JP2024516192A5 - - Google Patents
Info
- Publication number
- JP2024516192A5 JP2024516192A5 JP2023565335A JP2023565335A JP2024516192A5 JP 2024516192 A5 JP2024516192 A5 JP 2024516192A5 JP 2023565335 A JP2023565335 A JP 2023565335A JP 2023565335 A JP2023565335 A JP 2023565335A JP 2024516192 A5 JP2024516192 A5 JP 2024516192A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive material
- path pattern
- deformable conductive
- stack layer
- circuit assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163154665P | 2021-02-26 | 2021-02-26 | |
| US63/154,665 | 2021-02-26 | ||
| PCT/US2022/070850 WO2022183217A1 (en) | 2021-02-26 | 2022-02-25 | Devices, systems, and methods for making and using highly sustainable circuits |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024516192A JP2024516192A (ja) | 2024-04-12 |
| JP2024516192A5 true JP2024516192A5 (enExample) | 2025-03-05 |
Family
ID=83048507
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023565336A Pending JP2024518041A (ja) | 2021-02-26 | 2022-02-25 | 変形導電性材料パターンが形成された回路アセンブリを製造および使用するための装置、システム、および方法 |
| JP2023565335A Pending JP2024516192A (ja) | 2021-02-26 | 2022-02-25 | 非常にサスティナブルな回路を製造または使用するための装置、システム、および方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023565336A Pending JP2024518041A (ja) | 2021-02-26 | 2022-02-25 | 変形導電性材料パターンが形成された回路アセンブリを製造および使用するための装置、システム、および方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US20240147631A1 (enExample) |
| EP (2) | EP4298646A4 (enExample) |
| JP (2) | JP2024518041A (enExample) |
| CN (2) | CN117597744A (enExample) |
| WO (2) | WO2022183217A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20240387419A1 (en) * | 2023-05-18 | 2024-11-21 | Adeia Semiconductor Bonding Technologies Inc. | Direct hybrid bond pad having tapered sidewall |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56134404A (en) * | 1980-03-24 | 1981-10-21 | Sony Corp | Conductive material and method of prdoducing same |
| JP2807135B2 (ja) | 1992-10-05 | 1998-10-08 | 太陽誘電株式会社 | 積層セラミックインダクタの製造方法 |
| US6320139B1 (en) * | 1998-11-12 | 2001-11-20 | Rockwell Automation Technologies, Inc. | Reflow selective shorting |
| JP3389872B2 (ja) * | 1999-01-18 | 2003-03-24 | 株式会社村田製作所 | 電子部品の製造方法 |
| US7401369B2 (en) | 2005-04-14 | 2008-07-22 | Nike, Inc. | Fluid-filled bladder for footwear and other applications |
| US8063315B2 (en) * | 2005-10-06 | 2011-11-22 | Endicott Interconnect Technologies, Inc. | Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate |
| PT103998B (pt) * | 2008-03-20 | 2011-03-10 | Univ Nova De Lisboa | Dispositivos electrónicos e optoelectrónicos de efeito de campo compreendendo camadas de fibras naturais, sintéticas ou mistas e respectivo processo de fabrico |
| KR101214731B1 (ko) | 2011-07-29 | 2012-12-21 | 삼성전기주식회사 | 적층형 인덕터 및 이의 제조 방법 |
| US8842840B2 (en) | 2011-11-03 | 2014-09-23 | Arvind Gidwani | Demand based encryption and key generation and distribution systems and methods |
| JP6004907B2 (ja) * | 2012-11-16 | 2016-10-12 | 日本メクトロン株式会社 | 配線基板およびタッチパネルセンサシート |
| US10735408B2 (en) | 2013-03-14 | 2020-08-04 | Samsung Electronics Co., Ltd. | Application connection for devices in a network |
| EP3975204B1 (en) | 2016-02-29 | 2024-06-12 | Liquid Wire Inc. | Liquid wire |
| EP3709775B1 (en) * | 2017-11-07 | 2025-07-02 | Dai Nippon Printing Co., Ltd. | Stretchable circuit substrate and article |
| KR101970911B1 (ko) * | 2018-02-02 | 2019-04-22 | 영남대학교 산학협력단 | 도전 회로를 갖춘 굴곡성과 신축성의 기판의 제조 방법 |
| JP7119406B2 (ja) * | 2018-02-13 | 2022-08-17 | 大日本印刷株式会社 | 伸縮性配線基板およびその製造方法 |
| US10750618B2 (en) * | 2018-04-18 | 2020-08-18 | University Of Hawaii | System and method for manufacture of circuit boards |
| CN110760676B (zh) * | 2018-07-27 | 2021-07-20 | 中国科学院理化技术研究所 | 一种液态金属浆料中液态金属的回收方法 |
| EP3841850A4 (en) * | 2018-08-22 | 2022-10-26 | Liquid Wire Inc. | STRUCTURES WITH DEFORMABLE LADDERS |
| EP3977524A4 (en) * | 2019-05-28 | 2023-11-08 | Liquid Wire Inc. | CONTINUOUS CONNECTIONS BETWEEN HETERGENEOUS MATERIALS |
| JP7402706B2 (ja) * | 2020-02-10 | 2023-12-21 | アオイ電子株式会社 | 発光装置の製造方法、および発光装置 |
-
2022
- 2022-02-25 JP JP2023565336A patent/JP2024518041A/ja active Pending
- 2022-02-25 EP EP22760631.6A patent/EP4298646A4/en active Pending
- 2022-02-25 EP EP22760632.4A patent/EP4298873A4/en active Pending
- 2022-02-25 CN CN202280030333.1A patent/CN117597744A/zh active Pending
- 2022-02-25 WO PCT/US2022/070850 patent/WO2022183217A1/en not_active Ceased
- 2022-02-25 JP JP2023565335A patent/JP2024516192A/ja active Pending
- 2022-02-25 US US18/279,175 patent/US20240147631A1/en active Pending
- 2022-02-25 CN CN202280030904.1A patent/CN117652209A/zh active Pending
- 2022-02-25 WO PCT/US2022/070853 patent/WO2022183219A1/en not_active Ceased
- 2022-02-25 US US18/548,211 patent/US20240237205A9/en active Pending
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