CN118234137A - Manufacturing method of circuit board embedded with special-shaped copper block - Google Patents

Abstract

The invention discloses a method for manufacturing a circuit board embedded with special-shaped copper blocks, which comprises the following steps: taking copper blocks, manufacturing special-shaped copper blocks, manufacturing a bottom layer plate according to a circuit board manufacturing mode, taking a single-sided copper-clad plate, manufacturing an embedded layer plate, taking a prepreg, manufacturing a windowed prepreg, stacking the bottom layer plate and the embedded layer plate, placing the special-shaped copper blocks in a stacked windowed area to form a stacked structure, manufacturing a first lamination auxiliary tool and a second lamination auxiliary tool used in lamination, manufacturing a lamination typesetting structure, laminating, polishing and carrying out post-process processing to form the circuit board embedded with the special-shaped copper blocks; through adopting the structure of single face core with prepreg, improve the interlaminar cohesion, adopt boss formula pressfitting appurtenance, avoid the dysmorphism copper billet to produce the problem of off normal, warp, pressfitting infirm in the pressfitting process, the whole processing mode has solved off normal, warp, the infirm problem of pressfitting, avoids side erosion tolerance too big, milling copper billet loose problem.

Description

Manufacturing method of circuit board embedded with special-shaped copper block

Technical Field

The invention relates to the field of circuit board design and processing, in particular to a method for manufacturing a circuit board embedded with special-shaped copper blocks.

Background

The copper block is embedded or embedded in the circuit board, so that the local heat dissipation capacity of the circuit board can be effectively improved, and the efficient and reliable heat dissipation effect is provided for the work of products such as LEDs.

Aiming at the development of high density and multifunction in the industries of LEDs and the like, the circuit board supporting the work of the LED is also changed towards high density, and the design of embedding special-shaped copper blocks is presented for some circuit boards with higher density per unit area, thinner thickness and higher heat dissipation capability requirements.

The circuit board embedded with the special-shaped copper block can be used for placing components such as a welded LED in a groove formed by the special-shaped copper block, so that the surrounding or semi-surrounding state of the special-shaped copper block to the components is realized, the overall thickness of the circuit board can be effectively reduced, the heat dissipation capacity is improved, and the product density and reliability are improved.

At present, a traditional direct stacking and pressing mode is generally adopted for processing a circuit board embedded with the special-shaped copper block, and the mode can cause the problems of deviation, deformation, infirm pressing and the like of the special-shaped copper block; or the common copper block is embedded into the circuit board firstly, and then the special-shaped copper block is formed by chemical etching or physical milling processing and the like, but the special-shaped copper block is processed by the chemical etching method, and the problem that the special-shaped structure tolerance is increased due to overlarge side etching of the copper block is easily generated during etching because the embedded copper block is generally thicker, and the problem that the special-shaped copper block is loosened is easily caused by the milling processing method.

Based on the above background and problems, it is desirable to provide a method for manufacturing a circuit board with embedded special-shaped copper blocks, which can improve the processing reliability and quality.

Disclosure of Invention

The invention aims to solve the problems of misalignment, deformation and infirm lamination of a special-shaped copper block generated by manufacturing an embedded special-shaped copper block circuit board in a traditional mode in the prior art, and the problems of overlarge side etching tolerance generated by etching and loose copper block caused by milling in a mode of firstly embedding a common copper block and then performing chemical etching or milling processing to form the embedded special-shaped copper block circuit board; the manufacturing method of the circuit board embedded with the special-shaped copper block comprises the following steps:

S10: manufacturing a special-shaped copper block, namely manufacturing the special-shaped copper block which comprises more than or equal to one plane and more than or equal to one side wall;

S20: manufacturing a bottom plate, and manufacturing a circuit board with two circuit pattern layers or multiple circuit pattern layers according to a circuit board manufacturing mode to form the bottom plate;

s30: manufacturing an embedded laminate, namely taking a single-sided copper-clad plate which is more than or equal to one layer, respectively manufacturing circuit patterns, and manufacturing a window opening area of the embedded laminate in a matching manner according to the size of the special-shaped copper block to form the embedded laminate;

s40: manufacturing a windowing prepreg, namely taking the prepreg, and matching and manufacturing a windowing area of the prepreg according to the size of the special-shaped copper block to form the windowing prepreg;

S50: manufacturing a laminated structure, namely stacking the bottom layer plate and the embedded layer plate, arranging the windowed prepreg between the stacked layers, stacking the windowed area of the embedded layer plate and the windowed area of the prepreg to form a stacked windowed area, and arranging the special-shaped copper block in the stacked windowed area to form a stacked structure;

S60: manufacturing a lamination auxiliary tool, wherein the manufacturing of the lamination auxiliary tool comprises manufacturing of a first lamination auxiliary tool and manufacturing of a second lamination auxiliary tool, and the first lamination auxiliary tool is a lamination auxiliary tool which is formed by matching a bottom plate and comprises a release layer, a covering layer and a steel plate layer; the second pressing auxiliary tool is manufactured by the following steps: firstly, manufacturing a mould tool, wherein the mould tool comprises a mould base, and a mould boss is arranged on the mould base; paving a surface release layer on one surface of the die tool, which is provided with the die boss, wherein a convex structure formed by the die boss and the surface release layer and the special-shaped copper blocks arranged in the stacking structure form a typesetting complementary structure;

S70: manufacturing a press fit typesetting structure, and sequentially laminating and typesetting the first press fit tool structure, the stacking structure and the second press fit tool structure to form the press fit typesetting structure;

S80: manufacturing a laminated board, laminating the laminated typesetting structure, and removing the first lamination tool mechanism and the second lamination tool mechanism to form the laminated board;

S90: and polishing the laminated board, and performing post-working procedure processing to form the circuit board embedded with the special-shaped copper block.

Optionally, the manufacturing of the laminated structure further includes setting a compensation prepreg between the sidewall position of the special-shaped copper block and the bottom plate.

Optionally, the laminated structure is divided into an effective area and an auxiliary area in a plane direction, and the auxiliary area is provided with a positioning hole.

Optionally, the manufacturing the second pressing auxiliary tool further includes: manufacturing a release layer with a release layer window opening area, wherein the release layer window opening area is matched with the die boss; manufacturing a windowing covering layer, wherein a covering layer windowing area is manufactured on the windowing covering layer, and the covering layer windowing area is matched with the die boss; sequentially placing the release layer and the cover layer on the die tool, and sleeving the release layer window area and the cover layer window area into the die boss; the surface release layer is laid on the surface of the windowing covering layer and the die boss.

Optionally, the second pressing tool structure is further provided with a mold pin, the mold pin is fixed on the mold base, the mold pin is matched with the positioning hole, and the mold pin is sleeved in the mold pin after the mold pin is opened, the mold release layer is opened, the mold cover layer is opened, the mold release layer is opened, and the mold pin is sleeved on the mold pin.

Optionally, the length of the mold pin extending out of the surface release layer is smaller than or equal to the thickness of the circuit board embedded with the special-shaped copper block.

Optionally, the upper surface dimension of the die boss is smaller than the bottom surface dimension.

Optionally, the die boss is further provided with a buffer slot, the buffer slot is a slot with the depth being the same as the height of the die boss, and the buffer slot is distributed at the edge position of the die boss.

Alternatively, the sanding may be 800 mesh sanding belt or 1200 mesh sanding belt.

Optionally, after polishing, mechanical deep milling cleaning, laser milling cleaning and plasma photoresist removing cleaning are sequentially performed.

According to the technical scheme, the stacked structure is changed, the inner double-sided core plate is changed into a structure with the single-sided core plate and the prepreg, so that interlayer binding force of lamination is effectively improved, gaps between the special-shaped copper blocks and all layers are effectively filled by utilizing good fluidity of the prepreg under high-temperature and high-pressure lamination conditions, the binding force between the special-shaped copper blocks and all layers is improved, a boss type lamination auxiliary tool with a mold design is arranged on one surface of a groove body of the special-shaped copper blocks, the traditional auxiliary tool with a common lamination of a steel plate, a coating layer and a release layer is replaced, the lamination precision of the special-shaped copper blocks and interlayer binding force are effectively improved, the problems of offset, deformation and unstable lamination of the special-shaped copper blocks in the lamination process are avoided, the mold boss of the boss type lamination auxiliary tool is further arranged to be trapezoid, a buffer seam is arranged, the suitability and the buffer property of the boss type lamination auxiliary tool and the stacked structure are further improved, the processing error is reduced, the processing efficiency is improved, and the application life of the boss type lamination auxiliary tool is prolonged; the integral processing mode effectively solves the problems of deviation, deformation and infirm lamination of the circuit board embedded with the special-shaped copper block in the processing process, and avoids the problems of overlarge side erosion tolerance generated by etching and loose copper block caused by milling.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings may be obtained from the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic illustration of a process flow according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional structure diagram of forming a press-fit typesetting structure according to an embodiment of the present invention;

FIG. 3 is a schematic cross-sectional view of a second bonding tool according to an embodiment of the present invention;

Fig. 4 is a schematic cross-sectional structure of a press-fit typesetting structure for forming press-fit according to an embodiment of the present invention;

FIG. 5 is a schematic cross-sectional view of a laminate panel according to an embodiment of the present invention;

FIG. 6 is a schematic cross-sectional view of a polished tooling plate according to an embodiment of the present invention;

fig. 7 is a schematic cross-sectional structure of a circuit board according to an embodiment of the present invention, in which an embedded special-shaped copper block is formed;

fig. 8 is a schematic plan view of the plan view of fig. 7 (bottom-up view of fig. 7) according to an embodiment of the present invention.

Reference numerals illustrate:

Reference numerals	Name of the name	Reference numerals	Name of the name
				10	Lamination typesetting structure	630	Third positioning hole
10A	Laminated structure	640	Fourth locating hole
				10B	First pressing auxiliary tool	650	Fifth locating hole
10C	Second pressing auxiliary tool	710	First release layer
				10AY	Effective area	720	First coating layer
10AF	Auxiliary area	730	Second release layer
				100	Special-shaped copper block	740	Steel plate layer
110	Plane of special-shaped copper block	810	Mould tool
				120	Special-shaped copper block side wall	8110	Die base
130	Special-shaped copper block groove	8120	Die boss
				200	First laminated plate	8130	Mould pin
210	First laminated plate dielectric layer	8140	Buffer seam
				220	First laminated board bottom copper layer	820	Surface release layer
230	First laminated plate surface copper layer	8210	Adhesive layer
				300	Second laminated plate	830	Window release layer
310	Second laminated plate dielectric layer	840	Window covering layer
				320	Second laminated plate copper layer	10P	Press fit typesetting structure during press fit
400	Third laminated plate	20	Laminated board
				410	Third laminated plate dielectric layer	20A	Glue overflow
420	Third laminated plate copper layer	20D	Pressed board after polishing
				500	Compensation prepreg	30	Circuit board embedded with special-shaped copper block
610	First positioning hole	910	Heat conduction blind hole
				620	Second positioning hole	920	Welding circuit pattern

The achievement of the object, functional features and advantages of the present invention will be further described with reference to the drawings in connection with the embodiments.

Detailed Description

In the following description of embodiments of the invention, the technical proposal in the embodiment of the invention is clearly and completely described, it will be apparent that the described embodiments are only some, but not all, of the embodiments of the invention. All other embodiments, based on the embodiments of the invention, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the invention.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

Referring to fig. 1, fig. 1 is a schematic process flow diagram of an embodiment of the invention.

The method for manufacturing the circuit board embedded with the special-shaped copper block according to the embodiment is processed according to the process flow shown in fig. 1, and the following steps will be described.

Referring to fig. 2, 3 and 4, fig. 2 is a schematic cross-sectional structure diagram of forming a press-fit typesetting structure according to an embodiment of the invention; FIG. 3 is a schematic cross-sectional view of a second bonding tool according to an embodiment of the present invention; fig. 4 is a schematic cross-sectional structure of a press-fit typesetting structure for forming press-fit according to an embodiment of the present invention.

Step S10:

Manufacturing a special-shaped copper block; and taking the copper block, and manufacturing the copper block to form the special-shaped copper block with a plane and a side wall.

The embedded special-shaped copper block is generally L-shaped or U-shaped, one surface of the embedded special-shaped copper block forms a plane to play a role in laminating and supporting circuit board circuit manufacture and heat dissipation, and the side wall of the embedded special-shaped copper block forms a groove body structure with the circuit board, so that the embedded special-shaped copper block is used for preventing component products such as chips to be welded; in this embodiment, a specific manufacturing method is described using a "U" shaped copper block 100 as an embedded copper block, and as shown in fig. 2, the shaped copper block 100 includes a shaped copper block plane 110 and two shaped copper block sidewalls 120, so that a "U" shaped copper block 100 having a shaped copper block groove 130 is formed.

Step S20:

Manufacturing a bottom plate; according to the manufacturing method of the circuit board, a circuit board with two circuit pattern layers or a plurality of circuit pattern layers is manufactured and formed, and a bottom layer board is formed.

With continued reference to fig. 2, the bottom plate in this embodiment is a first laminated plate 200, including a laminated first laminated plate bottom copper layer 220, a first laminated plate dielectric layer 210, and a first laminated plate surface copper layer 230, where the first laminated plate bottom copper layer 220 is fabricated with a window pattern complementary to the shaped copper block plane 110, and a single side of the window pattern is larger than a size (generally 10 μm to 100 μm in advance) of the shaped copper block plane 110, so as to form a pre-large compensation during lamination; the first laminated board dielectric layer 210 may be a low-gummosis prepreg, and the gum content is optionally 40% to 55%, so that the low-gummosis prepreg has a smaller gummosis amount in the lamination process, and can effectively support lamination and reduce deformation of the copper layer pattern.

Step S30:

Manufacturing an embedded laminate; and (3) taking a layer of single-sided copper clad laminate which is more than or equal to one layer, respectively manufacturing circuit patterns, and manufacturing the window opening area of the embedded laminate in a matching manner according to the size of the special-shaped copper block to form the embedded laminate.

With continued reference to fig. 2, the embedded laminates of the present embodiment are a second laminated board 300 and a third laminated board 400, where the second laminated board 300 is manufactured by processing a single-sided copper clad laminate, and includes a second laminated board copper layer 320 and a second laminated board dielectric layer 310, and a second laminated board window area (not labeled in the figure) is manufactured; the third laminated board 400 is also manufactured by processing a single-sided copper clad laminate, and comprises a third laminated board copper layer 420 and a third laminated board dielectric layer 410, and a third laminated board windowing area (not shown in the figure) is manufactured; the size of the second laminated plate windowing region and the size of the third laminated plate windowing region are mutually matched with the embedded size of the special-shaped copper block 100, the single side is larger than the size of the special-shaped copper block 100, a certain gumming and glue filling gap is formed between the special-shaped copper block 100 and the windowing size, and the problems that the surface of the circuit board is convex during lamination are prevented.

The second laminate dielectric layer 310 and the third laminate dielectric layer 410 may also be low-flow prepregs, optionally with a gel content of 40% to 55%.

Step S40:

Manufacturing a windowed prepreg; and taking the prepreg, and matching and manufacturing a window opening area of the prepreg according to the size of the special-shaped copper block to form the window opening prepreg.

With continued reference to fig. 2, the windowed prepreg of the present embodiment includes a first high-flux prepreg 510 and a second Gao Liujiao prepreg 520, where a first high-flux prepreg windowed area and a second high-flux prepreg windowed area are respectively manufactured, and are matched with the outer dimension of the embedded special-shaped copper block 100, and are unilaterally larger than the outer dimension of the embedded special-shaped copper block 100 by a certain dimension (typically 10 μm to 100 μm).

The first prepreg 510 and the second prepreg Gao Liujiao may be high-flow prepregs, the gel content is optionally 55% to 75%, and the high-flow prepregs can more fully form the effects of flow, filling and interlayer bonding in the lamination process.

It should be noted that, in this embodiment, the first high-flux prepreg 510, the second laminated board 300, the second Gao Liujiao prepreg 520 and the third laminated board 400 form a laminated structure composed of a single-sided copper-clad plate and a prepreg layer, so as to replace the original laminated structure formed by a double-sided copper-clad plate, a prepreg layer and a surface copper foil layer, on one hand, the insulating medium layer of the single-sided copper-clad plate can be set to be a low-flux core board, so as to play a role of reinforcing and supporting, and the multi-layer windowed prepreg is set to be a high-flux glue layer, so that more sufficient glue filling and interlayer bonding force can be formed, and on the other hand, the alignment and positioning accuracy in the lamination process can be improved, so that the embedded special-shaped copper block has higher precision.

Step S50:

manufacturing a laminated structure; and stacking the bottom layer plate and the embedded layer plate, arranging the windowed prepreg between the stacked layers, stacking the windowed area of the embedded layer plate and the windowed area of the prepreg to form a stacked windowed area, and placing the special-shaped copper blocks in the stacked windowed area to form a stacked structure.

The laminated structure of this embodiment is shown in fig. 2.

With continued reference to fig. 2, in this embodiment, the fabrication of the laminated structure further includes disposing a compensation prepreg 500 between the sidewall (i.e., the sidewall 120 of the shaped copper block) 100 and the bottom plate (i.e., the first laminated plate 200).

Because the embedded special-shaped copper block 100 is generally provided with corners, the corners are easy to extrude other stacked layers in the pressing process, and therefore the compensation prepreg 500 arranged at the corners can play roles of buffering extrusion, compensation glue filling and compensation combination.

With continued reference to fig. 2, in the present embodiment, the stacked structure is divided into an effective area 10AY and an auxiliary area 10AF in the planar direction, and the auxiliary area 10AF is provided with positioning holes.

Namely, the auxiliary area 10AF of each layer of the laminated structure is provided with positioning holes, each positioning hole comprises a first positioning hole 610, a second positioning hole 620, a third positioning hole 630, a fourth positioning hole 640 and a fifth positioning hole 650, and the positioning holes can be matched with the die pins 8130 described below to work, so that the interlayer positioning accuracy in the lamination process is improved, the lamination layer is prevented from deviating, and the problem of embedding the special-shaped copper block 100 from deviating is solved.

Step S60:

Manufacturing a pressing auxiliary tool; the method comprises the steps of manufacturing a first pressing auxiliary tool 10B and manufacturing a second pressing auxiliary tool 10C, wherein the first pressing auxiliary tool 10B is a pressing auxiliary tool which is formed by matching a bottom plate and comprises a release layer, a covering layer and a steel plate layer.

With continued reference to fig. 2, the first lamination auxiliary tool 10B is sequentially laminated with a first release layer 710, a first cover layer 720, a second release layer 730, and a steel plate layer 740 from one side of the laminated structure to form a lamination auxiliary tool with release and cover capabilities, and since the first lamination auxiliary tool 10B is disposed on one side of the bottom plate to perform a leveling function, the first lamination auxiliary tool needs to be set to a flat auxiliary structure, and multiple release layers, cover layers and other functional layers can be disposed according to the requirement, which will not be repeated herein.

The second pressing auxiliary tool 10C is manufactured as follows: firstly, manufacturing a mould tool 810, wherein the mould tool 810 comprises a mould base 8110, and a mould boss 8120 is arranged on the mould base 8110; and paving a surface release layer 820 on one surface of the die tool 810, which is provided with the die boss 8120, wherein a convex structure formed by the die boss 8120 and the surface release layer 820 and the special-shaped copper blocks 100 arranged in the stacking structure form a typesetting complementary structure.

With continued reference to fig. 2, in this embodiment, the manufacturing of the second bonding auxiliary tool 10C further includes: manufacturing a release layer 830, wherein the release layer 830 is provided with a release layer window area, and the release layer window area is matched with a die boss 8120; manufacturing a windowing covered layer 840, wherein the windowing covered layer 840 is provided with a covered layer windowing area, and the covered layer windowing area is matched with a die boss 8120; placing the fenestration release layer 830 and the fenestration cover layer 840 in sequence on the mold tool 810, and sleeving the release layer fenestration area and the cover layer fenestration area into the mold boss 8120; the surface release layer 820 is laid on the fenestration layer and the surface of the mold boss.

In this embodiment, the mode of making the pressing auxiliary tool into a mold is adopted, and a mold structure matched with the embedded special-shaped copper block 100 is made, so that the traditional mode of forming the pressing auxiliary tool by adopting simple lamination layers with various functions is replaced, the covering capacity, the processing precision and the accuracy of embedding the special-shaped copper block during pressing can be effectively improved, the surface release layer 820 is arranged on the surface of the mold tool 810, smooth stripping of the mold tool 810 after the pressing is finished is achieved, and the surface release layer 820 can be adhered and fixed by adopting the adhesive layer 8210.

Further, the windowed release layer 830 and the windowed cover layer 840 matched with the mold tool 810 and the mold boss 8120 are provided, so that the mold tool 810 has better cover capability in the lamination process corresponding to the area (non-irregular copper block area) of the laminated circuit layers.

It should be noted that, the protruding height of the mold boss 8120, or the protruding height of the windowed covering layer 840, is generally set to be less than or equal to the depth of the groove (the special-shaped copper block groove 130) of the laminated board embedded in the special-shaped copper block 100 formed after the lamination is completed, that is, when the mold boss 8120 is manufactured, the mold boss 8120 is suitably pre-reduced according to the lamination thickness, so as to prevent the problem that the area of the laminated circuit layer is excessively laminated due to the excessive height; in addition, the size of the windowed covering layer 840 may be smaller than the size of the surface release layer 820, and may be smaller than the size of the windowed release layer 830, so as to prevent excessive gummosis of the windowed covering layer 840 during lamination from causing surface contamination of the mold tool 810.

Please continue to refer to fig. 3; the upper surface dimension of the die boss 8120 is smaller than the bottom surface dimension; the die boss 8120 is also fabricated with a buffer slot 8140, the buffer slot 8140 is a slot having the same depth as the die boss 8120 in height, and the buffer slot 8140 is distributed at the edge position of the die boss 8120 (generally, 1mm to 5mm from the outer edge of the die boss).

The die boss 8120 is arranged to be of a trapezoid cross section, alignment in the machining process is facilitated, the problems of scraping, pressing and offset of the die boss 810 on the special-shaped copper block 100 and the like caused by the alignment are prevented, and the service life of the die tool 810 can be prolonged; the buffer seam 8140 is arranged, so that good combination capability of the special-shaped copper block 100 between the longitudinal buffer and covering layers and each circuit layer in the lamination process can be formed, the processing precision can be improved, and the problems of deformation, deviation and the like caused by excessive extrusion of the special-shaped copper block 100 in the processing can be prevented; and the mould boss 8120 distributed at the side of the buffer slot 8140 can be used for manufacturing a longitudinal cutting groove, so that the longitudinal cutting groove forms a discontinuous structure, and a better buffer effect can be achieved.

With continued reference to fig. 2 and 4, fig. 4 is a layout structure diagram of fig. 2 at the start of the press.

Step S70:

manufacturing a pressing typesetting structure 10; and sequentially laminating and typesetting the first lamination tool structure 10B, the stacking structure 10A and the second lamination tool structure 10C to form the lamination typesetting structure 10.

In this embodiment, the second press-fit tool structure 10C is further provided with a mold pin 8130, the mold pin 8130 is fixed on the mold base 8110, the mold pin 8130 is arranged in a matching positioning hole, and the mold pin is sleeved with the windowed release layer, the windowed cover layer and the surface release layer of the second press-fit tool structure 10C; the length of the mold pin 8130 extending out of the surface release layer 820 is less than or equal to the thickness of the circuit board embedded with the shaped copper block 100.

The die pins 8130 are arranged to be complementarily matched with the positioning holes, and the pins are inserted into the positioning holes during lamination to position each lamination structure, so that the interlayer positioning and alignment accuracy of lamination can be improved, and the problems of lamination layer deviation and abnormal copper block 100 embedding deviation are prevented.

The height of the mold pin 8130 protruding from the surface of the release layer 820 is smaller than or equal to the thickness of the laminated board formed after the lamination is completed, so as to prevent the pin from buckling or being difficult to peel due to the excessively high height.

Please refer to fig. 5; fig. 5 is a schematic cross-sectional structure of a formed laminated plate according to an embodiment of the present invention.

Step S80:

Manufacturing a laminated board 20; the press-fit typesetting structure 10 is press-fit, and then the first press-fit tool mechanism 10B and the second press-fit tool mechanism 10C are removed to form the laminate 20.

After the lamination, the outer side of the sidewall of the special-shaped copper block 100 generally has problems such as glue overflow 20A or unevenness, and needs further treatment.

Referring to fig. 6, 7 and 8, fig. 6 is a schematic cross-sectional structure of a polished processing board according to an embodiment of the invention; fig. 7 is a schematic cross-sectional structure of a circuit board according to an embodiment of the present invention, in which an embedded special-shaped copper block is formed; fig. 8 is a schematic plan view of the plan view of fig. 7 (bottom-up view of fig. 7) according to an embodiment of the present invention.

Step S90:

The laminate 20 is manufactured by polishing, the flash 20A or the uneven portion is polished off to form 20D as shown in fig. 6, and the post-process processing is performed to form the circuit board 30 embedded with the irregularly-shaped copper piece.

In this embodiment, the polishing adopts 800 mesh abrasive belt or 1200 mesh abrasive belt polishing, adopts comparatively "mild" polishing parameter, can ensure to polish away impurity such as glue overflow 20A, can not cause the excessive problem of polishing of face or the loosening etc. of dysmorphism copper billet 100.

In this embodiment, after polishing, mechanical deep milling cleaning, laser milling cleaning, and plasma photoresist removing cleaning are sequentially performed.

After polishing, the combination precision and the stair effect between the special-shaped copper block 100 and the circuit board body still need to be further processed to form a more precise product, mechanical deep milling cleaning processing is adopted to primarily remove and trim larger impurities, laser milling cleaning processing is adopted to form the effects of removing impurities and trimming precision with high precision, and finally plasma glue removing cleaning processing is adopted to remove the areas which cannot be cleaned by the mechanical deep milling and the laser milling, so that the final high-precision effect is formed.

Post-processing includes fabricating surface circuit patterns, which may include fabricating conductive blind vias 910 that interconnect the shaped copper block 100, enhancing the conductive ability of the shaped copper block 100 out of the circuit board.

With continued reference to fig. 8, it can be seen that, when the components such as LEDs are soldered, the components may be placed in the grooves of the special-shaped copper block 100, and package soldering is performed by adopting COB (chip on board) method or the like, and the soldering circuit pattern 920 is a soldering pin, so as to form a surrounding or semi-surrounding of the special-shaped copper block 100 to the components, reduce the overall thickness of the soldered circuit board, and improve the heat dissipation capability.

In the actual processing and application processes, different circuit board products have different designs, processing and application situations, and the drawings in this embodiment are used only as an implementation process for illustrating this embodiment, and do not represent the dimension ratio of the actual product or the drawing in which the dimension ratio is enlarged in equal proportion according to the actual situation.

The foregoing is only the preferred embodiments of the present invention, and not the limitation of the scope of the present invention, and all the equivalent structural changes made by the description of the present invention and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the present invention.

Claims (10)

1. The manufacturing method of the circuit board embedded with the special-shaped copper block is characterized by comprising the following steps of:

S10: the special-shaped copper block is manufactured,

Taking a copper block, and manufacturing the copper block with the special shape and containing more than or equal to one plane and more than or equal to one side wall;

S20: a bottom layer plate is manufactured,

According to the manufacturing mode of the circuit board, manufacturing a circuit board with two circuit pattern layers or a plurality of circuit pattern layers to form the bottom plate;

S30: an embedded layer board is manufactured,

Taking a layer of single-sided copper clad laminate which is more than or equal to one layer, respectively manufacturing circuit patterns, and manufacturing an embedded laminate windowing area in a matching manner according to the size of the special-shaped copper block to form the embedded laminate;

S40: the prepreg with the window is manufactured,

Taking a prepreg, and matching and manufacturing a prepreg windowing area according to the size of the special-shaped copper block to form the windowing prepreg;

S50: a laminated structure is manufactured, and the laminated structure is manufactured,

Stacking the bottom layer plate and the embedded layer plate, arranging the windowed prepreg between the stacked layers, stacking the windowed area of the embedded layer plate and the windowed area of the prepreg to form a stacked windowed area, and arranging the special-shaped copper block in the stacked windowed area to form a stacked structure;

S60: manufacturing auxiliary pressing tools including a first auxiliary pressing tool and a second auxiliary pressing tool,

The first auxiliary pressing tool is matched with a pressing tool formed by the bottom plate and comprises a release layer, a covering layer and a steel plate layer;

the second pressing auxiliary tool is manufactured by the following steps:

firstly, manufacturing a mould tool, wherein the mould tool comprises a mould base, and a mould boss is arranged on the mould base;

Paving a surface release layer on one surface of the die tool, which is provided with the die boss, wherein a convex structure formed by the die boss and the surface release layer and the special-shaped copper blocks arranged in the stacking structure form a typesetting complementary structure;

s70: a pressing and typesetting structure is manufactured,

Sequentially laminating and typesetting the first lamination tool structure, the stacking structure and the second lamination tool structure to form the lamination typesetting structure;

s80: a laminate sheet is made up of a laminate,

Pressing the pressing typesetting structure, and removing the first pressing tool mechanism and the second pressing tool mechanism to form the laminated board;

S90: and polishing the laminated board, and performing post-working procedure processing to form the circuit board embedded with the special-shaped copper block.

2. The method for manufacturing a circuit board embedded in a special-shaped copper block according to claim 1, wherein the manufacturing a laminated structure further comprises providing a compensating prepreg between the side wall position of the special-shaped copper block and the bottom plate.

3. The method for manufacturing a circuit board embedded with a special-shaped copper block according to claim 1, wherein the laminated structure is divided into an effective area and an auxiliary area in the planar direction,

The auxiliary area is provided with a positioning hole.

4. A method for manufacturing a circuit board embedded with a special-shaped copper block as defined in claim 1 or 3, wherein the manufacturing of the second pressing auxiliary tool further comprises:

manufacturing a release layer with a release layer window opening area, wherein the release layer window opening area is matched with the die boss;

Manufacturing a windowing covering layer, wherein a covering layer windowing area is manufactured on the windowing covering layer, and the covering layer windowing area is matched with the die boss;

Sequentially placing the release layer and the cover layer on the die tool, and sleeving the release layer window area and the cover layer window area into the die boss;

the surface release layer is laid on the surface of the windowing covering layer and the die boss.

5. The method for manufacturing a circuit board embedded with a special-shaped copper block according to claim 4, wherein the second pressing tool structure is further provided with a mold pin, the mold pin is fixed on the mold base,

The die pins are matched with the positioning holes,

The windowing release layer, the windowing cover layer and the surface release layer are sleeved into the die pin.

6. The method for manufacturing a circuit board embedded with a special-shaped copper block according to claim 5, wherein the length of the mold pin extending out of the surface release layer is smaller than or equal to the thickness of the circuit board embedded with the special-shaped copper block.

7. A method of manufacturing a circuit board embedded in a shaped copper block as defined in claim 1 or 3, wherein the upper surface dimension of the die boss is smaller than the bottom surface dimension.

8. The method for manufacturing a circuit board embedded with a special-shaped copper block according to claim 7, wherein the die boss is further provided with a buffer slot, and the buffer slot is a slot with the depth identical to the height of the die boss;

The buffer seams are distributed at the edge positions of the die bosses.

9. A method of manufacturing a circuit board embedded in a profiled copper block as defined in claim 1, wherein the polishing is performed using an 800 mesh belt or a 1200 mesh belt.

10. The method for manufacturing a circuit board embedded with a special-shaped copper block according to claim 1 or 9, wherein mechanical deep milling cleaning, laser milling cleaning and plasma photoresist removing cleaning are sequentially performed after polishing.