CN217693827U - Multistage ladder high frequency PCB board - Google Patents
Multistage ladder high frequency PCB board Download PDFInfo
- Publication number
- CN217693827U CN217693827U CN202220686983.9U CN202220686983U CN217693827U CN 217693827 U CN217693827 U CN 217693827U CN 202220686983 U CN202220686983 U CN 202220686983U CN 217693827 U CN217693827 U CN 217693827U
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- high frequency
- ladder
- windowing
- frequency
- frequency core
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- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000002699 waste material Substances 0.000 description 9
- 229910000831 Steel Inorganic materials 0.000 description 8
- 239000010959 steel Substances 0.000 description 8
- 238000010030 laminating Methods 0.000 description 6
- 238000003801 milling Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 5
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- UFNIBRDIUNVOMX-UHFFFAOYSA-N 2,4'-dichlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1Cl UFNIBRDIUNVOMX-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Abstract
The utility model discloses a multistage ladder high frequency PCB board, including the main part that two at least high frequency Core boards constitute, all high frequency Core board top-down superpose in proper order, be provided with high frequency PP piece between two adjacent high frequency Core boards, and top-down has seted up a plurality of ladder windowing in the main part, and the bottom of windowing of every ladder all extends to the upper surface of one of them high frequency Core board, the high frequency Core board upper surface that the bottom that the ladder was windowed corresponds is provided with components and parts pad and wiring design, the components and parts pad is located ladder windowing department, the utility model discloses can promote the volume that components and parts bore quantity, practice thrift the PCB board greatly, can reduce PCB board and electronic equipment's cost of manufacture simultaneously.
Description
Technical Field
The utility model belongs to the technical field of the PCB board, more specifically the utility model relates to a multistage ladder high frequency PCB board that says so.
Background
The electronic products are gradually miniaturized and lightened in size but have more and more functions and more complex functions, which means that each PCB needs to be capable of carrying more components while being continuously reduced in size. The existing commonly adopted solution is to reduce the size of components on the PCB, and is limited by the condition that the size of part of the components cannot be reduced, the cost of the small-size components is high, and the like.
SUMMERY OF THE UTILITY MODEL
The utility model provides a not enough to prior art, the utility model provides a high frequency PCB board comprises two and above high frequency Core boards, can design the ladder on the high frequency Core board of difference and window to have the components and parts pad, thereby realize multilayer components and parts's solid welding and encapsulation, can promote the volume that components and parts bore quantity, practice thrift the PCB board greatly, can reduce PCB board and electronic equipment's cost of manufacture simultaneously.
In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a multistage ladder high frequency PCB board, includes the main part that two at least high frequency Core boards constitute, all high frequency Core boards top-down superpose in proper order, and top-down has seted up a plurality of ladder windowing in the main part, and the bottom of windowing of every ladder all extends to the upper surface of one of them high frequency Core board, the high frequency Core board upper surface that the bottom that the ladder windowed corresponds is provided with components and parts pad and wiring design, the components and parts pad is located ladder windowing department.
And a high-frequency PP sheet is arranged between two adjacent high-frequency Core plates.
And a component bonding pad and a wiring design are also arranged above the uppermost high-frequency Core plate.
A multi-stage stepped high-frequency PCB laminating die comprises a supporting piece and a laminating piece, wherein the supporting piece comprises a first mirror steel plate and a first release film which are arranged from bottom to top, and the laminating piece comprises a second mirror steel plate, a section die, a third release film, tg130PP and a second release film which are arranged from top to bottom; and a boss matched with the stepped windowing is arranged below the section die.
Furthermore, the length and width of the lug boss is 0.1mm smaller than the single side of the step windowing size, and the height of the lug boss is 0.2mm smaller than the step windowing height.
Compared with the prior art, the beneficial effects of the utility model are that: the high-frequency PCB is formed by bonding two or more high-frequency Core plates through high-frequency PP sheets, stepped windows can be designed on different high-frequency Core plates, and component bonding pads are designed in the stepped windows, so that the limitation that the existing PCB can only carry out component bonding pad wiring design on the surface of the outermost high-frequency Core plate is improved; this multistage ladder high frequency PCB board can realize multilayer components and parts's three-dimensional welding and encapsulation, and the volume that can promote components and parts greatly and bear quantity, practice thrift the PCB board than present planar design components and parts pad wiring can reduce the cost of manufacture of PCB board and electronic equipment simultaneously.
Drawings
Fig. 1 is a cross-sectional view of an embodiment of the multi-stage stepped high-frequency PCB of the present invention;
FIG. 2 is a top view of FIG. 1;
FIG. 3 is a partial perspective view of FIG. 1;
FIG. 4 is a schematic diagram of a laminated board in the lamination process of the multi-stage stepped high-frequency PCB of the present invention;
FIG. 5 is a cross-sectional view of the pattern;
fig. 6 is a top view of the die.
Reference numerals: 1. l3, step windowing; 2. l5, step windowing; 3. a high frequency Core plate; 5. a boss; 6. a support member; 61. a first mirror surface steel plate; 62. a first release film; 7. a pressing part; 71. a second mirror steel plate; 72. forming a mould; 73. a third release film; 74. tg130PP; 75. a second release film; 8. and pressing the PCB.
Detailed Description
Embodiments of the present invention are further described with reference to fig. 1 to 6.
In the description of the present invention, it should be noted that, for the terms of orientation, such as "central", "transverse (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like, indicate that the orientation and positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, but not for indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the present invention.
Furthermore, if any, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features. Thus, the definition of "a first" or "a second" feature may explicitly or implicitly include one or more of the features, and as used in the description of the invention, the definition of "a plurality" or "a plurality" means two or more unless otherwise explicitly specified.
The utility model provides a multistage ladder high frequency PCB board, includes the main part that two at least high frequency Core boards 3 constitute, all 3 top-down of high frequency Core boards superpose in proper order, and top-down has seted up a plurality of ladder windowing in the main part, and the bottom of windowing of every ladder all extends to the upper surface of one of them high frequency Core board 3, and the upper surface that the bottom can be at different high frequency Core boards 3 is windowed to the ladder of difference, the high frequency Core board 3 upper surface that the bottom that the ladder was windowed corresponds is provided with components and parts pad and wiring design, components and parts pad is located ladder windowing department, and every components and parts pad all is located the ladder windowing bottom position that corresponds promptly.
Preferably, a high-frequency PP sheet is disposed between two adjacent high-frequency Core plates 3, that is, two adjacent high-frequency Core plates 3 are adhesively fixed by the high-frequency PP sheet.
And a component bonding pad and a wiring design are also arranged above the uppermost layer high-frequency Core plate 3.
As shown in fig. 1-3, taking a certain six-layer secondary high-frequency PCB as an example, the PCB is designed with an L3-layer stepped windowing 1 and an L5-layer stepped windowing 2, so as to achieve the purpose of designing component pads on an L1 circuit layer, an L3 circuit layer and an L5 circuit layer at the same time, that is, stepped windowing can be designed on different high-frequency Core boards 3, and component pads are designed in the stepped windowing, thereby improving the limitation that the current PCB can only perform component pad wiring design on the surface of the outermost high-frequency Core board 3; the multistage ladder high frequency PCB board can realize three-dimensional welding and packaging of multilayer components, can greatly improve the component bearing quantity and save the volume of the PCB board compared with the existing planar design component pad wiring, and can reduce the manufacturing cost of the PCB board and electronic equipment.
A multi-stage ladder high-frequency PCB laminating die comprises a support piece 6 and a laminating piece 7, wherein the support piece 6 comprises a first mirror surface steel plate 61 and a first release film 62 which are arranged from bottom to top, and the laminating piece 7 comprises a second mirror surface steel plate 71, a section mould 72, a third release film 73, tg130PP and a second release film 75 which are arranged from top to bottom; and a boss 5 matched with the stepped windowing is arranged below the section die 72.
A lamination preparation process of a multistage stepped high-frequency PCB comprises the following steps:
s1: windowing the high-frequency Core plate 3 on the non-step layer, and milling waste materials at the windowing position of the high-frequency Core plate 3 by adopting a precision milling machine according to a preset program; taking the six-layer two-stage high-frequency PCB as an example, referring to fig. 1, the high-frequency Core plates 3 of L1-L2 need to mill waste materials at the step positions of the L3 layer, and the high-frequency Core plates 3 of L1-L2 and the high-frequency Core plates 3 of L3-L4 need to mill waste materials at the step positions of the L5 layer; in order to ensure the alignment precision between the high-frequency Core plates 3 of L1-L2 and the high-frequency Core plates 3 of L3-L4, before the waste at the step position of L5 layer is milled, the high-frequency Core plates 3 of L1-L2 and the high-frequency Core plates 3 of L3-L4 need to be fused by a hot melting machine;
s2: windowing the high-frequency PP sheet, and milling the waste at the windowing position of the high-frequency PP sheet by adopting a precision milling machine according to a preset program; taking the six-layer two-stage high-frequency PCB as an example, referring to fig. 1, the high-frequency PP sheet between the L2-layer pattern and the L3-layer pattern needs to mill away the waste material at the step position of the L3 layer, and the high-frequency PP sheet between the L4-layer pattern and the L5-layer pattern needs to mill away the waste material at the step position of the L5 layer; in order to ensure the alignment precision between the Core plate and the high-frequency PP sheet layer, before the waste at the step position of the L3 layer is milled, a hot melting machine is required to fuse the Core of the L1-L2 layer and the high-frequency PP sheet of the L2-L3 layer; before the waste at the step position of the L5 layer is milled, fusing the cores of the L1-L2 high-frequency Core plates 3 and L3-L4 with the high-frequency PP sheets of the L4-L5 by using a hot melting machine;
the windowing size of each layer of high-frequency Core plate 3 is consistent with the design of a PCB finished product plate; the windowing size of the high-frequency PP sheet needs to be 0.5-2mm larger than the designed single side of a PCB finished product board, and the windowing size can be specifically adjusted according to the gummosis amount of the high-frequency PP sheet; the purpose is to avoid the high frequency PP piece to overflow the gummosis volume between the layer too much, pollute the pad of ladder position.
S3: designing a press-fit mold, namely milling a boss 5 on a thick epoxy plate by adopting a precision milling machine according to a preset program, wherein the position of the boss 5 corresponds to the step windowing, the length and width of the boss 5 are smaller than the single side of the step windowing by 0.1mm, and the height of the boss 5 is smaller than the step windowing by 0.2mm;
wherein the thickness of the thick epoxy board is 3.00mm, the four corners of the section mould 72 are designed with alignment pin holes, the upper part of the pin is designed to be square, the lower part is designed to be round, wherein the height of the square part does not exceed the upper surface of the mould, and the length of the round part is 60-80% of the thickness of the PCB to be pressed.
S4: stacking the first mirror surface steel plate 61, the first release film 62, the PCB 8 to be laminated, the second release film 75, the Tg130PP74, the third release film 73, the section mold 72 and the second mirror surface steel plate 71 on a stacking table in sequence; the thickness of the release film and the thickness of the Tg130PP can be adjusted according to the step depth of a specific PCB, and the principle is that the total thickness of the release film and the PP sheet is more than or equal to the deepest step depth; the mold 72 needs to use alignment pins to fix the mold 72 and the PCB, so as to ensure that the protruding position of the mold 72 and the step position of the PCB are completely overlapped and do not slide during pressing.
S5: and (4) pressing, namely selecting a corresponding pressing program according to the specific type of the high-frequency PP sheet, and finishing the pressing manufacture of the multistage stepped high-frequency PCB at a certain high temperature and high pressure.
It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection does not only confine above-mentioned embodiment, the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (3)
1. The utility model provides a multistage ladder high frequency PCB board which characterized in that: including the main part that two at least high frequency Core boards constitute, all high frequency Core boards top-down superpose in proper order, and top-down has seted up a plurality of ladder windowing in the main part, and the bottom of windowing of every ladder all extends to the upper surface of one of them high frequency Core board, the high frequency Core board upper surface that the bottom of windowing of ladder corresponds is provided with components and parts pad and wiring design, the components and parts pad is located ladder windowing department.
2. The multi-step high frequency PCB board of claim 1, wherein: and a high-frequency PP sheet is arranged between two adjacent high-frequency Core plates.
3. The multi-stage stepped high frequency PCB board as claimed in claim 2, wherein: and a component bonding pad and a wiring design are also arranged above the uppermost high-frequency Core plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220686983.9U CN217693827U (en) | 2022-03-28 | 2022-03-28 | Multistage ladder high frequency PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220686983.9U CN217693827U (en) | 2022-03-28 | 2022-03-28 | Multistage ladder high frequency PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217693827U true CN217693827U (en) | 2022-10-28 |
Family
ID=83730377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220686983.9U Active CN217693827U (en) | 2022-03-28 | 2022-03-28 | Multistage ladder high frequency PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217693827U (en) |
-
2022
- 2022-03-28 CN CN202220686983.9U patent/CN217693827U/en active Active
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| GR01 | Patent grant | ||
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A multi-level stepped high-frequency PCB board Granted publication date: 20221028 Pledgee: China Co. truction Bank Corp Jiaxing branch Pledgor: CHENGYI ELECTRONICS (JIAXING) CO.,LTD. Registration number: Y2024330000090 |