CN117296140A - 基板收纳容器 - Google Patents

基板收纳容器 Download PDF

Info

Publication number
CN117296140A
CN117296140A CN202180097767.9A CN202180097767A CN117296140A CN 117296140 A CN117296140 A CN 117296140A CN 202180097767 A CN202180097767 A CN 202180097767A CN 117296140 A CN117296140 A CN 117296140A
Authority
CN
China
Prior art keywords
gas
chamber
substrate
container body
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180097767.9A
Other languages
English (en)
Chinese (zh)
Inventor
松鸟千明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miraial Co Ltd
Original Assignee
Miraial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miraial Co Ltd filed Critical Miraial Co Ltd
Publication of CN117296140A publication Critical patent/CN117296140A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier

Landscapes

  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN202180097767.9A 2021-06-21 2021-06-21 基板收纳容器 Pending CN117296140A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/023474 WO2022269718A1 (ja) 2021-06-21 2021-06-21 基板収納容器

Publications (1)

Publication Number Publication Date
CN117296140A true CN117296140A (zh) 2023-12-26

Family

ID=84545304

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180097767.9A Pending CN117296140A (zh) 2021-06-21 2021-06-21 基板收纳容器

Country Status (6)

Country Link
US (1) US12374573B2 (https=)
JP (1) JP7721643B2 (https=)
KR (1) KR102798614B1 (https=)
CN (1) CN117296140A (https=)
TW (1) TW202301528A (https=)
WO (1) WO2022269718A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12424472B2 (en) * 2021-03-29 2025-09-23 Miraial Co., Ltd. Substrate storing container
US12347711B2 (en) 2021-08-17 2025-07-01 Gudeng Precision Industrial Co., Ltd. Gas diffusion device, and wafer container including the same
TWI858804B (zh) * 2022-12-01 2024-10-11 家登精密工業股份有限公司 晶圓載具量測裝置
TWI897695B (zh) * 2024-02-20 2025-09-11 中勤實業股份有限公司 具有供流體進入之氣體擴散裝置的基板容器
WO2026009428A1 (ja) * 2024-07-05 2026-01-08 ミライアル株式会社 基板収納容器及び気体噴出ノズル部

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5879458A (en) * 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
EP2272088B1 (en) 2008-03-13 2016-12-07 Entegris, Inc. Wafer container with tubular environmental control components
TWI515159B (zh) 2009-12-10 2016-01-01 安堤格里斯公司 用於微環境之可供滌洗氣穿透之多孔壁
SG11201602916VA (en) 2013-10-14 2016-05-30 Entegris Inc Towers for substrate carriers
TWM489155U (en) * 2014-06-09 2014-11-01 Gudeng Precision Industrial Co Ltd Gas diffusion device of wafer pod
JP6265844B2 (ja) 2014-06-18 2018-01-24 信越ポリマー株式会社 基板収納容器
JP6424728B2 (ja) 2014-07-03 2018-11-21 Tdk株式会社 半導体磁器組成物およびptcサーミスタ
KR101637498B1 (ko) 2015-03-24 2016-07-07 피코앤테라(주) 웨이퍼 수납용기
JP6400534B2 (ja) 2015-07-06 2018-10-03 信越ポリマー株式会社 基板収納容器
SG11201901884RA (en) * 2016-09-06 2019-04-29 Shin Etsu Polymer Co Ltd Substrate Storage Container and Gas Replacement Unit
SG11201908168WA (en) * 2017-03-27 2019-10-30 Shin Etsu Polymer Co Ltd Substrate storage container
WO2018203384A1 (ja) * 2017-05-02 2018-11-08 ミライアル株式会社 基板収納容器
US10937677B2 (en) * 2018-04-02 2021-03-02 Bum Je WOO Wafer storage container
US11948821B2 (en) * 2018-04-25 2024-04-02 Miraial Co., Ltd. Substrate storing container
KR20200011290A (ko) 2018-07-24 2020-02-03 세메스 주식회사 기판 처리 장치
US10879099B2 (en) * 2018-08-15 2020-12-29 Taiwan Semiconductor Manufacturing Co., Ltd. Humidity control in storage device
CN112289718A (zh) 2019-07-13 2021-01-29 家登精密工业股份有限公司 基板载具及其气体扩散模块
WO2021014653A1 (ja) 2019-07-25 2021-01-28 ミライアル株式会社 基板収納容器
US11820575B2 (en) * 2020-10-23 2023-11-21 Miraial Co., Ltd. Substrate storing container, method for manufacturing the same, and filter unit

Also Published As

Publication number Publication date
JP7721643B2 (ja) 2025-08-12
WO2022269718A1 (ja) 2022-12-29
US20240145284A1 (en) 2024-05-02
TW202301528A (zh) 2023-01-01
KR102798614B1 (ko) 2025-04-18
US12374573B2 (en) 2025-07-29
JPWO2022269718A1 (https=) 2022-12-29
KR20240024780A (ko) 2024-02-26

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