CN117457569B - 一种晶圆载片台 - Google Patents
一种晶圆载片台 Download PDFInfo
- Publication number
- CN117457569B CN117457569B CN202311394289.5A CN202311394289A CN117457569B CN 117457569 B CN117457569 B CN 117457569B CN 202311394289 A CN202311394289 A CN 202311394289A CN 117457569 B CN117457569 B CN 117457569B
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- CN
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- Prior art keywords
- fixedly connected
- wafer
- telescopic rod
- electric telescopic
- bin
- Prior art date
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- 238000005485 electric heating Methods 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims description 15
- 235000012431 wafers Nutrition 0.000 description 62
- 230000001133 acceleration Effects 0.000 description 4
- 238000005498 polishing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202311394289.5A CN117457569B (zh) | 2023-10-26 | 2023-10-26 | 一种晶圆载片台 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202311394289.5A CN117457569B (zh) | 2023-10-26 | 2023-10-26 | 一种晶圆载片台 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202410422961.5A Division CN118315327A (zh) | 2023-10-26 | 一种晶圆载片台 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN117457569A CN117457569A (zh) | 2024-01-26 |
CN117457569B true CN117457569B (zh) | 2024-05-24 |
Family
ID=89581089
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202311394289.5A Active CN117457569B (zh) | 2023-10-26 | 2023-10-26 | 一种晶圆载片台 |
Country Status (1)
Country | Link |
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CN (1) | CN117457569B (zh) |
Citations (12)
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KR100986281B1 (ko) * | 2010-01-21 | 2010-10-07 | 주식회사 이노비즈 | 엘이디 검사장비의 웨이퍼 로딩유닛 |
CN205234620U (zh) * | 2016-01-14 | 2016-05-18 | 吴洪校 | 一种稳定舒适的开放手术椎弓根导向器 |
CN109413070A (zh) * | 2018-10-30 | 2019-03-01 | 郑州市景安网络科技股份有限公司 | 一种waf业务开通方法及相关装置 |
JP2020009820A (ja) * | 2018-07-03 | 2020-01-16 | 日本電産サンキョー株式会社 | 産業用ロボット |
CN211016549U (zh) * | 2020-01-19 | 2020-07-14 | 上海优村科技有限公司 | 一种存储芯片简易测试装置 |
CN211317143U (zh) * | 2019-12-16 | 2020-08-21 | 合宇(上海)智能科技有限公司 | 一种单片机芯片检测装置 |
CN213232005U (zh) * | 2020-08-04 | 2021-05-18 | 海安明光光学玻璃科技有限公司 | 一种光学玻璃切割装置 |
CN214672553U (zh) * | 2021-05-14 | 2021-11-09 | 漳州职业技术学院 | 一种用于晶圆检测的移动载台机构 |
CN114576533A (zh) * | 2022-03-03 | 2022-06-03 | 宿迁市数博软件科技有限公司 | 一种抗干扰防破坏的监控安防工程用监控装置 |
CN218546823U (zh) * | 2022-06-17 | 2023-02-28 | 深圳市伟业永升科技有限公司 | 一种半导体检测用探针平台 |
CN116682630A (zh) * | 2023-06-09 | 2023-09-01 | 珠海博明视觉科技有限公司 | 磁铁自动检测充磁一体机设备 |
CN116741668A (zh) * | 2023-06-15 | 2023-09-12 | 江苏东海半导体股份有限公司 | 一种集成电路的多芯片封装定位装置及其工作方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4994724B2 (ja) * | 2006-07-07 | 2012-08-08 | 株式会社東芝 | 成膜装置及び成膜方法 |
-
2023
- 2023-10-26 CN CN202311394289.5A patent/CN117457569B/zh active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100986281B1 (ko) * | 2010-01-21 | 2010-10-07 | 주식회사 이노비즈 | 엘이디 검사장비의 웨이퍼 로딩유닛 |
CN205234620U (zh) * | 2016-01-14 | 2016-05-18 | 吴洪校 | 一种稳定舒适的开放手术椎弓根导向器 |
JP2020009820A (ja) * | 2018-07-03 | 2020-01-16 | 日本電産サンキョー株式会社 | 産業用ロボット |
CN109413070A (zh) * | 2018-10-30 | 2019-03-01 | 郑州市景安网络科技股份有限公司 | 一种waf业务开通方法及相关装置 |
CN211317143U (zh) * | 2019-12-16 | 2020-08-21 | 合宇(上海)智能科技有限公司 | 一种单片机芯片检测装置 |
CN211016549U (zh) * | 2020-01-19 | 2020-07-14 | 上海优村科技有限公司 | 一种存储芯片简易测试装置 |
CN213232005U (zh) * | 2020-08-04 | 2021-05-18 | 海安明光光学玻璃科技有限公司 | 一种光学玻璃切割装置 |
CN214672553U (zh) * | 2021-05-14 | 2021-11-09 | 漳州职业技术学院 | 一种用于晶圆检测的移动载台机构 |
CN114576533A (zh) * | 2022-03-03 | 2022-06-03 | 宿迁市数博软件科技有限公司 | 一种抗干扰防破坏的监控安防工程用监控装置 |
CN218546823U (zh) * | 2022-06-17 | 2023-02-28 | 深圳市伟业永升科技有限公司 | 一种半导体检测用探针平台 |
CN116682630A (zh) * | 2023-06-09 | 2023-09-01 | 珠海博明视觉科技有限公司 | 磁铁自动检测充磁一体机设备 |
CN116741668A (zh) * | 2023-06-15 | 2023-09-12 | 江苏东海半导体股份有限公司 | 一种集成电路的多芯片封装定位装置及其工作方法 |
Non-Patent Citations (2)
Title |
---|
对于叠片热弯玻璃的生产设备、加热工艺及模具制作的探讨;许伟光;;门窗;20110220(第02期);全文 * |
用于离心式微流控生化分析芯片的光探测系统;王宇;郝鹏;武俊峰;徐阳;邓永波;吴一辉;;激光与光电子学进展;20151210(第12期);全文 * |
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CN117457569A (zh) | 2024-01-26 |
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Effective date of registration: 20240424 Address after: 050000 plant 11-12, Ludao V Valley Science and Technology Industrial Park, Luquan District, Shijiazhuang City, Hebei Province Applicant after: Hebei Light Electronic Technology Co.,Ltd. Country or region after: China Address before: Building 1, No. 288 Changjiang West Road, Hai'an Town, Hai'an City, Nantong City, Jiangsu Province, 226000 Applicant before: HAI'AN MING GUANG OPTICAL GLASS TECHNOLOGY Co.,Ltd. Country or region before: China |
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