CN118749007A - 聚酰胺酸、聚酰亚胺、非热塑性聚酰亚胺薄膜、多层聚酰亚胺薄膜及覆金属层叠板 - Google Patents

聚酰胺酸、聚酰亚胺、非热塑性聚酰亚胺薄膜、多层聚酰亚胺薄膜及覆金属层叠板 Download PDF

Info

Publication number
CN118749007A
CN118749007A CN202380023104.1A CN202380023104A CN118749007A CN 118749007 A CN118749007 A CN 118749007A CN 202380023104 A CN202380023104 A CN 202380023104A CN 118749007 A CN118749007 A CN 118749007A
Authority
CN
China
Prior art keywords
polyamic acid
polyimide film
mol
residue
residues
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380023104.1A
Other languages
English (en)
Chinese (zh)
Inventor
佐藤嵩浩
大熊敬介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaneka Corp
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Publication of CN118749007A publication Critical patent/CN118749007A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B32B2037/1215—Hot-melt adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
CN202380023104.1A 2022-02-24 2023-02-13 聚酰胺酸、聚酰亚胺、非热塑性聚酰亚胺薄膜、多层聚酰亚胺薄膜及覆金属层叠板 Pending CN118749007A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022026383 2022-02-24
JP2022-026383 2022-02-24
PCT/JP2023/004721 WO2023162745A1 (ja) 2022-02-24 2023-02-13 ポリアミド酸、ポリイミド、非熱可塑性ポリイミドフィルム、複層ポリイミドフィルム及び金属張積層板

Publications (1)

Publication Number Publication Date
CN118749007A true CN118749007A (zh) 2024-10-08

Family

ID=87765791

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380023104.1A Pending CN118749007A (zh) 2022-02-24 2023-02-13 聚酰胺酸、聚酰亚胺、非热塑性聚酰亚胺薄膜、多层聚酰亚胺薄膜及覆金属层叠板

Country Status (6)

Country Link
US (1) US20240399713A1 (https=)
JP (1) JPWO2023162745A1 (https=)
KR (1) KR20240150439A (https=)
CN (1) CN118749007A (https=)
TW (1) TW202342593A (https=)
WO (1) WO2023162745A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5031639B2 (ja) 2008-03-31 2012-09-19 新日鐵化学株式会社 フレキシブル銅張積層板
KR101282170B1 (ko) * 2010-10-19 2013-07-04 에스케이이노베이션 주식회사 후막 폴리이미드 금속박 적층체
KR101299652B1 (ko) 2011-09-07 2013-08-23 주식회사 엘지화학 불소수지 함유 연성 금속 적층판
JP6515180B2 (ja) 2015-03-31 2019-05-15 株式会社カネカ 多層接着フィルム及びフレキシブル金属張積層板
CN109843588B (zh) 2016-10-31 2021-10-29 宇部兴产株式会社 金属层叠用聚酰亚胺膜及使用了其的聚酰亚胺金属层叠体
WO2022085619A1 (ja) * 2020-10-22 2022-04-28 株式会社カネカ 非熱可塑性ポリイミドフィルム、複層ポリイミドフィルム、及び金属張積層板

Also Published As

Publication number Publication date
KR20240150439A (ko) 2024-10-15
US20240399713A1 (en) 2024-12-05
WO2023162745A1 (ja) 2023-08-31
JPWO2023162745A1 (https=) 2023-08-31
TW202342593A (zh) 2023-11-01

Similar Documents

Publication Publication Date Title
JP7428646B2 (ja) 金属張積層板及び回路基板
JP2000103010A (ja) フレキシブル金属箔積層体
US20070158869A1 (en) Process for producing adhesive film
TWI890877B (zh) 非熱塑性聚醯亞胺膜、多層聚醯亞胺膜、及金屬貼合積層板
JPWO2020022129A5 (https=)
JP2019014062A (ja) 積層体、フレキシブル金属張積層板、およびフレキシブルプリント回路基板
JP2001270034A (ja) フレキシブル金属箔積層体
CN116507667A (zh) 多层聚酰亚胺薄膜、覆金属箔层压板和多层聚酰亚胺薄膜的制造方法
JPWO2006011404A1 (ja) 接着フィルムおよびその利用
JP2001270036A (ja) フレキシブル金属箔積層体
JP7561987B2 (ja) 高い寸法安定性を有するポリイミドフィルム及びその製造方法
JP2023121512A (ja) 非熱可塑性ポリイミドフィルム、複層ポリイミドフィルム、及び金属張積層板
CN118749007A (zh) 聚酰胺酸、聚酰亚胺、非热塑性聚酰亚胺薄膜、多层聚酰亚胺薄膜及覆金属层叠板
JP2020015237A (ja) 金属張積層板の製造方法及び回路基板の製造方法
JP2001270035A (ja) フレキシブル金属箔積層体
TW202344567A (zh) 聚醯胺酸、聚醯亞胺、非熱塑性聚醯亞胺膜、多層聚醯亞胺膜及金屬貼合積層板
JP4360025B2 (ja) 補強材を有するポリイミド片面積層体およびその製造法
JP7829368B2 (ja) ポリイミド前駆体及びポリイミド
TWI909310B (zh) 聚酯醯亞胺樹脂組合物、聚酯醯亞胺樹脂層、柔性金屬箔層壓板及其製備方法
JP2004315601A (ja) 接着性の改良されたポリイミドフィルム、その製造法および積層体
KR102773837B1 (ko) 폴리이미드 필름 및 이의 제조방법
CN115368608B (zh) 用于软性覆金属箔基板之聚酰亚胺复合膜
JP5069844B2 (ja) プリント配線板用絶縁フィルムの製造方法、ポリイミド／銅積層体及びプリント配線板
JP2019214642A (ja) カバーレイフィルム用ポリイミドフィルムおよびその製造方法
JP2026051602A (ja) 多層ポリイミドフィルム、カバーレイフィルム、並びに多層ポリイミドフィルムの製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination