CN117460597A - 具有凸多边形磨料部件的双面研磨设备 - Google Patents
具有凸多边形磨料部件的双面研磨设备 Download PDFInfo
- Publication number
- CN117460597A CN117460597A CN202280037766.XA CN202280037766A CN117460597A CN 117460597 A CN117460597 A CN 117460597A CN 202280037766 A CN202280037766 A CN 202280037766A CN 117460597 A CN117460597 A CN 117460597A
- Authority
- CN
- China
- Prior art keywords
- face
- abrasive
- double
- base
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims description 17
- 229910003460 diamond Inorganic materials 0.000 claims description 8
- 239000010432 diamond Substances 0.000 claims description 8
- 230000002706 hydrostatic effect Effects 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 42
- 230000008569 process Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163180481P | 2021-04-27 | 2021-04-27 | |
| US63/180,481 | 2021-04-27 | ||
| PCT/KR2022/006034 WO2022231308A1 (en) | 2021-04-27 | 2022-04-27 | Double side grinding apparatus having convex polygon-shaped abrasive members |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117460597A true CN117460597A (zh) | 2024-01-26 |
Family
ID=83847073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280037766.XA Pending CN117460597A (zh) | 2021-04-27 | 2022-04-27 | 具有凸多边形磨料部件的双面研磨设备 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4329982A1 (ko) |
| JP (1) | JP2024518332A (ko) |
| KR (1) | KR20230175281A (ko) |
| CN (1) | CN117460597A (ko) |
| TW (1) | TW202245033A (ko) |
| WO (1) | WO2022231308A1 (ko) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1735127B1 (en) * | 2004-03-19 | 2013-07-31 | MEMC Electronic Materials, Inc. | Wafer clamping device for a double side grinder |
| JP2006224201A (ja) * | 2005-02-15 | 2006-08-31 | Disco Abrasive Syst Ltd | 研削ホイール |
| CN202088116U (zh) * | 2011-04-26 | 2011-12-28 | 博深工具股份有限公司 | 一种钻石型金刚石磨盘 |
| JP6350384B2 (ja) * | 2015-05-11 | 2018-07-04 | 信越半導体株式会社 | 研削用砥石 |
| JP6948798B2 (ja) * | 2017-02-14 | 2021-10-13 | 株式会社ディスコ | 研削ホイール |
-
2022
- 2022-04-27 WO PCT/KR2022/006034 patent/WO2022231308A1/en active Application Filing
- 2022-04-27 EP EP22796140.6A patent/EP4329982A1/en active Pending
- 2022-04-27 KR KR1020237040301A patent/KR20230175281A/ko unknown
- 2022-04-27 CN CN202280037766.XA patent/CN117460597A/zh active Pending
- 2022-04-27 JP JP2023566021A patent/JP2024518332A/ja active Pending
- 2022-04-27 TW TW111116079A patent/TW202245033A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022231308A1 (en) | 2022-11-03 |
| TW202245033A (zh) | 2022-11-16 |
| KR20230175281A (ko) | 2023-12-29 |
| JP2024518332A (ja) | 2024-05-01 |
| EP4329982A1 (en) | 2024-03-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |