CN117999516A - 感光性树脂组合物、干膜、固化物和印刷布线板 - Google Patents
感光性树脂组合物、干膜、固化物和印刷布线板 Download PDFInfo
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- CN117999516A CN117999516A CN202280064998.4A CN202280064998A CN117999516A CN 117999516 A CN117999516 A CN 117999516A CN 202280064998 A CN202280064998 A CN 202280064998A CN 117999516 A CN117999516 A CN 117999516A
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- photosensitive resin
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- type epoxy
- epoxy resin
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- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- JNELGWHKGNBSMD-UHFFFAOYSA-N xanthone powder Natural products C1=CC=C2C(=O)C3=CC=CC=C3OC2=C1 JNELGWHKGNBSMD-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical class O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021159246 | 2021-09-29 | ||
JP2021-159246 | 2021-09-29 | ||
PCT/JP2022/036285 WO2023054523A1 (ja) | 2021-09-29 | 2022-09-28 | 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板 |
Publications (1)
Publication Number | Publication Date |
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CN117999516A true CN117999516A (zh) | 2024-05-07 |
Family
ID=85780707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202280064998.4A Pending CN117999516A (zh) | 2021-09-29 | 2022-09-28 | 感光性树脂组合物、干膜、固化物和印刷布线板 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7445095B2 (ja) |
CN (1) | CN117999516A (ja) |
WO (1) | WO2023054523A1 (ja) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3876709B2 (ja) | 2001-12-25 | 2007-02-07 | 三菱電機株式会社 | 液状熱硬化性樹脂組成物、並びに液状熱硬化性樹脂組成物の製造方法と絶縁コイルの製造方法 |
JP4562761B2 (ja) | 2007-09-21 | 2010-10-13 | 日本化薬株式会社 | 新規不飽和基含有ポリカルボン酸樹脂、樹脂組成物及びその硬化物 |
WO2009147938A1 (ja) | 2008-06-02 | 2009-12-10 | 株式会社カネカ | 新規な樹脂組成物及びその利用 |
KR20180042841A (ko) | 2015-08-17 | 2018-04-26 | 히타치가세이가부시끼가이샤 | 복합 재료, 솔더 레지스트용 감광성 수지 조성물 및 감광성 엘리먼트 |
JP6759323B2 (ja) | 2018-03-28 | 2020-09-23 | 太陽インキ製造株式会社 | 感光性樹脂組成物、2液型感光性樹脂組成物、ドライフィルムおよびプリント配線板 |
-
2022
- 2022-09-28 JP JP2023551806A patent/JP7445095B2/ja active Active
- 2022-09-28 CN CN202280064998.4A patent/CN117999516A/zh active Pending
- 2022-09-28 WO PCT/JP2022/036285 patent/WO2023054523A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2023054523A1 (ja) | 2023-04-06 |
JPWO2023054523A1 (ja) | 2023-04-06 |
JP7445095B2 (ja) | 2024-03-06 |
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