CN1181620A - 引线键合方法 - Google Patents

引线键合方法 Download PDF

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CN1181620A
CN1181620A CN97120681A CN97120681A CN1181620A CN 1181620 A CN1181620 A CN 1181620A CN 97120681 A CN97120681 A CN 97120681A CN 97120681 A CN97120681 A CN 97120681A CN 1181620 A CN1181620 A CN 1181620A
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lead
adhesive tape
bonding
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石川信久
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Abstract

在把金属丝键合于由工件夹夹紧的内引线的键合区上之前,先把胶带贴在内引线的夹紧区(夹紧位置)上,使之至少覆盖两相邻内引线。然后,在至少两相邻内引线通过胶带被工件夹夹紧的状态下,将金属丝键合于键合区上。根据此引线键合法,可以防止引线键合时键合区位移,从而提高键合位置的定位精度。

Description

引线键合方法
本发明涉及一种封装半导体器件时进行的引线键合的方法。
作为封装半导体器件的步骤之一是把金属丝键合到引线框的内引线上，这种引线键合步骤是众所周知的。
图1是现有技术的引线框基本部分的平面图，示出了内引线和安装半导体器件的管芯焊盘之间的位置关系，图2是展示图1所示内引线的夹紧状态的剖面图。
参见图1，参考数字50一般表示引线框。引线框50具有多根内引线51和用于安装半导体器件的管芯焊盘52。管芯焊盘52被内引线51的内端包围着。每根内引线51的内端部分形成为引线键合区(此后简称为键合区)51a，其上镀有银(Ag)或金(Au)。而且，键合区51a外侧上的每根内引线51的那部分形成为键合头加压部位(此后称之后为夹紧区)51b，用于在键合引线时夹紧内引线51。
另外，胶带53贴在内引线51的夹紧区51b外侧部分上。胶带53用于防止内引线51的键合区51a发生的摆动，所以胶带53沿管芯焊盘52的外围设置，以便盖在多根内引线51上。
近年来，随着所安装的半导体器件的集成度提高，所需的内引线数也已增加，因此，需很精细地形成内引线。例如，每根内引线的厚度为0.125mm，如图3所示，每根内引线51的键合区51a的宽度W为0.1mm，相邻内引线51的键合区51a间的间距P为0.08mm。另一方面，在把用于毛细管作为引线键合的键合头压到键合区51a上时，例如必须确保圆形区51c的直径为约80μm。
在进行引线键合时，用工件夹61把内引线51的夹紧区51b(见图1)压到热块(heat block)62上，如图2和3所示，从而夹紧内引线51，防止键合区51a位移。在这种夹紧状态下，通过加热、加压、超声振动等把金属丝键合到键合区51a上。
然而，工件夹61和热块62与内引线51接触的表面分别由树脂和金属构成，且内引线51由金属构成。因此，即使内引线51夹在工件夹61和热块62之间，内引线51与工件夹61间和内引线51与热块62间的摩擦力也很小。其结果是，在引线键合时，把毛细管压到键合区51a上，使得每根内引线51经受冲击或超声振动，邻近正在进行引线键合的上述内引线51的内端容易发生侧滑，如图3中虚线所示，导致键合位置的定位准确性降低。
一般情况下，通过图象处理等预先识别所有内引线51的键合区51a的位置，然后根据该位置标识进行引线键合。因此，位置识别后内引线51的键合区51a发生的位移会影响引线键合的精度。
因此，本发明的目的是提供一种引线键合方法，该方法能够防止内引线的键合区位移，从而提高键合位置的定位精度。
按照本发明提供的引线键合方法包括以下步骤：利用工件夹在夹紧位置夹紧多根内引线，并在封装半导体器件时把金属丝键合到被所述工件夹夹紧的所述内引线的键合区上；其改进包括以下步骤：预先在所述内引线的所述夹紧位置贴上胶带，使之至少覆盖两根相邻的所述内引线，在所述至少两根相邻内引线被所述工件夹通过所述胶带夹紧的状态下，把所述金属丝键合到所述键合区上。
按本发明的引线键合方法，在内引线的夹紧位置预先贴上胶带，从而预先固定内引线。然后，在内引线被工件夹通过胶带夹紧的条件下，把金属丝键合到内引线的键合区上。因此，在更牢地固定了内引线的条件下进行引线键合。结果是，即使在引线键合步骤中，把键合头压在键合区上，任何一根内引线经受冲击或超声振动，邻近上述正在进行引线键合的内引线的内引线内端也不会侧滑，从而防止了键合区的位移。
结合以下的详细说明、所附权利要求书及各附图会更充分地理解本发明的其它目的和特征。
图1是现有技术引线框基本部分的平面图，示出了内引线和管芯焊盘间的位置关系；
图2是展示引线键合过程中图1所示内引线的夹紧状态的剖面图；
图3是展示现有技术中存在的问题的平面图；
图4A是展示本发明引线键合方法的优选实施例的平面图，示出了胶带的粘贴情况；
图4B是该优选实施例中基本部分的剖面图，示出了引线键合过程中内引线的夹紧状态；
图5是图4A中基本部分的剖面图；
图6是图4B的平面图。
下面结合附图说明本发明引线键合方法的优选实施例。
图4A和4B是展示该优选实施例的引线键合方法的示意图，图5是图4A中基本部分的剖面图，图6是图4B的平面图。
本发明的引线键合法在夹紧内引线的状态下将金属丝键合到内引线的键合区上。
按该优选实施例，在引线键合前，如图4A所示，把胶带13贴到引线框10的多根内引线11上。
用于该优选实施例的引线框10具有多根内引线11和管芯焊盘12，管芯焊盘12位于半导体器件安装位置处，并被内引线11的内端包围着。每根内引线11的内端部分构成为键合区11a，其上镀有Ag或Au，每根内引线11在键合区11a外侧上的那部分构成为键合头加压位置(此后称之为夹紧区)11b，用于在引线键合时夹紧所有内引线11。即，夹紧区11b设置成沿管芯焊盘12的外围延伸的带状。
按该优选实施例，在内引线11的夹紧区11a上预先贴上胶带13。例如，在键合区11a的长度从每根内引线11的内端到其外侧为约1mm，且夹紧区11b的内侧缘定位成离每根内引线11的内端约1.1～1.5mm，贴胶带13的位置设置成胶带13的内侧缘离每根内引线11的内端约1.1～1.5mm。
如图4A所示，沿管芯焊盘12的外围连续设置胶带13，使之覆盖于所有内引线11上。
而且，如图6所示，胶带13的宽度W2大于用于夹紧内引线11的工件夹61的宽度W1，其原因此后说明。例如，在工件夹61的宽度W1约为1.4mm时，胶带13的宽度设定为约2mm。而且，在工件夹61的横向中心设置成与紧夹内引线11的夹紧区11b的横向中心基本一致时，最好将胶带13的横向中心与贴胶带13的夹紧区11b的横向中心基本一致。
胶带13由能耐引线键合时产生的热的绝缘材料构成。例如，用由聚酰亚胺构成的胶带作胶带13。胶带13的与要键合到内引线11上的表面相反的上表面无粘性。
如图5所示，可以通过胶带13把内引线11牢固地定位。
贴了胶带13后，只从胶带13的上部用工件夹61对内引线11加压，将其夹紧于热块62上，如图4B和6所示。在此夹紧条件下，利用如毛细管等键合头，通过加热，加压、超声振动等，把金属丝键合到键合区11a上。
如上所述胶带13的宽度W2设置成大于工件夹61的宽度W1的原因是为了确保工件夹61可以仅从上部夹紧在胶带13上的任何位置。特别是，通过使工件夹61的横向中心与胶带13的横向中心基本一致。在工件夹61的横向相对侧缘与胶带13的横向相对侧缘间提供侧边距。这样一来，即使工件夹61的夹紧位置横向移动，也可以由工件夹61通过胶带13可靠地夹紧内引线11。所以，在工件夹61的横向中心设置成与夹紧内引线11的夹紧区11b的横向中心基本一致时，最好使胶带13的横向中心与夹紧区11b的横向中心一致。
胶带13一直贴在内引线11上，直到完成了引线键合步骤后的模制步骤为止。即，胶带13与安装于引线框10上的半导体器件一起进行模制。由于胶带13具有绝缘特性，所以即使与半导体器件一起模制后也不会对所得封装产生影响。
根据上述优选实施例的引线键合方法，胶带13预先贴在夹紧区11b上，并且只在胶带13上部由工件夹61夹紧内引线11，以便接下来把金属丝键合到内引线11上。因此，可以在被工件夹61加强了胶带13对内引线11的夹紧区11b的固定的条件下，进行引线键合。其结果是，即使在引线键合步骤把键合头压到键合区11b上时任何一根内引线11经受冲击或超声振动，邻近上述正在引线键合的内引线11的内端也不会发生侧滑，从而防止了键合区11b的位移。
而且，由于只从胶带13上部夹紧内引线11，可以均匀地夹紧内引线11。结果，可以解决由于内引线11的不均匀夹紧造成的内引线11的内端上下摆动的问题，不会导致引线键合可靠性下降。
另外，由于内引线11上预先贴了胶带13，所以可以防止引线键合时键合区11a摆动。此外，胶带13一直贴在内引线11上，直到完成模制步骤为止。所以，在制备引线框10时在内引线11上贴上胶带13，可以从制备引线框10直到完成模制步骤为止的整个过程中防止键合区11a摆动。
而且，不必分离胶带13。因此，即使在半导体器件封装时应用此优选实施例的引线键合法，也不会因此而增加封装的步骤数。
根据此优选实施例的引线键合法，可以提高键合位置的定位精度，从而实现高精度引线键合，获得具有高可靠性地连接金属丝和内引线11的半导体封装。
尽管上述优选实施例中沿管芯焊盘的外围连续设置胶带使之覆盖在所有多根内引线上，但这种构型只是示例性的，可以提供各种变形，本发明的胶带可以贴到夹紧位置上，以便至少覆盖两相邻的内引线。例如，可以相应于管芯焊盘的一侧或两侧设置胶带，使之覆盖于多根内引线上。另外，胶带可以设置成覆盖于三根并列的内引线上。
尽管以上结合特定实施例描述了本发明，但以上说明只是说明性的，并不构成对本发明范围的限定。在不脱离由所附权利要求书限定的发明范围和精神实质的情况下，本领域的普通技术人员可以做出各种变形和变化。

Claims (4)

1、一种引线键合方法，包括以下步骤：利用工件在夹紧位置夹紧多根内引线，在封装半导体器件的过程中，把金属丝键合到被所述工件夹夹紧的所述内引线的键合区；其改进包括以下步骤：预先把胶带贴到所述内引线的所述夹紧位置，使之至少覆盖在两相邻的所述内引线上，由此在所述至少两相邻内引线通过所述胶带被所述工件夹夹紧的状态下，将所述金属丝键合于所述键合区上。
2、根据权利要求1的引线键合方法，其中把要粘贴的所述胶带的位置设定成使所述胶带的内侧缘位于离每根所述内引线的内端约1.1～1.5mm处。
3、根据权利要求1的引线键合方法，其中所述胶带的宽度大于所述工件夹的宽度。
4、根据权利要求1的引线键合方法，其中所述胶带由具有耐热性的绝缘材料形成。
CN97120681A 1996-09-11 1997-09-11 引线键合方法 Pending CN1181620A (zh)

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