CN117321254A - 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板 - Google Patents

粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板 Download PDF

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Publication number
CN117321254A
CN117321254A CN202280035832.XA CN202280035832A CN117321254A CN 117321254 A CN117321254 A CN 117321254A CN 202280035832 A CN202280035832 A CN 202280035832A CN 117321254 A CN117321254 A CN 117321254A
Authority
CN
China
Prior art keywords
copper foil
roughened
peaks
valleys
peak
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280035832.XA
Other languages
English (en)
Chinese (zh)
Inventor
小出沙织
细川真
栗原美穗
田坂知里
四井绫子
沟口美智
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Publication of CN117321254A publication Critical patent/CN117321254A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN202280035832.XA 2021-05-20 2022-05-18 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板 Pending CN117321254A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-085490 2021-05-20
JP2021085490 2021-05-20
PCT/JP2022/020748 WO2022244827A1 (ja) 2021-05-20 2022-05-18 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Publications (1)

Publication Number Publication Date
CN117321254A true CN117321254A (zh) 2023-12-29

Family

ID=84141655

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280035832.XA Pending CN117321254A (zh) 2021-05-20 2022-05-18 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板

Country Status (5)

Country Link
JP (1) JPWO2022244827A1 (https=)
KR (1) KR20240009404A (https=)
CN (1) CN117321254A (https=)
TW (1) TWI805378B (https=)
WO (1) WO2022244827A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016089192A (ja) * 2014-10-30 2016-05-23 株式会社Ｓｈカッパープロダクツ 表面処理銅箔及び積層板
WO2017099094A1 (ja) * 2015-12-09 2017-06-15 古河電気工業株式会社 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板
CN107614760A (zh) * 2015-07-03 2018-01-19 三井金属矿业株式会社 粗糙化处理铜箔、覆铜层叠板和印刷电路板
WO2018211951A1 (ja) * 2017-05-19 2018-11-22 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
WO2019093494A1 (ja) * 2017-11-10 2019-05-16 ナミックス株式会社 複合銅箔
JP2020143362A (ja) * 2019-02-01 2020-09-10 長春石油化學股▲分▼有限公司 プリント回路板用の低伝送損失電解銅箔
CN117321253A (zh) * 2021-05-20 2023-12-29 三井金属矿业株式会社 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
CN110072334B (zh) 2015-01-22 2022-04-01 三井金属矿业株式会社 带载体的极薄铜箔及其制造方法
JP6200042B2 (ja) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN110088361B (zh) * 2016-12-14 2021-07-16 古河电气工业株式会社 表面处理铜箔以及覆铜层叠板
WO2020031721A1 (ja) 2018-08-10 2020-02-13 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016089192A (ja) * 2014-10-30 2016-05-23 株式会社Ｓｈカッパープロダクツ 表面処理銅箔及び積層板
CN107614760A (zh) * 2015-07-03 2018-01-19 三井金属矿业株式会社 粗糙化处理铜箔、覆铜层叠板和印刷电路板
WO2017099094A1 (ja) * 2015-12-09 2017-06-15 古河電気工業株式会社 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板
WO2018211951A1 (ja) * 2017-05-19 2018-11-22 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
CN110382745A (zh) * 2017-05-19 2019-10-25 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
WO2019093494A1 (ja) * 2017-11-10 2019-05-16 ナミックス株式会社 複合銅箔
JP2020143362A (ja) * 2019-02-01 2020-09-10 長春石油化學股▲分▼有限公司 プリント回路板用の低伝送損失電解銅箔
CN117321253A (zh) * 2021-05-20 2023-12-29 三井金属矿业株式会社 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板

Also Published As

Publication number Publication date
TW202302915A (zh) 2023-01-16
JPWO2022244827A1 (https=) 2022-11-24
TWI805378B (zh) 2023-06-11
WO2022244827A1 (ja) 2022-11-24
KR20240009404A (ko) 2024-01-22

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SE01 Entry into force of request for substantive examination
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Country or region after: Japan

Address after: Japan

Applicant after: Mitsui Metal Co.,Ltd.

Address before: Tokyo, Japan

Applicant before: MITSUI MINING & SMELTING Co.,Ltd.

Country or region before: Japan