CN117438381A - 密封膜、电子部件装置的制造方法及电子部件装置 - Google Patents

密封膜、电子部件装置的制造方法及电子部件装置 Download PDF

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Publication number
CN117438381A
CN117438381A CN202311384098.0A CN202311384098A CN117438381A CN 117438381 A CN117438381 A CN 117438381A CN 202311384098 A CN202311384098 A CN 202311384098A CN 117438381 A CN117438381 A CN 117438381A
Authority
CN
China
Prior art keywords
resin layer
sealing
electronic component
resin
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311384098.0A
Other languages
English (en)
Chinese (zh)
Inventor
野村丰
渡濑裕介
荻原弘邦
金子知世
铃木雅彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lishennoco Co ltd
Original Assignee
Lishennoco Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lishennoco Co ltd filed Critical Lishennoco Co ltd
Publication of CN117438381A publication Critical patent/CN117438381A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN202311384098.0A 2017-03-31 2018-03-29 密封膜、电子部件装置的制造方法及电子部件装置 Pending CN117438381A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017072159 2017-03-31
JP2017-072159 2017-03-31
PCT/JP2018/013344 WO2018181761A1 (ja) 2017-03-31 2018-03-29 封止フィルム、電子部品装置の製造方法及び電子部品装置
CN201880020294.0A CN110462818B (zh) 2017-03-31 2018-03-29 密封膜、电子部件装置的制造方法及电子部件装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201880020294.0A Division CN110462818B (zh) 2017-03-31 2018-03-29 密封膜、电子部件装置的制造方法及电子部件装置

Publications (1)

Publication Number Publication Date
CN117438381A true CN117438381A (zh) 2024-01-23

Family

ID=63678034

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201880020294.0A Active CN110462818B (zh) 2017-03-31 2018-03-29 密封膜、电子部件装置的制造方法及电子部件装置
CN202311384098.0A Pending CN117438381A (zh) 2017-03-31 2018-03-29 密封膜、电子部件装置的制造方法及电子部件装置

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201880020294.0A Active CN110462818B (zh) 2017-03-31 2018-03-29 密封膜、电子部件装置的制造方法及电子部件装置

Country Status (5)

Country Link
JP (1) JP7115469B2 (ja)
KR (1) KR102440947B1 (ja)
CN (2) CN110462818B (ja)
TW (1) TWI733014B (ja)
WO (1) WO2018181761A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022158450A1 (ja) * 2021-01-19 2022-07-28 昭和電工マテリアルズ株式会社 導電性部材、電子装置の製造方法、接続構造体、及び、電子装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS616615A (ja) 1984-06-20 1986-01-13 Nippon Sheet Glass Co Ltd 屈折率分布型レンズ
JP2001127095A (ja) 1999-10-29 2001-05-11 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
JP2001244372A (ja) 2000-03-01 2001-09-07 Seiko Epson Corp 半導体装置およびその製造方法
DE102006009789B3 (de) 2006-03-01 2007-10-04 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleiterbauteils aus einer Verbundplatte mit Halbleiterchips und Kunststoffgehäusemasse
US7906860B2 (en) * 2007-10-26 2011-03-15 Infineon Technologies Ag Semiconductor device
JP5385247B2 (ja) 2010-12-03 2014-01-08 信越化学工業株式会社 ウエハモールド材及び半導体装置の製造方法
KR101767381B1 (ko) * 2010-12-30 2017-08-11 삼성전자 주식회사 인쇄회로기판 및 이를 포함하는 반도체 패키지
JP5623970B2 (ja) 2011-04-22 2014-11-12 信越化学工業株式会社 樹脂積層体、及び半導体装置とその製造方法
JP5934078B2 (ja) * 2012-11-19 2016-06-15 信越化学工業株式会社 繊維含有樹脂基板及び半導体装置の製造方法
JP6393092B2 (ja) * 2013-08-07 2018-09-19 日東電工株式会社 中空型電子デバイス封止用樹脂シート及び中空型電子デバイスパッケージの製造方法
JP6213128B2 (ja) * 2013-10-09 2017-10-18 富士通株式会社 電子部品パッケージおよび電子部品パッケージの製造方法
JP2016012713A (ja) * 2014-06-05 2016-01-21 日立化成株式会社 樹脂フィルム、半導体装置および半導体装置の製造方法

Also Published As

Publication number Publication date
JPWO2018181761A1 (ja) 2020-02-20
JP7115469B2 (ja) 2022-08-09
CN110462818A (zh) 2019-11-15
TW201903989A (zh) 2019-01-16
KR20190132401A (ko) 2019-11-27
KR102440947B1 (ko) 2022-09-05
CN110462818B (zh) 2023-12-26
WO2018181761A1 (ja) 2018-10-04
TWI733014B (zh) 2021-07-11

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