CN1176779C - 一种无铅焊料及其制备方法 - Google Patents
一种无铅焊料及其制备方法 Download PDFInfo
- Publication number
- CN1176779C CN1176779C CNB011397292A CN01139729A CN1176779C CN 1176779 C CN1176779 C CN 1176779C CN B011397292 A CNB011397292 A CN B011397292A CN 01139729 A CN01139729 A CN 01139729A CN 1176779 C CN1176779 C CN 1176779C
- Authority
- CN
- China
- Prior art keywords
- lead
- solder
- free solder
- intermediate alloy
- smelting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003466 welding Methods 0.000 title description 5
- 239000000463 material Substances 0.000 title description 4
- 229910000679 solder Inorganic materials 0.000 claims abstract description 42
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 18
- 239000000956 alloy Substances 0.000 claims abstract description 18
- 230000008018 melting Effects 0.000 claims abstract description 17
- 238000002844 melting Methods 0.000 claims abstract description 17
- 238000003723 Smelting Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 6
- 238000005266 casting Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 235000003642 hunger Nutrition 0.000 claims 1
- 230000037351 starvation Effects 0.000 claims 1
- 230000002349 favourable effect Effects 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 238000009472 formulation Methods 0.000 abstract 2
- 239000000203 mixture Substances 0.000 abstract 2
- 238000013459 approach Methods 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 description 8
- 239000011701 zinc Substances 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 7
- 229910020836 Sn-Ag Inorganic materials 0.000 description 3
- 229910020988 Sn—Ag Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910020830 Sn-Bi Inorganic materials 0.000 description 2
- 229910020994 Sn-Zn Inorganic materials 0.000 description 2
- 229910018728 Sn—Bi Inorganic materials 0.000 description 2
- 229910009069 Sn—Zn Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 231100000614 poison Toxicity 0.000 description 2
- 230000007096 poisonous effect Effects 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000005491 wire drawing Methods 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010027439 Metal poisoning Diseases 0.000 description 1
- 229910052774 Proactinium Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910020935 Sn-Sb Inorganic materials 0.000 description 1
- 229910018956 Sn—In Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 229910008757 Sn—Sb Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003930 cognitive ability Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000003651 drinking water Substances 0.000 description 1
- 235000020188 drinking water Nutrition 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000003546 flue gas Substances 0.000 description 1
- 208000008127 lead poisoning Diseases 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 210000000653 nervous system Anatomy 0.000 description 1
- 230000001473 noxious effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Manufacture And Refinement Of Metals (AREA)
Abstract
Description
无铅焊料体系 | 机械性能 | 拉伸强度 | 蠕变特性 | 延展性 | 熔点 | 润湿性 | 成本 | 其它 |
Sn-Ag | 好 | 好 | 好 | 差 | 偏高30-40℃ | 差 | 高 | |
Sn-Zn | 好 | 好 | 好 | 差 | 易氧化、易腐蚀 | |||
Sn-In | 差 | 太高 | 极易氧化 | |||||
Sn-Bi | 好 | 好 | 差 | |||||
Sn-Sb | 差 | 稍有毒 |
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB011397292A CN1176779C (zh) | 2001-11-27 | 2001-11-27 | 一种无铅焊料及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB011397292A CN1176779C (zh) | 2001-11-27 | 2001-11-27 | 一种无铅焊料及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1421296A CN1421296A (zh) | 2003-06-04 |
CN1176779C true CN1176779C (zh) | 2004-11-24 |
Family
ID=4675367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011397292A Expired - Lifetime CN1176779C (zh) | 2001-11-27 | 2001-11-27 | 一种无铅焊料及其制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1176779C (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005102594A1 (ja) | 2004-04-21 | 2005-11-03 | Nec Corporation | はんだ及びそれを使用した実装品 |
CN1895837B (zh) * | 2005-07-12 | 2011-04-20 | 北京有色金属研究总院 | Sn-Cu-Cr无铅焊料及其制备方法 |
CN1313631C (zh) * | 2005-08-02 | 2007-05-02 | 马莒生 | 一种锡银铜镍铝系无铅焊料合金 |
CN100413634C (zh) * | 2005-12-12 | 2008-08-27 | 黄德欢 | 一种低熔点无铅焊锡 |
CN100364713C (zh) * | 2005-12-12 | 2008-01-30 | 黄德欢 | 一种Ag-Al-Cu-Ni-Sn系无铅焊锡 |
JP4807465B1 (ja) * | 2010-06-28 | 2011-11-02 | 住友金属鉱山株式会社 | Pbフリーはんだ合金 |
CN102166690A (zh) * | 2011-05-27 | 2011-08-31 | 东南大学 | 一种锡-锌基复合焊料 |
CN103894754A (zh) * | 2014-04-04 | 2014-07-02 | 河南科隆集团有限公司 | 一种含锡低温铜基钎料及其制备方法 |
CN104353840B (zh) * | 2014-11-25 | 2017-11-03 | 北京康普锡威科技有限公司 | 一种led用低成本无铅焊料合金粉末及其制备方法 |
CN105499830A (zh) * | 2016-03-04 | 2016-04-20 | 保定爱廸新能源股份有限公司 | 光伏焊带用Sn-Zn系无铅多元合金及其制备方法 |
CN110402181A (zh) * | 2018-12-13 | 2019-11-01 | 北京联金高新科技有限公司 | SnZn系无铅焊料及其制备方法 |
CN110883445B (zh) * | 2019-11-11 | 2022-01-18 | 江西理工大学 | 一种无铅锡焊料及其制备方法 |
-
2001
- 2001-11-27 CN CNB011397292A patent/CN1176779C/zh not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1421296A (zh) | 2003-06-04 |
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GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: GELINMEI HI-TECH CO., LTD., SHENZHEN Free format text: FORMER NAME OR ADDRESS: GELINMEI ENVIRONMENT MATERIAL CO., LTD., SHENZHEN Owner name: SHENZHEN CITY GELINMEI HIGH NEW TECHNOLOGY CO., LT Free format text: FORMER NAME OR ADDRESS: GELINMEI HI-TECH CO., LTD., SHENZHEN |
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CP03 | Change of name, title or address |
Address after: 518104, Shenzhen, Guangdong Province, Baoan District, Sha Wu Town, West Industrial Zone, No. 50 Patentee after: SHENZHEN GEM HIGH-TECH Co.,Ltd. Address before: 518104, Shenzhen, Guangdong Province, Baoan District, Sha Wu Town, West Industrial Zone, No. 50 Patentee before: Shenzhen Green Eco-Manufacture Hi-Tech Co.,Ltd. Address after: 518104, Shenzhen, Guangdong Province, Baoan District, Sha Wu Town, West Industrial Zone, No. 50 Patentee after: Shenzhen Green Eco-Manufacture Hi-Tech Co.,Ltd. Address before: 518101 science and Technology Museum, Longjing Road, Shenzhen, Guangdong, Baoan District B304 Patentee before: GELINMEI ENVIRONMENT MATERIAL |
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Effective date of registration: 20070716 Pledge (preservation): Pledge |
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PM01 | Change of the registration of the contract for pledge of patent right |
Change date: 20130131 Registration number: 2007440000367 Pledgee after: China Development Bank Co. Pledgee before: CHINA DEVELOPMENT BANK |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20130306 Granted publication date: 20041124 Pledgee: China Development Bank Co. Pledgor: SHENZHEN GEM HIGH-TECH Co.,Ltd. Registration number: 2007440000367 |
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PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Lead-free solder and preparation method thereof Effective date of registration: 20130724 Granted publication date: 20041124 Pledgee: China Development Bank Co. Pledgor: SHENZHEN GEM HIGH-TECH Co.,Ltd. Registration number: 2013990000502 |
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CP01 | Change in the name or title of a patent holder |
Address after: 518104, Shenzhen, Guangdong Province, Baoan District, Sha Wu Town, West Industrial Zone, No. 50 Patentee after: GEM Co.,Ltd. Address before: 518104, Shenzhen, Guangdong Province, Baoan District, Sha Wu Town, West Industrial Zone, No. 50 Patentee before: SHENZHEN GEM HIGH-TECH Co.,Ltd. |
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