JPWO2023189448A5 JPWO2023189448A5 (https=) 2024-11-27
JP7740521B2 JP7740521B2 (ja) 2025-09-17

Family

ID=88200774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511676A Active JP7740521B2 (ja) 2022-04-01 2023-03-12 積層セラミックコンデンサ、積層セラミックコンデンサの製造方法および積層セラミックコンデンサの実装構造

Country Status (4)

Country Link
US (1) US20240387112A1 (https=)
JP (1) JP7740521B2 (https=)
CN (1) CN118922899A (https=)
WO (1) WO2023189448A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025204851A1 (ja) * 2024-03-27 2025-10-02 パナソニックＩｐマネジメント株式会社 セラミック部品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077775A (ja) * 2001-09-05 2003-03-14 Murata Mfg Co Ltd チップ状電子部品の製造方法およびチップ状電子部品
JP2012156315A (ja) * 2011-01-26 2012-08-16 Murata Mfg Co Ltd 積層セラミック電子部品
JP2020167231A (ja) * 2019-03-28 2020-10-08 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077775A (ja) * 2001-09-05 2003-03-14 Murata Mfg Co Ltd チップ状電子部品の製造方法およびチップ状電子部品
JP2012156315A (ja) * 2011-01-26 2012-08-16 Murata Mfg Co Ltd 積層セラミック電子部品
JP2020167231A (ja) * 2019-03-28 2020-10-08 株式会社村田製作所 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法

Also Published As

Publication number Publication date
JP7740521B2 (ja) 2025-09-17
WO2023189448A1 (ja) 2023-10-05
CN118922899A (zh) 2024-11-08
US20240387112A1 (en) 2024-11-21

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