CN117652209A - 用于制造和使用在其中形成有可变形导电材料的图案的电路组件的装置、系统和方法 - Google Patents

用于制造和使用在其中形成有可变形导电材料的图案的电路组件的装置、系统和方法 Download PDF

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Publication number
CN117652209A
CN117652209A CN202280030904.1A CN202280030904A CN117652209A CN 117652209 A CN117652209 A CN 117652209A CN 202280030904 A CN202280030904 A CN 202280030904A CN 117652209 A CN117652209 A CN 117652209A
Authority
CN
China
Prior art keywords
conductive material
layer
deformable conductive
pattern
circuit assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280030904.1A
Other languages
English (en)
Chinese (zh)
Inventor
马克·S·克鲁斯科夫
凯瑟琳·M·尼尔森
杰西·迈克尔·马丁内斯
奥斯汀·迈克尔·克拉克
马克·威廉·罗内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Liquid Wire Co
Original Assignee
Liquid Wire Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liquid Wire Co filed Critical Liquid Wire Co
Publication of CN117652209A publication Critical patent/CN117652209A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
CN202280030904.1A 2021-02-26 2022-02-25 用于制造和使用在其中形成有可变形导电材料的图案的电路组件的装置、系统和方法 Pending CN117652209A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163154665P 2021-02-26 2021-02-26
US63/154,665 2021-02-26
PCT/US2022/070853 WO2022183219A1 (en) 2021-02-26 2022-02-25 Devices, systems, and methods for making and using circuit assemblies having patterns of deformable conductive material formed therein

Publications (1)

Publication Number Publication Date
CN117652209A true CN117652209A (zh) 2024-03-05

Family

ID=83048507

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202280030904.1A Pending CN117652209A (zh) 2021-02-26 2022-02-25 用于制造和使用在其中形成有可变形导电材料的图案的电路组件的装置、系统和方法
CN202280030333.1A Pending CN117597744A (zh) 2021-02-26 2022-02-25 用于制造和使用高度可持续电路的装置、系统及方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202280030333.1A Pending CN117597744A (zh) 2021-02-26 2022-02-25 用于制造和使用高度可持续电路的装置、系统及方法

Country Status (5)

Country Link
US (2) US20240237205A9 (enExample)
EP (2) EP4298646A4 (enExample)
JP (2) JP2024516192A (enExample)
CN (2) CN117652209A (enExample)
WO (2) WO2022183217A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240387419A1 (en) * 2023-05-18 2024-11-21 Adeia Semiconductor Bonding Technologies Inc. Direct hybrid bond pad having tapered sidewall

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6320139B1 (en) * 1998-11-12 2001-11-20 Rockwell Automation Technologies, Inc. Reflow selective shorting
CN101370353A (zh) * 2007-05-23 2009-02-18 安迪克连接科技公司 具有导电浆料的电路化衬底
US20140138125A1 (en) * 2012-11-16 2014-05-22 Nippon Mektron, Ltd. Circuit board and method of manufacturing the same, touch panel sensor sheet and screen printing plate
KR101970911B1 (ko) * 2018-02-02 2019-04-22 영남대학교 산학협력단 도전 회로를 갖춘 굴곡성과 신축성의 기판의 제조 방법

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JPS56134404A (en) * 1980-03-24 1981-10-21 Sony Corp Conductive material and method of prdoducing same
JP2807135B2 (ja) 1992-10-05 1998-10-08 太陽誘電株式会社 積層セラミックインダクタの製造方法
JP3389872B2 (ja) * 1999-01-18 2003-03-24 株式会社村田製作所 電子部品の製造方法
US7401369B2 (en) 2005-04-14 2008-07-22 Nike, Inc. Fluid-filled bladder for footwear and other applications
PT103998B (pt) * 2008-03-20 2011-03-10 Univ Nova De Lisboa Dispositivos electrónicos e optoelectrónicos de efeito de campo compreendendo camadas de fibras naturais, sintéticas ou mistas e respectivo processo de fabrico
KR101214731B1 (ko) 2011-07-29 2012-12-21 삼성전기주식회사 적층형 인덕터 및 이의 제조 방법
US8842840B2 (en) 2011-11-03 2014-09-23 Arvind Gidwani Demand based encryption and key generation and distribution systems and methods
US10735408B2 (en) 2013-03-14 2020-08-04 Samsung Electronics Co., Ltd. Application connection for devices in a network
HUE057538T2 (hu) 2016-02-29 2022-05-28 Liquid Wire Inc Folyékony huzal
US10959326B2 (en) * 2017-11-07 2021-03-23 Dai Nippon Printing Co., Ltd. Stretchable circuit substrate and article
JP7119406B2 (ja) * 2018-02-13 2022-08-17 大日本印刷株式会社 伸縮性配線基板およびその製造方法
US10750618B2 (en) * 2018-04-18 2020-08-18 University Of Hawaii System and method for manufacture of circuit boards
CN110760676B (zh) * 2018-07-27 2021-07-20 中国科学院理化技术研究所 一种液态金属浆料中液态金属的回收方法
US11088063B2 (en) 2018-08-22 2021-08-10 Liquid Wire Inc. Structures with deformable conductors
EP3977524A4 (en) * 2019-05-28 2023-11-08 Liquid Wire Inc. CONTINUOUS CONNECTIONS BETWEEN HETERGENEOUS MATERIALS
JP7402706B2 (ja) * 2020-02-10 2023-12-21 アオイ電子株式会社 発光装置の製造方法、および発光装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6320139B1 (en) * 1998-11-12 2001-11-20 Rockwell Automation Technologies, Inc. Reflow selective shorting
CN101370353A (zh) * 2007-05-23 2009-02-18 安迪克连接科技公司 具有导电浆料的电路化衬底
US20140138125A1 (en) * 2012-11-16 2014-05-22 Nippon Mektron, Ltd. Circuit board and method of manufacturing the same, touch panel sensor sheet and screen printing plate
KR101970911B1 (ko) * 2018-02-02 2019-04-22 영남대학교 산학협력단 도전 회로를 갖춘 굴곡성과 신축성의 기판의 제조 방법

Also Published As

Publication number Publication date
EP4298646A1 (en) 2024-01-03
EP4298873A1 (en) 2024-01-03
WO2022183219A1 (en) 2022-09-01
EP4298873A4 (en) 2025-04-23
CN117597744A (zh) 2024-02-23
JP2024518041A (ja) 2024-04-24
EP4298646A4 (en) 2025-03-26
WO2022183217A1 (en) 2022-09-01
US20240237205A9 (en) 2024-07-11
JP2024516192A (ja) 2024-04-12
US20240147631A1 (en) 2024-05-02
US20240138062A1 (en) 2024-04-25

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