JP2024518041A - 変形導電性材料パターンが形成された回路アセンブリを製造および使用するための装置、システム、および方法 - Google Patents

変形導電性材料パターンが形成された回路アセンブリを製造および使用するための装置、システム、および方法 Download PDF

Info

Publication number
JP2024518041A
JP2024518041A JP2023565336A JP2023565336A JP2024518041A JP 2024518041 A JP2024518041 A JP 2024518041A JP 2023565336 A JP2023565336 A JP 2023565336A JP 2023565336 A JP2023565336 A JP 2023565336A JP 2024518041 A JP2024518041 A JP 2024518041A
Authority
JP
Japan
Prior art keywords
conductive material
layer
circuit assembly
pattern
stack layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023565336A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024518041A5 (enExample
Inventor
エス． クルスコフ マーク
エム． ネルソン キャサリン
マイケル マルティネス ジェシー
マイケル クラーク オースティン
ウィリアム ロナイ マーク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Liquid Wire Inc
Original Assignee
Liquid Wire Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liquid Wire Inc filed Critical Liquid Wire Inc
Publication of JP2024518041A publication Critical patent/JP2024518041A/ja
Publication of JP2024518041A5 publication Critical patent/JP2024518041A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2023565336A 2021-02-26 2022-02-25 変形導電性材料パターンが形成された回路アセンブリを製造および使用するための装置、システム、および方法 Pending JP2024518041A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202163154665P 2021-02-26 2021-02-26
US63/154,665 2021-02-26
PCT/US2022/070853 WO2022183219A1 (en) 2021-02-26 2022-02-25 Devices, systems, and methods for making and using circuit assemblies having patterns of deformable conductive material formed therein

Publications (2)

Publication Number Publication Date
JP2024518041A true JP2024518041A (ja) 2024-04-24
JP2024518041A5 JP2024518041A5 (enExample) 2025-03-05

Family

ID=83048507

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023565336A Pending JP2024518041A (ja) 2021-02-26 2022-02-25 変形導電性材料パターンが形成された回路アセンブリを製造および使用するための装置、システム、および方法
JP2023565335A Pending JP2024516192A (ja) 2021-02-26 2022-02-25 非常にサスティナブルな回路を製造または使用するための装置、システム、および方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023565335A Pending JP2024516192A (ja) 2021-02-26 2022-02-25 非常にサスティナブルな回路を製造または使用するための装置、システム、および方法

Country Status (5)

Country Link
US (2) US20240147631A1 (enExample)
EP (2) EP4298646A4 (enExample)
JP (2) JP2024518041A (enExample)
CN (2) CN117597744A (enExample)
WO (2) WO2022183217A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240387419A1 (en) * 2023-05-18 2024-11-21 Adeia Semiconductor Bonding Technologies Inc. Direct hybrid bond pad having tapered sidewall

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019093069A1 (ja) * 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品
JP2019516208A (ja) * 2016-02-29 2019-06-13 リキッド ワイヤ エルエルシーＬｉｑｕｉｄ Ｗｉｒｅ Ｌｌｃ 液体ワイヤ
JP2019140292A (ja) * 2018-02-13 2019-08-22 大日本印刷株式会社 伸縮性配線基板およびその製造方法
US20200381349A1 (en) * 2019-05-28 2020-12-03 Liquid Wire Inc. Continuous Interconnects Between Heterogeneous Materials

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56134404A (en) * 1980-03-24 1981-10-21 Sony Corp Conductive material and method of prdoducing same
JP2807135B2 (ja) 1992-10-05 1998-10-08 太陽誘電株式会社 積層セラミックインダクタの製造方法
US6320139B1 (en) * 1998-11-12 2001-11-20 Rockwell Automation Technologies, Inc. Reflow selective shorting
JP3389872B2 (ja) * 1999-01-18 2003-03-24 株式会社村田製作所 電子部品の製造方法
US7401369B2 (en) 2005-04-14 2008-07-22 Nike, Inc. Fluid-filled bladder for footwear and other applications
US8063315B2 (en) * 2005-10-06 2011-11-22 Endicott Interconnect Technologies, Inc. Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate
PT103998B (pt) * 2008-03-20 2011-03-10 Univ Nova De Lisboa Dispositivos electrónicos e optoelectrónicos de efeito de campo compreendendo camadas de fibras naturais, sintéticas ou mistas e respectivo processo de fabrico
KR101214731B1 (ko) 2011-07-29 2012-12-21 삼성전기주식회사 적층형 인덕터 및 이의 제조 방법
US8842840B2 (en) 2011-11-03 2014-09-23 Arvind Gidwani Demand based encryption and key generation and distribution systems and methods
JP6004907B2 (ja) * 2012-11-16 2016-10-12 日本メクトロン株式会社 配線基板およびタッチパネルセンサシート
US10735408B2 (en) 2013-03-14 2020-08-04 Samsung Electronics Co., Ltd. Application connection for devices in a network
KR101970911B1 (ko) * 2018-02-02 2019-04-22 영남대학교 산학협력단 도전 회로를 갖춘 굴곡성과 신축성의 기판의 제조 방법
US10750618B2 (en) * 2018-04-18 2020-08-18 University Of Hawaii System and method for manufacture of circuit boards
CN110760676B (zh) * 2018-07-27 2021-07-20 中国科学院理化技术研究所 一种液态金属浆料中液态金属的回收方法
EP3841850A4 (en) * 2018-08-22 2022-10-26 Liquid Wire Inc. STRUCTURES WITH DEFORMABLE LADDERS
JP7402706B2 (ja) * 2020-02-10 2023-12-21 アオイ電子株式会社 発光装置の製造方法、および発光装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019516208A (ja) * 2016-02-29 2019-06-13 リキッド ワイヤ エルエルシーＬｉｑｕｉｄ Ｗｉｒｅ Ｌｌｃ 液体ワイヤ
WO2019093069A1 (ja) * 2017-11-07 2019-05-16 大日本印刷株式会社 伸縮性回路基板および物品
JP2019140292A (ja) * 2018-02-13 2019-08-22 大日本印刷株式会社 伸縮性配線基板およびその製造方法
US20200381349A1 (en) * 2019-05-28 2020-12-03 Liquid Wire Inc. Continuous Interconnects Between Heterogeneous Materials

Also Published As

Publication number Publication date
CN117652209A (zh) 2024-03-05
JP2024516192A (ja) 2024-04-12
US20240237205A9 (en) 2024-07-11
EP4298873A1 (en) 2024-01-03
EP4298873A4 (en) 2025-04-23
EP4298646A4 (en) 2025-03-26
US20240138062A1 (en) 2024-04-25
CN117597744A (zh) 2024-02-23
WO2022183219A1 (en) 2022-09-01
WO2022183217A1 (en) 2022-09-01
US20240147631A1 (en) 2024-05-02
EP4298646A1 (en) 2024-01-03

Similar Documents

Publication Publication Date Title
CN102740612B (zh) 软硬结合电路板的制作方法
JP7269347B2 (ja) 変形可能な導体を有する構造体
US8482117B2 (en) Semiconductor device with electronic component incorporation substrate
CN105165129B (zh) 树脂多层基板的制造方法
CN1647262A (zh) 脱模层转移用薄膜及层合薄膜
CN115841959B (zh) 一种大功率芯片的封装结构及方法
CN107251664A (zh) 立体电路构造体
CN1532920A (zh) 高散热型塑料封装及其制造方法
JP2024516192A (ja) 非常にサスティナブルな回路を製造または使用するための装置、システム、および方法
CN103517585B (zh) 软硬结合电路板及其制作方法
CN1784113A (zh) Cof用挠性印刷布线板及其制造方法
US8603858B2 (en) Method for manufacturing a semiconductor package
JP2023517885A (ja) 変形可能なインダクタ
US20220270961A1 (en) Structures with deformable conductors
CN117279222B (zh) 电路板制备方法、电路板及电子设备
CN103517586B (zh) 软硬结合电路板及其制作方法
JP2001077488A (ja) 回路基板とその製造方法およびリードフレーム
CN101442013A (zh) 电路模块和电路模块的制造方法
CN104735910A (zh) 一种电路板的制作方法和电路板
US7827679B1 (en) Thermal management circuit board and methods of producing the same
JP2003209355A (ja) 配線基板の製造方法および配線基板
Neeli An investigation into electronic circuit production in thermoplastics
TW201401956A (zh) 軟硬結合電路板及其製作方法
JP2004079881A (ja) 接着性ダム枠材
JPS60180129A (ja) 半導体パツケ−ジの製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250225

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250225

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20260126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20260303