CN118414697A - 陶瓷基板、接合体、半导体装置、陶瓷基板的制造方法及陶瓷电路基板的制造方法 - Google Patents

陶瓷基板、接合体、半导体装置、陶瓷基板的制造方法及陶瓷电路基板的制造方法 Download PDF

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Publication number
CN118414697A
CN118414697A CN202380014871.6A CN202380014871A CN118414697A CN 118414697 A CN118414697 A CN 118414697A CN 202380014871 A CN202380014871 A CN 202380014871A CN 118414697 A CN118414697 A CN 118414697A
Authority
CN
China
Prior art keywords
ceramic substrate
notch
opening
substrate
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380014871.6A
Other languages
English (en)
Chinese (zh)
Inventor
岩井健太郎
佐佐木亮人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Special Ceramic Materials Co ltd
Original Assignee
Toshiba Corp
Toshiba Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Materials Co Ltd filed Critical Toshiba Corp
Publication of CN118414697A publication Critical patent/CN118414697A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09163—Slotted edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Structure Of Printed Boards (AREA)
CN202380014871.6A 2022-03-30 2023-03-29 陶瓷基板、接合体、半导体装置、陶瓷基板的制造方法及陶瓷电路基板的制造方法 Pending CN118414697A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-055240 2022-03-30
JP2022055240 2022-03-30
PCT/JP2023/012928 WO2023190738A1 (ja) 2022-03-30 2023-03-29 セラミックス基板、接合体、半導体装置、セラミックス基板の製造方法、およびセラミックス回路基板の製造方法

Publications (1)

Publication Number Publication Date
CN118414697A true CN118414697A (zh) 2024-07-30

Family

ID=88202707

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380014871.6A Pending CN118414697A (zh) 2022-03-30 2023-03-29 陶瓷基板、接合体、半导体装置、陶瓷基板的制造方法及陶瓷电路基板的制造方法

Country Status (5)

Country Link
US (1) US20240324105A1 (https=)
EP (1) EP4503114A4 (https=)
JP (2) JP7804753B2 (https=)
CN (1) CN118414697A (https=)
WO (1) WO2023190738A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2555394B1 (fr) * 1983-11-22 1986-03-28 Eurofarad Support pour composant rapide, notamment composant hyperfrequence, a elements de decouplage incorpores
JP4755754B2 (ja) 2000-12-06 2011-08-24 株式会社東芝 窒化珪素基板およびそれを用いた窒化珪素回路基板並びにその製造方法
JP4078042B2 (ja) * 2001-06-12 2008-04-23 ローム株式会社 複数の素子を有するチップ型電子部品の製造方法
JP2005056933A (ja) 2003-08-06 2005-03-03 Ngk Spark Plug Co Ltd 放熱部材、回路基板および半導体装置
JP2005159083A (ja) 2003-11-27 2005-06-16 Kyocera Corp 多数個取り配線基板
JP2006203108A (ja) 2005-01-24 2006-08-03 Hitachi Metals Ltd セラミックス回路基板の接合構造およびパワーモジュール
JP5379465B2 (ja) * 2008-12-17 2013-12-25 パナソニック株式会社 発光装置
EP2484957B1 (en) 2009-07-06 2022-05-04 Kabushiki Kaisha Toshiba Method of packaging a ceramic substrate for mounting a device, method of packaging a ceramic substrate for mounting an led
JP6519123B2 (ja) * 2013-08-30 2019-05-29 日亜化学工業株式会社 発光素子搭載用基板及び該基板の固定方法
JP6642146B2 (ja) 2015-03-31 2020-02-05 日立金属株式会社 窒化珪素系セラミックス集合基板及びその製造方法
JP7145739B2 (ja) 2018-11-28 2022-10-03 京セラ株式会社 配線基板、電子装置および電子モジュール

Also Published As

Publication number Publication date
EP4503114A4 (en) 2026-03-25
JP2025182048A (ja) 2025-12-11
US20240324105A1 (en) 2024-09-26
WO2023190738A1 (ja) 2023-10-05
JP7804753B2 (ja) 2026-01-22
JPWO2023190738A1 (https=) 2023-10-05
EP4503114A1 (en) 2025-02-05

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