CN215581864U

CN215581864U - High heat dissipation printed circuit board

Info

Publication number: CN215581864U
Application number: CN202121465502.3U
Authority: CN
Inventors: 谢光前; 沙伟强; 叶志峰
Original assignee: Kinwong Electronic Technology Longchuan Co Ltd
Current assignee: Kinwong Electronic Technology Longchuan Co Ltd
Priority date: 2021-06-29
Filing date: 2021-06-29
Publication date: 2022-01-18
Anticipated expiration: 2031-06-29

Abstract

The utility model relates to the technical field of printed circuit boards, and provides a high-heat-dissipation printed circuit board which comprises a copper substrate, a first semi-curing sheet, a core plate and a resin module, wherein a copper-based boss is arranged on one side surface of the copper substrate, an accommodating groove staggered with the copper-based boss is arranged on the other side surface of the copper substrate, the core plate and the first semi-curing sheet are respectively provided with a window corresponding to the position of the copper-based boss, the core plate, the first semi-curing sheet and the copper substrate are sequentially stacked, and the resin module is fixed in the accommodating groove. According to the high-heat-dissipation printed circuit board provided by the utility model, the resin module is embedded on the copper substrate, the burr of the single large-size copper substrate is removed, a plate grinding carrier and a browning fixture are not required to be manufactured, the investment of the carrier when the burr is ground by a horizontal line and a browning line is passed due to the single copper block can be reduced, the technical problem of high manufacturing cost of the conventional high-heat-dissipation printed circuit board is solved, and the economic benefit is improved.

Description

High heat dissipation printed circuit board

Technical Field

The utility model relates to the technical field of printed circuit boards, in particular to a high-heat-dissipation printed circuit board.

Background

With the development of the super-large-scale integrated circuit technology, more and more chips can be integrated on one circuit board body, and accordingly, the power consumed by electronic devices on the circuit board body is increased. The heat generated when the chip works enables the temperature of the corresponding circuit board body area to be increased rapidly, and the working efficiency and the service life of the chip are influenced indirectly. Therefore, improving the heat dissipation of the circuit board body is one of important means for solving the above problems.

Generally, a copper block is embedded in an FR-4 substrate, and the local heat dissipation effect is remarkable. However, the copper block is embedded in the FR-4 substrate, the copper block needs to be processed, the copper block is easy to form an edge, a special carrier needs to be manufactured for the small-size copper block, the copper block edge can be processed through a horizontal grinding plate line, or manual grinding is carried out, a browning fixture needs to be manufactured to complete a browning process of the copper block, the copper block needs to be manually placed on the carrier or the fixture after an auxiliary tool is used, the copper block needs to be manually detached after browning, and a large amount of labor cost is needed.

Therefore, the conventional high-heat-dissipation printed circuit board has the technical problem of high manufacturing cost.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a high-heat-dissipation printed circuit board, and aims to solve the technical problem that the existing high-heat-dissipation printed circuit board is high in manufacturing cost.

In order to achieve the purpose, the utility model adopts the technical scheme that: the utility model provides a high heat dissipation printed circuit board, includes resin module, copper base plate, first semi-solid piece and core, a side of copper base plate is equipped with the copper base boss, another side of copper base plate be equipped with the holding tank that copper base boss staggers each other, the core with first semi-solid piece all be equipped with the corresponding windowing in copper base boss position, the core first semi-solid piece with the copper base plate stacks in proper order, the resin module is fixed in the holding tank.

In one embodiment, the copper substrate, the first semi-cured sheet and the core plate are provided with first riveting holes corresponding to the positions of the middle non-unit areas.

In one embodiment, the copper substrate, the first semi-cured sheet and the core plate are provided with second riveting holes corresponding to the positions of the peripheral non-unit areas.

In one embodiment, the windowing size of the first semi-cured sheet is 0.072mm-0.078mm larger than the size of the copper-based boss in a single side; and/or the windowing size of the first semi-curing sheet is 0.072mm-0.078mm larger than the size of the copper-based boss on one side.

In one embodiment, the core plate is a flexible core plate, and the copper substrate further has a through bending groove located between the accommodating groove and the copper-based boss.

In one embodiment, the number of the core plates is more than two, and the more than two core plates are stacked in sequence.

In one embodiment, two adjacent core boards are connected through a second prepreg.

In one embodiment, both sides of the core board are provided with circuit layers.

In one embodiment, the groove wall of the accommodating groove is a smooth groove wall.

In one embodiment, the top surface of the copper-based boss and the top surface of the core plate are flush.

The high-heat-dissipation printed circuit board provided by the utility model has the beneficial effects that: the resin module is embedded on the copper substrate, the burr is removed from the single large-size copper substrate, a plate grinding carrier and a browning jig are not required to be manufactured, the horizontal plate grinding line is utilized, meanwhile, the resin module is not required to grind the burr and the browning like a copper block, the investment of the carrier when the horizontal line is required to grind the burr and cross the browning line due to the single copper block can be reduced, meanwhile, the work of manually placing the copper block on the carrier and taking the copper block from the carrier after grinding the burr and browning is also cancelled, the technical problem that the manufacturing cost of the existing high-heat-dissipation printed circuit board is high is solved, and therefore economic benefits are improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of a high heat dissipation printed wiring board according to an embodiment of the present invention;

fig. 2 is a plan view of the high heat dissipation printed wiring board of fig. 1;

fig. 3 is a schematic view of another structure of a high heat dissipation printed wiring board according to an embodiment of the present invention.

Wherein, in the figures, the respective reference numerals:

10. a first rivet hole; 20. a second riveting hole; 100. a copper substrate; 110. copper-based bosses; 120. accommodating grooves; 130. a curved groove; 200. a first semi-cured sheet; 300. a core board; 400. a resin module; 500. a second prepreg.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the utility model and are not to be construed as limiting the utility model.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Referring to fig. 1 and 3, a printed circuit board with high heat dissipation includes a resin module 400, a copper substrate 100, a first semi-cured sheet 200 and a core board 300, wherein one side surface of the copper substrate 100 is provided with a copper-based boss 110, the other side surface of the copper substrate 100 is provided with an accommodating groove 120 staggered with the copper-based boss 110, the core board 300 and the first semi-cured sheet 200 are both provided with a window corresponding to the copper-based boss 110, the core board 300, the first semi-cured sheet 200 and the copper substrate 100 are sequentially stacked, and the resin module 400 is fixed in the accommodating groove 120.

If the burrs of a plurality of copper blocks with small unit sizes are processed, a production department also needs to manufacture a special carrier to assist in processing the burrs of the single copper block and needs to use a special browning carrier to assist in manufacturing a browning process of the copper block by using the single copper block.

According to the high-heat-dissipation printed circuit board, the resin module 400 is embedded on the copper substrate 100, the burr of a single large-size copper substrate 100 is removed, a plate grinding carrier and a browning fixture do not need to be manufactured, a horizontal plate grinding line is utilized, meanwhile, the resin module 400 does not need to grind the burr and brownish like a copper block, the investment of the carrier when the burr and the brownish line need to be ground by the horizontal line due to the single copper block can be reduced, meanwhile, the work of manually placing the copper block on the carrier, grinding the burr and taking the copper block from the carrier after browning is omitted, the technical problem that the manufacturing cost of the existing high-heat-dissipation printed circuit board is high is solved, and therefore economic benefits are improved.

Wherein, the number of the copper-based bosses 110 is several, such as one, two or more. Generally, the number of copper-based lands 110 is plural. The number of the receiving grooves 120 is several, such as one, two, or more. The height of the copper-based lands 110 is 0.25mm to 0.26mm, and the copper-based lands 110 are obtained by acid etching the copper substrate 100.

The shape of the copper-based projection 110 is not limited to a square projection, but may be a circular projection or other irregular projections.

Among them, the resin module 400 may be a thermosetting resin module of epoxy resin, a thermoplastic resin module of polyimide, a thermosetting resin module impregnated with a reinforcing material, or a thermoplastic resin module impregnated with a reinforcing material. Specifically, the resin module 400 is an FR-4 module, an ABF module, a BT resin module.

The burrs may be referred to as flashes, burrs or flashes.

In one embodiment, referring to fig. 2, the copper substrate 100, the first semi-cured sheet 200 and the core board 300 have first rivet holes 10 corresponding to the positions of the middle non-unit areas. The pre-stacked copper substrate 100, the prepreg and the core board 300 are riveted and positioned through the first riveting hole 10, the core board 300 can be more firmly combined with the prepreg and the copper substrate 100 or with the remaining layers of core boards 300, and local deformation, displacement and wrinkling caused by pulling and extrusion of a film sticking machine are not easy to occur in the film sticking process, so that the pressing yield is greatly improved.

In one embodiment, referring to fig. 2, the copper substrate 100, the first semi-cured sheet 200 and the core board 300 have second rivet holes 20 corresponding to the positions of the peripheral non-unit areas. In a similar way, the pre-stacked copper substrate 100, prepreg and core board 300 are riveted and positioned through the second riveting hole 20, so that the lamination yield can be greatly improved.

In one embodiment, the size of the accommodating groove 120 is 0.05mm to 0.075mm larger than the size of the resin module 400, so that the resin module 400 can be smoothly installed in the accommodating groove 120, and the gap between the resin module 400 and the groove wall of the accommodating groove 120 is appropriate.

The one-sided shape means that each side, that is, the shape of the receiving groove 120 is the same as the shape of the resin module 400, and each side of the receiving groove 120 is 0.05mm to 0.075mm larger than the size of each side of the resin module 400.

In one embodiment, the first semi-cured sheet 200 has a window size 0.072mm to 0.078mm larger than the size of the copper-based boss 110.

In one embodiment, referring to fig. 1, the core board 300 is a flexible core board 300, the copper substrate 100 further has a through curved groove 130, and the curved groove 130 is located between the receiving groove 120 and the copper-based projection 110.

In one embodiment, referring to fig. 1 and 3, the number of the core plates 300 is more than two, and more than two core plates 300 are stacked in sequence.

Specifically, two adjacent core boards 300 are connected by the second prepreg 500.

In one embodiment, referring to fig. 1 and 3, two side surfaces of the core board 300 are provided with circuit layers.

In one embodiment, the groove walls of the receiving groove 120 are smooth groove walls. Optionally, the worker places the entire copper substrate 100 on a grinding line to clean the edge of the accommodating groove 120.

In one embodiment, the top surface of the copper-based bosses 110 is flush with the top surface of the core plate 300.

In the printed circuit board with high heat dissipation described in this embodiment, the resin module 400 is embedded on the copper substrate 100, the positions of the copper substrate 100 and the copper-based boss 110 are fixed, and the copper substrate 100, the prepreg and the core board 300 share one set of positioning system, so that the copper-based boss 110 is completely aligned with the windows of the prepreg and the core board 300, the windows of the copper-based boss 110, the prepreg and the core board 300 are prevented from being scrapped due to easy deviation, and the yield of the printed circuit board with high heat dissipation is improved.

Wherein the thickness of the copper substrate 100 is 1mm, 1.5mm or 2mm, and the size of the copper substrate 100 is 450mm × 200mm, 468mm × 250mm or 500mm × 300 mm.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims

1. A high heat dissipation printed wiring board characterized in that: including copper base plate, first semi-solid piece, core and resin module, a side of copper base plate is equipped with the copper base boss, the another side of copper base plate be equipped with the mutual staggered holding tank of copper base boss, the core with first semi-solid piece all be equipped with the corresponding windowing in copper base boss position, the core first semi-solid piece with the copper base plate stacks in proper order, the resin module is fixed in the holding tank.

2. The high heat dissipation printed wiring board of claim 1, wherein: the copper substrate, the first semi-cured sheet and the core plate are provided with first riveting holes corresponding to the positions of the middle non-unit areas.

3. The high heat dissipation printed wiring board of claim 1, wherein: the copper substrate, the first semi-solidified sheet and the core plate are provided with second riveting holes corresponding to the positions of the peripheral non-unit areas.

4. The high heat dissipation printed wiring board of claim 1, wherein: the windowing size of the first semi-curing sheet is 0.072mm-0.078mm larger than the size of the copper-based boss on one side.

5. The high heat dissipation printed wiring board of claim 1, wherein: the core plate is a flexible core plate, the copper substrate is further provided with a through bending groove, and the bending groove is located between the accommodating groove and the copper-based boss.

6. The high heat dissipation printed wiring board of claim 1, wherein: the number of the core plates is more than two, and the core plates are sequentially stacked.

7. The high heat dissipation printed wiring board of claim 5, wherein: and two adjacent core plates are connected through a second prepreg.

8. The high heat dissipation printed wiring board of claim 1, wherein: and circuit layers are arranged on two side surfaces of the core board.

9. The high heat dissipation printed wiring board of claim 1, wherein: the cell wall of holding tank is smooth cell wall.

10. The high heat dissipation printed wiring board according to any one of claims 1 to 9, wherein: the top surface of the copper-based boss is flush with the top surface of the core plate.