CN117581335A - 加工装置、及加工品的制造方法 - Google Patents

加工装置、及加工品的制造方法 Download PDF

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Publication number
CN117581335A
CN117581335A CN202280044313.XA CN202280044313A CN117581335A CN 117581335 A CN117581335 A CN 117581335A CN 202280044313 A CN202280044313 A CN 202280044313A CN 117581335 A CN117581335 A CN 117581335A
Authority
CN
China
Prior art keywords
processing
drying
holding
moving
holding mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280044313.XA
Other languages
English (en)
Chinese (zh)
Inventor
深井元树
片冈昌一
堀聡子
坂上雄哉
山本裕子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of CN117581335A publication Critical patent/CN117581335A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0478—Apparatus for manufacture or treatment the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Dicing (AREA)
  • Details Of Cutting Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202280044313.XA 2021-07-09 2022-03-08 加工装置、及加工品的制造方法 Pending CN117581335A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021114351A JP7645141B2 (ja) 2021-07-09 2021-07-09 加工装置、及び加工品の製造方法
JP2021-114351 2021-07-09
PCT/JP2022/009929 WO2023281817A1 (ja) 2021-07-09 2022-03-08 加工装置、及び加工品の製造方法

Publications (1)

Publication Number Publication Date
CN117581335A true CN117581335A (zh) 2024-02-20

Family

ID=84801581

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280044313.XA Pending CN117581335A (zh) 2021-07-09 2022-03-08 加工装置、及加工品的制造方法

Country Status (5)

Country Link
JP (1) JP7645141B2 (ja)
KR (1) KR102831761B1 (ja)
CN (1) CN117581335A (ja)
TW (1) TWI830233B (ja)
WO (1) WO2023281817A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013116532A (ja) * 2011-12-05 2013-06-13 Disco Corp 切削装置
KR20130102423A (ko) * 2012-03-07 2013-09-17 한미반도체 주식회사 반도체 자재 절단장치
JP2015005544A (ja) * 2013-06-19 2015-01-08 株式会社ディスコ 切削装置
JP2017152582A (ja) * 2016-02-25 2017-08-31 株式会社ディスコ 加工方法
CN109986461A (zh) * 2017-12-25 2019-07-09 株式会社迪思科 切削装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5947010B2 (ja) 2011-09-15 2016-07-06 株式会社ディスコ 分割装置
KR101411157B1 (ko) * 2012-07-31 2014-06-23 세메스 주식회사 기판 처리 장치
JP2017084893A (ja) * 2015-10-26 2017-05-18 株式会社ディスコ 分割装置
JP2017135232A (ja) * 2016-01-27 2017-08-03 株式会社ディスコ 分割治具およびウエーハの分割方法
JP6612206B2 (ja) 2016-12-19 2019-11-27 Ｔｏｗａ株式会社 切断装置
JP7246147B2 (ja) * 2017-09-29 2023-03-27 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP7102157B2 (ja) 2018-02-08 2022-07-19 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法
JP7083692B2 (ja) * 2018-05-01 2022-06-13 株式会社ディスコ 切削装置
JP7377092B2 (ja) 2019-12-16 2023-11-09 Ｔｏｗａ株式会社 統計データ生成方法、切断装置及びシステム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013116532A (ja) * 2011-12-05 2013-06-13 Disco Corp 切削装置
KR20130102423A (ko) * 2012-03-07 2013-09-17 한미반도체 주식회사 반도체 자재 절단장치
JP2015005544A (ja) * 2013-06-19 2015-01-08 株式会社ディスコ 切削装置
JP2017152582A (ja) * 2016-02-25 2017-08-31 株式会社ディスコ 加工方法
CN109986461A (zh) * 2017-12-25 2019-07-09 株式会社迪思科 切削装置

Also Published As

Publication number Publication date
JP2023010304A (ja) 2023-01-20
KR20240008342A (ko) 2024-01-18
JP7645141B2 (ja) 2025-03-13
TW202303718A (zh) 2023-01-16
WO2023281817A1 (ja) 2023-01-12
KR102831761B1 (ko) 2025-07-10
TWI830233B (zh) 2024-01-21

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