CN1181713C - 在制作印制电路板的过程中处理金属包裹层压板的处理方法和系统 - Google Patents

在制作印制电路板的过程中处理金属包裹层压板的处理方法和系统 Download PDF

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Publication number
CN1181713C
CN1181713C CNB99816528XA CN99816528A CN1181713C CN 1181713 C CN1181713 C CN 1181713C CN B99816528X A CNB99816528X A CN B99816528XA CN 99816528 A CN99816528 A CN 99816528A CN 1181713 C CN1181713 C CN 1181713C
Authority
CN
China
Prior art keywords
laminated sheet
volume
anticorrosive film
processing section
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB99816528XA
Other languages
English (en)
Chinese (zh)
Other versions
CN1339244A (zh
Inventor
福本恭文
次
北川修次
太
河野啓太
哉
大口哲哉
幸
石黑宏幸
士
北村武士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP11083467A external-priority patent/JP2000271942A/ja
Priority claimed from JP14734699A external-priority patent/JP2000340927A/ja
Priority claimed from JP21142399A external-priority patent/JP2001031305A/ja
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of CN1339244A publication Critical patent/CN1339244A/zh
Application granted granted Critical
Publication of CN1181713C publication Critical patent/CN1181713C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits
CNB99816528XA 1999-03-26 1999-11-18 在制作印制电路板的过程中处理金属包裹层压板的处理方法和系统 Expired - Fee Related CN1181713C (zh)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP83467/1999 1999-03-26
JP83467/99 1999-03-26
JP11083467A JP2000271942A (ja) 1999-03-26 1999-03-26 シート状樹脂成形基材の端部処理装置
JP147346/1999 1999-05-26
JP147346/99 1999-05-26
JP14734699A JP2000340927A (ja) 1999-05-26 1999-05-26 内層用回路板の製造方法及び多層積層板及び多層積層板の製造方法
JP211423/99 1999-07-27
JP211423/1999 1999-07-27
JP21142399A JP2001031305A (ja) 1999-07-27 1999-07-27 内層用回路板の巻取り装置

Publications (2)

Publication Number Publication Date
CN1339244A CN1339244A (zh) 2002-03-06
CN1181713C true CN1181713C (zh) 2004-12-22

Family

ID=27304231

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB99816528XA Expired - Fee Related CN1181713C (zh) 1999-03-26 1999-11-18 在制作印制电路板的过程中处理金属包裹层压板的处理方法和系统

Country Status (2)

Country Link
CN (1) CN1181713C (fr)
WO (1) WO2000059275A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005077955A (ja) * 2003-09-02 2005-03-24 Sanyo Electric Co Ltd エッチング方法およびそれを用いた回路装置の製造方法
CN101841971B (zh) * 2010-04-06 2012-07-18 周伟 挠性电路板的层压用辅助材料及挠性电路板的层压工艺
KR101449984B1 (ko) * 2013-05-02 2014-10-15 주식회사 티지오테크 금속 봉지부 제조방법
CN106954344B (zh) * 2017-04-19 2023-08-29 湖北永创鑫电子有限公司 柔性线路板模切生产线
CN107539816B (zh) * 2017-07-04 2019-06-21 芜湖市亿仑电子有限公司 一种金属化薄膜自动输送夹紧装置
JP6831571B2 (ja) * 2017-08-09 2021-02-17 株式会社ミヤコシ 連続ラベル用紙の抜き粕巻取り装置および抜き粕巻取り方法
CN110371724B (zh) * 2019-06-18 2020-07-03 淮安信息职业技术学院 一种微牵伸自动柔性放卷装置及其放料方法
CN110642052B (zh) * 2019-09-19 2021-09-07 中建材创新科技研究院有限公司 一种接纸机的自动换卷运算控制装置及控制方法
JP2022164445A (ja) * 2021-04-16 2022-10-27 新光電気工業株式会社 レジスト層の形成方法、配線基板の製造方法及びレジスト層の形成装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57197891A (en) * 1981-05-29 1982-12-04 Asahi Chemical Ind Method and device for thermally press-bonding photosensitive dry film resist for producing printed circuit board
JPS62104095A (ja) * 1985-10-30 1987-05-14 東洋紡績株式会社 プリント基板の製造装置
JPH01125644U (fr) * 1988-02-10 1989-08-28
JPH02237094A (ja) * 1989-03-09 1990-09-19 Sanyo Electric Co Ltd 混成集積回路の製造方法
JP3341364B2 (ja) * 1993-06-14 2002-11-05 イビデン株式会社 面状体への貼着剤の接着方法及び装置
JPH10115912A (ja) * 1996-10-09 1998-05-06 Dainippon Printing Co Ltd 感光性ドライフィルムレジストのラミネート方法

Also Published As

Publication number Publication date
WO2000059275A1 (fr) 2000-10-05
CN1339244A (zh) 2002-03-06

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