CN118871484A - 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板、以及半导体装置 - Google Patents

树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板、以及半导体装置 Download PDF

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Publication number
CN118871484A
CN118871484A CN202380027131.6A CN202380027131A CN118871484A CN 118871484 A CN118871484 A CN 118871484A CN 202380027131 A CN202380027131 A CN 202380027131A CN 118871484 A CN118871484 A CN 118871484A
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resin
group
formula
mass
compound
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Chinese (zh)
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伊藤祥一
田所弘晃
印南享
宫本真
二村圭亮
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Mitsubishi Gas Chemical Co Inc
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Mitsubishi Gas Chemical Co Inc
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    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/16—Homopolymers or copolymers of alkyl-substituted styrenes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
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    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
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    • H05K1/02—Details
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    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
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    • H05K1/02—Details
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    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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    • B32—LAYERED PRODUCTS
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    • B32B2457/00—Electrical equipment
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CN202380027131.6A 2022-03-14 2023-03-13 树脂组合物、固化物、预浸料、覆金属箔层叠板、树脂复合片、印刷电路板、以及半导体装置 Pending CN118871484A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-039677 2022-03-14
JP2022039677 2022-03-14
PCT/JP2023/009586 WO2023176764A1 (ja) 2022-03-14 2023-03-13 樹脂組成物、硬化物、プリプレグ、金属箔張積層板、樹脂複合シート、プリント配線板、および、半導体装置

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CN118871484A true CN118871484A (zh) 2024-10-29

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Country Link
US (1) US20250188256A1 (https=)
EP (1) EP4495151A4 (https=)
JP (2) JP7459394B2 (https=)
KR (1) KR102849732B1 (https=)
CN (1) CN118871484A (https=)
TW (1) TW202346461A (https=)
WO (1) WO2023176764A1 (https=)

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