JP2024516192A - 非常にサスティナブルな回路を製造または使用するための装置、システム、および方法 - Google Patents

非常にサスティナブルな回路を製造または使用するための装置、システム、および方法 Download PDF

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JP2024516192A
JP2024516192A JP2023565335A JP2023565335A JP2024516192A JP 2024516192 A JP2024516192 A JP 2024516192A JP 2023565335 A JP2023565335 A JP 2023565335A JP 2023565335 A JP2023565335 A JP 2023565335A JP 2024516192 A JP2024516192 A JP 2024516192A
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JP
Japan
Prior art keywords
conductive material
circuit assembly
layer
pattern
stack layer
Prior art date
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Pending
Application number
JP2023565335A
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English (en)
Japanese (ja)
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JP2024516192A5 (enExample
Inventor
イー． カルボ ジュニア ジョージ
スリニバス デサバシーナ サイ
アドベンチャー ホプキンス マイケル
ジェイ． キンゼル チャールズ
エス． クルスコフ マーク
マイケル マルティネス ジェシー
エム． ネルソン キャサリン
ブイ． ニューマン テイラー
アントニオ リベラ トレバー
ウィリアム ロナイ マーク
ジャスパー ワランス マイケル
マイケル クラーク オースティン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Liquid Wire Inc
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Liquid Wire Inc
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Filing date
Publication date
Application filed by Liquid Wire Inc filed Critical Liquid Wire Inc
Publication of JP2024516192A publication Critical patent/JP2024516192A/ja
Publication of JP2024516192A5 publication Critical patent/JP2024516192A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
JP2023565335A 2021-02-26 2022-02-25 非常にサスティナブルな回路を製造または使用するための装置、システム、および方法 Pending JP2024516192A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163154665P 2021-02-26 2021-02-26
US63/154,665 2021-02-26
PCT/US2022/070850 WO2022183217A1 (en) 2021-02-26 2022-02-25 Devices, systems, and methods for making and using highly sustainable circuits

Publications (2)

Publication Number Publication Date
JP2024516192A true JP2024516192A (ja) 2024-04-12
JP2024516192A5 JP2024516192A5 (enExample) 2025-03-05

Family

ID=83048507

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023565335A Pending JP2024516192A (ja) 2021-02-26 2022-02-25 非常にサスティナブルな回路を製造または使用するための装置、システム、および方法
JP2023565336A Pending JP2024518041A (ja) 2021-02-26 2022-02-25 変形導電性材料パターンが形成された回路アセンブリを製造および使用するための装置、システム、および方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023565336A Pending JP2024518041A (ja) 2021-02-26 2022-02-25 変形導電性材料パターンが形成された回路アセンブリを製造および使用するための装置、システム、および方法

Country Status (5)

Country Link
US (2) US20240237205A9 (enExample)
EP (2) EP4298646A4 (enExample)
JP (2) JP2024516192A (enExample)
CN (2) CN117652209A (enExample)
WO (2) WO2022183217A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240387419A1 (en) * 2023-05-18 2024-11-21 Adeia Semiconductor Bonding Technologies Inc. Direct hybrid bond pad having tapered sidewall

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000208543A (ja) * 1999-01-18 2000-07-28 Murata Mfg Co Ltd 電子部品の製造方法
US20200381349A1 (en) * 2019-05-28 2020-12-03 Liquid Wire Inc. Continuous Interconnects Between Heterogeneous Materials
JP2021128950A (ja) * 2020-02-10 2021-09-02 アオイ電子株式会社 発光装置の製造方法、および発光装置

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JP2807135B2 (ja) 1992-10-05 1998-10-08 太陽誘電株式会社 積層セラミックインダクタの製造方法
US6320139B1 (en) * 1998-11-12 2001-11-20 Rockwell Automation Technologies, Inc. Reflow selective shorting
US7401369B2 (en) 2005-04-14 2008-07-22 Nike, Inc. Fluid-filled bladder for footwear and other applications
US8063315B2 (en) * 2005-10-06 2011-11-22 Endicott Interconnect Technologies, Inc. Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate
PT103998B (pt) * 2008-03-20 2011-03-10 Univ Nova De Lisboa Dispositivos electrónicos e optoelectrónicos de efeito de campo compreendendo camadas de fibras naturais, sintéticas ou mistas e respectivo processo de fabrico
KR101214731B1 (ko) 2011-07-29 2012-12-21 삼성전기주식회사 적층형 인덕터 및 이의 제조 방법
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JP6004907B2 (ja) * 2012-11-16 2016-10-12 日本メクトロン株式会社 配線基板およびタッチパネルセンサシート
US10735408B2 (en) 2013-03-14 2020-08-04 Samsung Electronics Co., Ltd. Application connection for devices in a network
HUE057538T2 (hu) 2016-02-29 2022-05-28 Liquid Wire Inc Folyékony huzal
US10959326B2 (en) * 2017-11-07 2021-03-23 Dai Nippon Printing Co., Ltd. Stretchable circuit substrate and article
KR101970911B1 (ko) * 2018-02-02 2019-04-22 영남대학교 산학협력단 도전 회로를 갖춘 굴곡성과 신축성의 기판의 제조 방법
JP7119406B2 (ja) * 2018-02-13 2022-08-17 大日本印刷株式会社 伸縮性配線基板およびその製造方法
US10750618B2 (en) * 2018-04-18 2020-08-18 University Of Hawaii System and method for manufacture of circuit boards
CN110760676B (zh) * 2018-07-27 2021-07-20 中国科学院理化技术研究所 一种液态金属浆料中液态金属的回收方法
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Publication number Priority date Publication date Assignee Title
JP2000208543A (ja) * 1999-01-18 2000-07-28 Murata Mfg Co Ltd 電子部品の製造方法
US20200381349A1 (en) * 2019-05-28 2020-12-03 Liquid Wire Inc. Continuous Interconnects Between Heterogeneous Materials
JP2022534502A (ja) * 2019-05-28 2022-08-01 リキッド ワイヤ インコーポレイテッド 異種材料間の連続した相互接続部
JP2021128950A (ja) * 2020-02-10 2021-09-02 アオイ電子株式会社 発光装置の製造方法、および発光装置

Also Published As

Publication number Publication date
EP4298646A1 (en) 2024-01-03
EP4298873A1 (en) 2024-01-03
WO2022183219A1 (en) 2022-09-01
EP4298873A4 (en) 2025-04-23
CN117597744A (zh) 2024-02-23
JP2024518041A (ja) 2024-04-24
EP4298646A4 (en) 2025-03-26
WO2022183217A1 (en) 2022-09-01
US20240237205A9 (en) 2024-07-11
US20240147631A1 (en) 2024-05-02
CN117652209A (zh) 2024-03-05
US20240138062A1 (en) 2024-04-25

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