CN117577566B - 一种便于夹取的晶圆传送机械臂 - Google Patents

一种便于夹取的晶圆传送机械臂 Download PDF

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CN117577566B
CN117577566B CN202311556548.XA CN202311556548A CN117577566B CN 117577566 B CN117577566 B CN 117577566B CN 202311556548 A CN202311556548 A CN 202311556548A CN 117577566 B CN117577566 B CN 117577566B
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杜春辉
张晓星
冯建炜
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Suzhou Semitec Semiconductor Technology Co ltd
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Abstract

本发明涉及半导体技术领域,具体涉及一种便于夹取的晶圆传送机械臂,包括底座,所述底座的外壁上通过螺栓连接有支座,所述支座的外壁上通过螺栓连接有电机,所述电机的主轴上焊接有悬臂,所述悬臂的端部外壁上焊接有电推杆,所述电推杆的输出端焊接有安装架。本发明中通过设置的限位柱和拦截块,使得避位槽内的晶圆能够进入限位柱之间,实现对晶圆的框选,限位柱端部的拦截块能够转动,从而能够将晶圆兜住,进而使得安装架能够携带晶圆进行转运,避免了传统吸盘吸附方式的一系列问题,通过设置的分片机构,使得转动块带动第一个晶圆相对第二个晶圆进行转动,使得晶圆之间出现间隙,避免晶圆之间吸附过紧而无法分开的情况。

Description

一种便于夹取的晶圆传送机械臂
技术领域
本发明属于半导体技术领域,具体涉及一种便于夹取的晶圆传送机械臂。
背景技术
晶圆是制作硅半导体电路所用的硅晶片,硅晶片是通过硅晶棒在经过研磨,抛光,清洗,切片后得到的片状硅晶,通常为圆形,也就是晶圆,而从晶圆到成品中间还需要经过多道加工工序,因此需要传送机械臂将晶圆从料盒中转运至输送带或者工作台上。
现有的传送机械臂通常采用吸盘吸附方式,但是经过清洗后的晶圆表面上残留有液体,使得吸盘吸附困难,甚至会导致晶圆发生脱落的情况,并且晶圆表面上产留的液体会导致堆叠的晶圆吸附在一起,需要手动分片,十分影响工作效率。
发明内容
本发明的目的是为了解决背景技术中的问题,而提出的一种便于夹取的晶圆传送机械臂。
为了实现上述目的,本发明采用了如下技术方案:
一种便于夹取的晶圆传送机械臂,包括底座,所述底座的外壁上通过螺栓连接有支座,所述支座的外壁上通过螺栓连接有电机,所述电机的主轴上焊接有悬臂,所述悬臂的端部外壁上焊接有电推杆,所述电推杆的输出端焊接有安装架,所述安装架位于悬臂两侧的外壁上焊接有两对对称分布的限位柱,所述安装架靠近限位柱的一侧外壁上转动插接有调节架,所述调节架的外壁上焊接有若干个调节柱,每个所述限位柱的端部外壁上转动插接有拦截块,每个所述拦截块的外壁上开设有行程槽,每个所述拦截块与调节柱一一对应,每个所述调节柱滑动插接在行程槽内,所述底座的底部外壁上焊接有料盒,所述底座的外壁上设置有输送带,所述安装架上设置有调节机构,所述料盒内设置有分片机构。
在上述的一种便于夹取的晶圆传送机械臂中,所述底座的外壁上设置有限位框和避位槽,所述料盒延伸至限位框内,所述限位框的外壁上开设有拨槽,所述避位槽与限位柱相适配,所述避位槽和输送带对称分布在电机的两侧,所述避位槽与电机的距离与悬臂的长度相适配。
在上述的一种便于夹取的晶圆传送机械臂中,所述调节机构包括调节齿轮,所述安装架的顶部外壁上焊接有支架,所述支架的外壁上通过转轴转动插接有调节齿轮,所述调节齿轮两侧的转轴上焊接有一对对称分布的绞盘,每个所述绞盘的外壁上均缠绕有软绳,两个所述软绳的缠绕方向相反,每个所述软绳的端部均粘接在调节架远离绞盘的一侧外壁上。
在上述的一种便于夹取的晶圆传送机械臂中,所述支座靠近料盒和输送带的两侧外壁上均滑动插接有调节齿条,每个所述调节齿条的外壁与支座的外壁之间均设置有弹簧一,每个所述调节齿条均与调节齿轮单向啮合,所述调节齿轮与靠近输送带一侧的调节齿条向下啮合,所述调节齿轮与靠近料盒一侧的调节齿条向上啮合。
在上述的一种便于夹取的晶圆传送机械臂中,所述分片机构包括拨杆,所述拨杆转动插接在底座的外壁上,所述拨杆与拨槽相适配,所述拨杆与悬臂始终保持垂直状态,所述拨杆的端部外壁上焊接有带轮二,所述电机的主轴端部外壁上焊接有带轮一,所述带轮一与带轮二直径大小相同,所述带轮一与带轮二的外壁上套装有传动带。
在上述的一种便于夹取的晶圆传送机械臂中,所述拨杆远离带轮二的一侧外壁上焊接有半齿轮一,所述料盒靠近限位框的一端内壁上开设有安装槽,所述安装槽内转动插接有齿圈,所述齿圈与半齿轮一相互啮合。
在上述的一种便于夹取的晶圆传送机械臂中,所述齿圈的内环壁上焊接有四个等距圆周分布的凸块一,所述齿圈的内环壁上滑动插接有一对对称分布的滑柱,每个所述滑柱的外壁上均焊接有转动块,每个所述转动块的外壁与齿圈的内环壁之间设置有弹簧三,所述弹簧三套装在滑柱的外壁上,每个所述转动块的外壁上均开设有滑槽,所述安装槽的内壁上滑动插接有四个等距圆周分布的夹持块,每个所述夹持块的外壁均焊接有滑杆,每个所述滑杆均与滑槽相适配,每个所述夹持块的外壁上均焊接有凸块二,所述凸块二与凸块一相适配。
在上述的一种便于夹取的晶圆传送机械臂中,所述拨杆靠近带轮二的一侧外壁上焊接有半齿轮二,所述料盒的底部外壁上焊接有凸台,所述凸台的外壁上转动插接有丝杆,所述丝杆的外壁上焊接有传动齿轮,所述传动齿轮与半齿轮二相互啮合,所述半齿轮二的直径大于传动齿轮的直径,所述丝杆的外壁上通过螺纹套装有上料架,所述上料架滑动插接在料盒内。
与现有技术相比,本发明的有益效果是:
1、通过设置的限位柱和拦截块,使得当限位柱插入避位槽时,避位槽内的晶圆能够进入限位柱之间,实现对晶圆的框选,限位柱端部的拦截块能够转动,从而能够将晶圆兜住,进而使得安装架能够携带晶圆进行转运,避免了传统吸盘吸附方式的一系列问题;
2、通过设置的分片机构,使得当电机带动悬臂从输送带向避位槽逆时针转动一百八十度时,在传动带的作用下,拨杆也随之同向转动半周,此时半齿轮一与齿圈啮合,从而使得齿圈带动转动块和凸块一转动,当凸块一与凸块二抵接时,凸块一向内推动凸块二,使得凸块二带动夹持块向晶圆靠近,实现对料盒内顶部第二个晶圆进行夹持的效果,同时夹持块通过滑杆带动转动块向晶圆靠近,实现对料盒内顶部第一个晶圆进行夹持的效果,从而使得转动块带动第一个晶圆相对第二个晶圆进行转动,使得晶圆之间出现间隙,从而使得空气进入间隙中,避免晶圆之间存在负压导致吸附过紧而无法分开的情况,当电机带动悬臂从避位槽向输送带逆时针转动一百八十度时,在传动带的作用下,拨杆也随之同向转动半周,此时半齿轮二与传动齿轮啮合,从而使得传动齿轮带动丝杆转动,在螺纹配合的作用下,进而使得上料架在料盒内上升一个晶圆厚度,从而将料盒内顶部第一个晶圆推进限位框内,实现向限位框内上料的效果;
3、通过设置的调节机构,使得当电机带动安装架转动至避位槽上方时,控制电推杆伸展,使得安装架带动限位柱下移,从而使得避位槽内的晶圆插接在限位柱之间,当安装架下降至底部后,控制电推杆收缩,安装架带动支架上的调节齿轮向上移动,使得调节齿轮与调节齿条向上啮合,从而使得两个绞盘转动,由于两个软绳的缠绕方向相反,使得一个绞盘收卷软绳,另一个绞盘释放软绳,从而使得收卷的软绳能够拉动调节架转动,调节架上的调节柱拨动拦截块转动,实现将限位柱之间的晶圆兜住,当电机带动安装架转动至输送带上方时,控制电推杆伸展,安装架带动调节齿轮向下移动,使得调节齿轮与调节齿条向下啮合,从而使得两个绞盘反向转动,进而使得软绳带动调节架反向转动,调节架带动调节柱反向拨动拦截块,使得拦截块收纳起来,从而使得限位柱之间的晶圆能够落下;
综上所述,通过设置的限位柱和拦截块,使得避位槽内的晶圆能够进入限位柱之间,实现对晶圆的框选,限位柱端部的拦截块能够转动,从而能够将晶圆兜住,进而使得安装架能够携带晶圆进行转运,避免了传统吸盘吸附方式的一系列问题,通过设置的分片机构,使得转动块带动第一个晶圆相对第二个晶圆进行转动,使得晶圆之间出现间隙,避免晶圆之间吸附过紧而无法分开的情况。
附图说明
图1为本发明的整体结构立体示意图。
图2为本发明的整体结构平面示意图。
图3为图2的A处结构放大图。
图4为图2的B处结构放大图。
图5为本发明的料盒立体剖视示意图。
图6为图5的C处结构放大图。
图7为本发明的绞盘立体示意图。
图8为本发明的调节架立体示意图。
图9为本发明的分片机构立体图示意图。
图10为本发明的转动块立体示意图。
图11为本发明的夹持块立体示意图。
图12为本发明的整体结构工作状态立体示意图。
图中:1、底座;11、支座;111、调节齿条;112、弹簧一;12、料盒;121、限位框;122、拨槽;123、避位槽;124、凸台;125、安装槽;13、输送带;2、电机;21、悬臂;22、电推杆;23、安装架;231、支架;232、限位柱;24、调节架;241、调节柱;25、拦截块;251、行程槽;26、调节齿轮;261、绞盘;262、软绳;27、带轮一;3、拨杆;31、带轮二;32、传动带;33、半齿轮一;34、半齿轮二;4、齿圈;41、凸块一;42、转动块;421、滑柱;422、弹簧三;423、滑槽;5、夹持块;51、滑杆;52、凸块二;6、丝杆;61、传动齿轮;62、上料架;9、晶圆。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。
在本发明的描述中,需要理解的是,术语“上”、“下”、“前”、“后”、“左”、“右”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。
请参阅图1-图12,本发明提供一种技术方案:包括底座1,底座1的外壁上通过螺栓连接有支座11,支座11的外壁上通过螺栓连接有电机2,电机2的主轴上焊接有悬臂21,悬臂21的端部外壁上焊接有电推杆22,电推杆22的输出端焊接有安装架23,安装架23位于悬臂21两侧的外壁上焊接有两对对称分布的限位柱232,安装架23靠近限位柱232的一侧外壁上转动插接有调节架24,调节架24的外壁上焊接有若干个调节柱241,每个限位柱232的端部外壁上转动插接有拦截块25,每个拦截块25的外壁上开设有行程槽251,每个拦截块25与调节柱241一一对应,每个调节柱241滑动插接在行程槽251内,底座1的底部外壁上焊接有料盒12,底座1的外壁上设置有输送带13,安装架23上设置有调节机构,料盒12内设置有分片机构,底座1的外壁上设置有限位框121和避位槽123,料盒12延伸至限位框121内,限位框121的外壁上开设有拨槽122,避位槽123与限位柱232相适配,避位槽123和输送带13对称分布在电机2的两侧,避位槽123与电机2的距离与悬臂21的长度相适配。
限位柱232与晶圆9相适配,限位框121与晶圆9相适配,电机2为步进电机并且每次转动一百八十度,电推杆22的输出端只能够伸缩而无法转动,拨槽122的高度小于晶圆9的厚度,避免限位框121内的晶圆9从拨槽122滑出,避位槽123的宽度小于晶圆9的直径,避免晶圆9从避位槽123漏出,料盒12所能容纳的晶圆9数量为整数。
具体的,调节机构包括调节齿轮26,安装架23的顶部外壁上焊接有支架231,支架231的外壁上通过转轴转动插接有调节齿轮26,调节齿轮26两侧的转轴上焊接有一对对称分布的绞盘261,每个绞盘261的外壁上均缠绕有软绳262,两个软绳262的缠绕方向相反,每个软绳262的端部均粘接在调节架24远离绞盘261的一侧外壁上,支座11靠近料盒12和输送带13的两侧外壁上均滑动插接有调节齿条111,每个调节齿条111的外壁与支座11的外壁之间均设置有弹簧一112,每个调节齿条111均与调节齿轮26单向啮合,调节齿轮26与靠近输送带13一侧的调节齿条111向下啮合,调节齿轮26与靠近料盒12一侧的调节齿条111向上啮合。
通过设置的弹簧一112,使得当调节齿条111不与调节齿轮26啮合时,调节齿条111能够压缩弹簧一112进行避位,两个调节齿条111上下分布,输送带13一侧的调节齿条111在上方,使得安装架23下移时能够带动调节齿轮26与调节齿条111向下啮合,而靠近料盒12一侧的调节齿条111在下方,使得安装架23上移时能够带动调节齿轮26与调节齿条111向上啮合。
对于上述调节机构进行进一步的阐述:当电机2带动安装架23转动至避位槽123上方时,控制电推杆22伸展,使得安装架23带动限位柱232下移,从而使得避位槽123内的晶圆9插接在限位柱232之间,当安装架23下降至底部后,控制电推杆22收缩,安装架23带动支架231上的调节齿轮26向上移动,使得调节齿轮26与调节齿条111向上啮合,从而使得两个绞盘261转动,由于两个软绳262的缠绕方向相反,使得一个绞盘261收卷软绳262,另一个绞盘261释放软绳262,从而使得收卷的软绳262能够拉动调节架24转动,调节架24上的调节柱241拨动拦截块25转动,实现将限位柱232之间的晶圆9兜住,当电机2带动安装架23转动至输送带13上方时,控制电推杆22伸展,安装架23带动调节齿轮26向下移动,使得调节齿轮26与调节齿条111向下啮合,从而使得两个绞盘261反向转动,进而使得软绳262带动调节架24反向转动,调节架24带动调节柱241反向拨动拦截块25,使得拦截块25收纳起来,从而使得限位柱232之间的晶圆9能够落下。
具体的,分片机构包括拨杆3,拨杆3转动插接在底座1的外壁上,拨杆3与拨槽122相适配,拨杆3与悬臂21始终保持垂直状态,拨杆3的端部外壁上焊接有带轮二31,电机2的主轴端部外壁上焊接有带轮一27,带轮一27与带轮二31直径大小相同,带轮一27与带轮二31的外壁上套装有传动带32,拨杆3远离带轮二31的一侧外壁上焊接有半齿轮一33,料盒12靠近限位框121的一端内壁上开设有安装槽125,安装槽125内转动插接有齿圈4,齿圈4与半齿轮一33相互啮合,齿圈4的内环壁上焊接有四个等距圆周分布的凸块一41,齿圈4的内环壁上滑动插接有一对对称分布的滑柱421,每个滑柱421的外壁上均焊接有转动块42,每个转动块42的外壁与齿圈4的内环壁之间设置有弹簧三422,弹簧三422套装在滑柱421的外壁上,每个转动块42的外壁上均开设有滑槽423,安装槽125的内壁上滑动插接有四个等距圆周分布的夹持块5,每个夹持块5的外壁均焊接有滑杆51,每个滑杆51均与滑槽423相适配,每个夹持块5的外壁上均焊接有凸块二52,凸块二52与凸块一41相适配,拨杆3靠近带轮二31的一侧外壁上焊接有半齿轮二34,料盒12的底部外壁上焊接有凸台124,凸台124的外壁上转动插接有丝杆6,丝杆6的外壁上焊接有传动齿轮61,传动齿轮61与半齿轮二34相互啮合,半齿轮二34的直径大于传动齿轮61的直径,丝杆6的外壁上通过螺纹套装有上料架62,上料架62滑动插接在料盒12内。
转动块42和夹持块5的圆弧面均与晶圆9相适配,半齿轮一33和半齿轮二34对称分布,半齿轮一33和半齿轮二34的对称线与拨杆3垂直,拨杆3与悬臂21垂直,使得当悬臂21从输送带13向避位槽123转动时,半齿轮一33与齿圈4啮合,从而能够对料盒12顶部的晶圆9进行转动分离,当悬臂21从避位槽123向输送带13转动时,半齿轮二34与传动齿轮61啮合,从而将经过转动分离的晶圆9拨进避位槽123内,等待下一次的转运,半齿轮二34的直径大于传动齿轮61的直径,使得丝杆6能够转动多圈,保证上料架62能够上升一个晶圆9厚度的高度。
对于上述分片机构进行进一步的阐述:当电机2带动悬臂21从输送带13向避位槽123逆时针转动一百八十度时,在传动带32的作用下,拨杆3也随之同向转动半周,此时半齿轮一33与齿圈4啮合,从而使得齿圈4带动转动块42和凸块一41转动,当凸块一41与凸块二52抵接时,凸块一41向齿圈4圆心处推动凸块二52,使得凸块二52带动夹持块5向晶圆9靠近,实现对料盒12内顶部第二个晶圆9进行夹持的效果,同时夹持块5通过滑杆51带动转动块42向晶圆9靠近,实现对料盒12内顶部第一个晶圆9进行夹持的效果,从而使得转动块42带动第一个晶圆9相对第二个晶圆9进行转动,使得晶圆9之间相对转动出现间隙而发生分离,避免晶圆9之间吸附过紧而无法分开的情况,同时拨杆3能够将限位框121内的晶圆9拨进避位槽123内,当电机2带动悬臂21从避位槽123向输送带13逆时针转动一百八十度时,在传动带32的作用下,拨杆3也随之同向转动半周,此时半齿轮二34与传动齿轮61啮合,从而使得传动齿轮61带动丝杆6转动,在螺纹配合的作用下,进而使得上料架62在料盒12内上升一个晶圆9厚度的高度,从而将料盒12内顶部第一个晶圆9推进限位框121内,实现向限位框121内上料的效果。
本发明的工作原理及使用流程:将晶圆9码放在料盒12内,初始状态限位框121内没有晶圆9,控制电机2逆时针转动一周,当悬臂21从输送带13向避位槽123逆时针转动一百八十度时,在分片机构的作用下,使得转动块42带动料盒12内顶部第一个晶圆9相对第二个晶圆9进行转动,使得晶圆9之间相对转动出现间隙而发生分离,避免晶圆9之间吸附过紧而无法分开的情况,当悬臂21从避位槽123向输送带13逆时针转动一百八十度时,在分片机构的作用下,上料架62在料盒12内上升一个晶圆9厚度的高度,从而将料盒12内顶部第一个转动分离的晶圆9推进限位框121内,实现向限位框121内上料的效果,当电机2再次带动安装架23转动至避位槽123上方时,在分片机构的作用下,限位框121内的晶圆9被拨进避位槽123内,在调节机构的作用下,限位柱232端部的拦截块25能够将晶圆9兜住,进而使得安装架23能够携带晶圆9进行转运,当安装架23带动晶圆9移动至输送带13上方时,在调节机构的作用下,调节架24带动调节柱241反向拨动拦截块25,使得拦截块25收纳起来,从而使得限位柱232之间的晶圆9能够落下,如此往复,直到将料盒12内的晶圆9全部转运。
以上所述,仅为本发明较佳的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,根据本发明的技术方案及其发明构思加以等同替换或改变,都应涵盖在本发明的保护范围之内。

Claims (6)

1.一种便于夹取的晶圆传送机械臂,包括底座(1),其特征在于:所述底座(1)的外壁上通过螺栓连接有支座(11),所述支座(11)的外壁上通过螺栓连接有电机(2),所述电机(2)的主轴上焊接有悬臂(21),所述悬臂(21)的端部外壁上焊接有电推杆(22),所述电推杆(22)的输出端焊接有安装架(23),所述安装架(23)位于悬臂(21)两侧的外壁上焊接有两对对称分布的限位柱(232),所述安装架(23)靠近限位柱(232)的一侧外壁上转动插接有调节架(24),所述调节架(24)的外壁上焊接有若干个调节柱(241),每个所述限位柱(232)的端部外壁上转动插接有拦截块(25),每个所述拦截块(25)的外壁上开设有行程槽(251),每个所述拦截块(25)与调节柱(241)一一对应,每个所述调节柱(241)滑动插接在行程槽(251)内,所述底座(1)的底部外壁上焊接有料盒(12),所述底座(1)的外壁上设置有输送带(13),所述安装架(23)上设置有调节机构,所述料盒(12)内设置有分片机构,所述底座(1)的外壁上设置有限位框(121)和避位槽(123),所述料盒(12)延伸至限位框(121)内,所述限位框(121)的外壁上开设有拨槽(122),所述避位槽(123)与限位柱(232)相适配,所述避位槽(123)和输送带(13)对称分布在电机(2)的两侧,所述避位槽(123)与电机(2)的距离与悬臂(21)的长度相适配;
所述调节机构包括调节齿轮(26),所述安装架(23)的顶部外壁上焊接有支架(231),所述支架(231)的外壁上通过转轴转动插接有调节齿轮(26),所述调节齿轮(26)两侧的转轴上焊接有一对对称分布的绞盘(261),每个所述绞盘(261)的外壁上均缠绕有软绳(262),两个所述软绳(262)的缠绕方向相反,每个所述软绳(262)的端部均粘接在调节架(24)远离绞盘(261)的一侧外壁上。
2.根据权利要求1所述的一种便于夹取的晶圆传送机械臂,其特征在于:所述支座(11)靠近料盒(12)和输送带(13)的两侧外壁上均滑动插接有调节齿条(111),每个所述调节齿条(111)的外壁与支座(11)的外壁之间均设置有弹簧一(112),每个所述调节齿条(111)均与调节齿轮(26)单向啮合,所述调节齿轮(26)与靠近输送带(13)一侧的调节齿条(111)向下啮合,所述调节齿轮(26)与靠近料盒(12)一侧的调节齿条(111)向上啮合。
3.根据权利要求1所述的一种便于夹取的晶圆传送机械臂,其特征在于:所述分片机构包括拨杆(3),所述拨杆(3)转动插接在底座(1)的外壁上,所述拨杆(3)与拨槽(122)相适配,所述拨杆(3)与悬臂(21)始终保持垂直状态,所述拨杆(3)的端部外壁上焊接有带轮二(31),所述电机(2)的主轴端部外壁上焊接有带轮一(27),所述带轮一(27)与带轮二(31)直径大小相同,所述带轮一(27)与带轮二(31)的外壁上套装有传动带(32)。
4.根据权利要求3所述的一种便于夹取的晶圆传送机械臂,其特征在于:所述拨杆(3)远离带轮二(31)的一侧外壁上焊接有半齿轮一(33),所述料盒(12)靠近限位框(121)的一端内壁上开设有安装槽(125),所述安装槽(125)内转动插接有齿圈(4),所述齿圈(4)与半齿轮一(33)相互啮合。
5.根据权利要求4所述的一种便于夹取的晶圆传送机械臂,其特征在于:所述齿圈(4)的内环壁上焊接有四个等距圆周分布的凸块一(41),所述齿圈(4)的内环壁上滑动插接有一对对称分布的滑柱(421),每个所述滑柱(421)的外壁上均焊接有转动块(42),每个所述转动块(42)的外壁与齿圈(4)的内环壁之间设置有弹簧三(422),所述弹簧三(422)套装在滑柱(421)的外壁上,每个所述转动块(42)的外壁上均开设有滑槽(423),所述安装槽(125)的内壁上滑动插接有四个等距圆周分布的夹持块(5),每个所述夹持块(5)的外壁均焊接有滑杆(51),每个所述滑杆(51)均与滑槽(423)相适配,每个所述夹持块(5)的外壁上均焊接有凸块二(52),所述凸块二(52)与凸块一(41)相适配。
6.根据权利要求4所述的一种便于夹取的晶圆传送机械臂,其特征在于:所述拨杆(3)靠近带轮二(31)的一侧外壁上焊接有半齿轮二(34),所述料盒(12)的底部外壁上焊接有凸台(124),所述凸台(124)的外壁上转动插接有丝杆(6),所述丝杆(6)的外壁上焊接有传动齿轮(61),所述传动齿轮(61)与半齿轮二(34)相互啮合,所述半齿轮二(34)的直径大于传动齿轮(61)的直径,所述丝杆(6)的外壁上通过螺纹套装有上料架(62),所述上料架(62)滑动插接在料盒(12)内。
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN215881636U (zh) * 2021-08-24 2022-02-22 无锡圆诺电子科技有限公司 一种晶圆传送用机械臂
CN114823473A (zh) * 2022-04-04 2022-07-29 汪翼凡 一种对晶圆半导体进行转线的机械臂
CN115394698A (zh) * 2022-10-27 2022-11-25 泓浒(苏州)半导体科技有限公司 晶圆传送机械臂及晶圆传送方法
CN115483151A (zh) * 2022-08-01 2022-12-16 江苏卓玉智能科技有限公司 一种半导体晶圆加工用固定装置
CN116276020A (zh) * 2023-04-26 2023-06-23 长春大正博凯汽车设备有限公司 一种汽车车门装配用机械手

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN215881636U (zh) * 2021-08-24 2022-02-22 无锡圆诺电子科技有限公司 一种晶圆传送用机械臂
CN114823473A (zh) * 2022-04-04 2022-07-29 汪翼凡 一种对晶圆半导体进行转线的机械臂
CN115483151A (zh) * 2022-08-01 2022-12-16 江苏卓玉智能科技有限公司 一种半导体晶圆加工用固定装置
CN115394698A (zh) * 2022-10-27 2022-11-25 泓浒(苏州)半导体科技有限公司 晶圆传送机械臂及晶圆传送方法
CN116276020A (zh) * 2023-04-26 2023-06-23 长春大正博凯汽车设备有限公司 一种汽车车门装配用机械手

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