CN117979674A - 一种吸波气凝胶材料及其制备方法和在pmi吸波泡沫制备中的应用 - Google Patents
一种吸波气凝胶材料及其制备方法和在pmi吸波泡沫制备中的应用 Download PDFInfo
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- CN117979674A CN117979674A CN202410393539.1A CN202410393539A CN117979674A CN 117979674 A CN117979674 A CN 117979674A CN 202410393539 A CN202410393539 A CN 202410393539A CN 117979674 A CN117979674 A CN 117979674A
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- wave
- absorbing
- aerogel material
- silicon source
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- 239000004964 aerogel Substances 0.000 title claims abstract description 108
- 239000000463 material Substances 0.000 title claims abstract description 62
- 239000006260 foam Substances 0.000 title claims abstract description 35
- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 55
- 239000002131 composite material Substances 0.000 claims abstract description 54
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 50
- 239000010703 silicon Substances 0.000 claims abstract description 50
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 49
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 39
- 238000010438 heat treatment Methods 0.000 claims abstract description 38
- 230000006698 induction Effects 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims abstract description 35
- 239000000843 powder Substances 0.000 claims abstract description 33
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- 239000011261 inert gas Substances 0.000 claims abstract description 5
- 238000002791 soaking Methods 0.000 claims abstract description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 48
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 48
- 239000006096 absorbing agent Substances 0.000 claims description 39
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 31
- 239000004917 carbon fiber Substances 0.000 claims description 31
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical group C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 31
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- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Natural products CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 21
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 18
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 18
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 18
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- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 9
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- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 8
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 claims description 7
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 7
- 229920002873 Polyethylenimine Polymers 0.000 claims description 6
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- 235000006408 oxalic acid Nutrition 0.000 claims description 6
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- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 claims description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 229920006934 PMI Polymers 0.000 claims 2
- 239000006185 dispersion Substances 0.000 abstract description 6
- 238000005265 energy consumption Methods 0.000 abstract description 2
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 18
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- QMQXDJATSGGYDR-UHFFFAOYSA-N methylidyneiron Chemical compound [C].[Fe] QMQXDJATSGGYDR-UHFFFAOYSA-N 0.000 description 5
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- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
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- 239000002243 precursor Substances 0.000 description 2
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 239000004604 Blowing Agent Substances 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
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- 229910021529 ammonia Inorganic materials 0.000 description 1
- -1 and in view of cost Chemical compound 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- ADCXHZZSUADYMI-UHFFFAOYSA-N cadmium lithium Chemical compound [Li].[Cd] ADCXHZZSUADYMI-UHFFFAOYSA-N 0.000 description 1
- OJIJEKBXJYRIBZ-UHFFFAOYSA-N cadmium nickel Chemical compound [Ni].[Cd] OJIJEKBXJYRIBZ-UHFFFAOYSA-N 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- 239000006261 foam material Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000012767 functional filler Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 210000000987 immune system Anatomy 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000002505 iron Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- KUJOABUXCGVGIY-UHFFFAOYSA-N lithium zinc Chemical compound [Li].[Zn] KUJOABUXCGVGIY-UHFFFAOYSA-N 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/36—After-treatment
- C08J9/40—Impregnation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/36—After-treatment
- C08J9/40—Impregnation
- C08J9/42—Impregnation with macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2333/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2333/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2401/00—Characterised by the use of cellulose, modified cellulose or cellulose derivatives
- C08J2401/08—Cellulose derivatives
- C08J2401/26—Cellulose ethers
- C08J2401/28—Alkyl ethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
- C08J2433/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
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CN202410393539.1A CN117979674B (zh) | 2024-04-02 | 2024-04-02 | 一种吸波气凝胶材料及其制备方法和在pmi吸波泡沫制备中的应用 |
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CN117979674A true CN117979674A (zh) | 2024-05-03 |
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Citations (16)
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JPS58104010A (ja) * | 1981-12-11 | 1983-06-21 | Central Glass Co Ltd | 炭化珪素粉末の製造法 |
CN104592452A (zh) * | 2015-01-19 | 2015-05-06 | 洛阳理工学院 | 一种高接枝率聚丙烯改性料的制备方法 |
KR101627371B1 (ko) * | 2015-02-24 | 2016-06-07 | 한국과학기술연구원 | 입도 조절이 가능한 탄화규소 분말의 제조방법 |
CN106608730A (zh) * | 2015-10-26 | 2017-05-03 | 沈阳拓荆科技有限公司 | 碳基Si-C-O气凝胶隔热复合材料及其制备方法 |
CN107634190A (zh) * | 2017-08-14 | 2018-01-26 | 天津大学 | 一种通过高温热处理制备二氧化硅与碳复合材料的方法 |
CN108441166A (zh) * | 2017-12-21 | 2018-08-24 | 哈尔滨工业大学(威海) | 一种锂铝硅微晶玻璃/碳化硅/碳纤维三元复合吸波材料及其制备方法 |
CN110898772A (zh) * | 2019-11-13 | 2020-03-24 | 郭嘉川 | 复合有机气凝胶的制备方法及其用途 |
CN113403032A (zh) * | 2021-07-13 | 2021-09-17 | 衢州市智能制造技术与装备研究院 | 一种碳化硅复合材料的制备方法 |
CN114436674A (zh) * | 2022-02-11 | 2022-05-06 | 洛阳理工学院 | 一种网络状碳化硅纤维的制备方法 |
CN114466580A (zh) * | 2022-01-06 | 2022-05-10 | 西北工业大学 | 一种碳化硅/碳化铪纳米线改性碳化硅涂层增强石墨烯蜂窝基纳米气凝胶隔热吸波复合材料 |
CN114890770A (zh) * | 2022-05-31 | 2022-08-12 | 哈尔滨工业大学 | 一种多孔碳化硅/碳复合气凝胶的制备方法 |
CN115253938A (zh) * | 2022-08-10 | 2022-11-01 | 航天特种材料及工艺技术研究所 | 一种耐高温抗辐射弹性碳化硅纳米纤维气凝胶材料及其制备方法 |
CN115318210A (zh) * | 2022-08-11 | 2022-11-11 | 宿辉 | 一种电磁屏蔽用二硫化钴/多孔碳/碳化硅气凝胶复合材料的制备方法和应用 |
CN115605010A (zh) * | 2022-09-27 | 2023-01-13 | 刘莉(Cn) | 一种复合电磁吸收材料、制备方法及其应用 |
CN115745652A (zh) * | 2022-11-22 | 2023-03-07 | 西北工业大学太仓长三角研究院 | 一种轻质承载多功能SiC气凝胶复合材料及其制备方法 |
CN115925426A (zh) * | 2022-09-30 | 2023-04-07 | 成都飞机工业(集团)有限责任公司 | 一种气凝胶复合材料及其制备方法 |
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2024
- 2024-04-02 CN CN202410393539.1A patent/CN117979674B/zh active Active
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58104010A (ja) * | 1981-12-11 | 1983-06-21 | Central Glass Co Ltd | 炭化珪素粉末の製造法 |
CN104592452A (zh) * | 2015-01-19 | 2015-05-06 | 洛阳理工学院 | 一种高接枝率聚丙烯改性料的制备方法 |
KR101627371B1 (ko) * | 2015-02-24 | 2016-06-07 | 한국과학기술연구원 | 입도 조절이 가능한 탄화규소 분말의 제조방법 |
CN106608730A (zh) * | 2015-10-26 | 2017-05-03 | 沈阳拓荆科技有限公司 | 碳基Si-C-O气凝胶隔热复合材料及其制备方法 |
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