JPWO2022269718A1 - - Google Patents

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Publication number
JPWO2022269718A1
JPWO2022269718A1 JP2023529244A JP2023529244A JPWO2022269718A1 JP WO2022269718 A1 JPWO2022269718 A1 JP WO2022269718A1 JP 2023529244 A JP2023529244 A JP 2023529244A JP 2023529244 A JP2023529244 A JP 2023529244A JP WO2022269718 A1 JPWO2022269718 A1 JP WO2022269718A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023529244A
Other languages
Japanese (ja)
Other versions
JP7721643B2 (ja
JPWO2022269718A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022269718A1 publication Critical patent/JPWO2022269718A1/ja
Publication of JPWO2022269718A5 publication Critical patent/JPWO2022269718A5/ja
Application granted granted Critical
Publication of JP7721643B2 publication Critical patent/JP7721643B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
JP2023529244A 2021-06-21 2021-06-21 基板収納容器 Active JP7721643B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/023474 WO2022269718A1 (ja) 2021-06-21 2021-06-21 基板収納容器

Publications (3)

Publication Number Publication Date
JPWO2022269718A1 true JPWO2022269718A1 (https=) 2022-12-29
JPWO2022269718A5 JPWO2022269718A5 (https=) 2024-04-18
JP7721643B2 JP7721643B2 (ja) 2025-08-12

Family

ID=84545304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023529244A Active JP7721643B2 (ja) 2021-06-21 2021-06-21 基板収納容器

Country Status (6)

Country Link
US (1) US12374573B2 (https=)
JP (1) JP7721643B2 (https=)
KR (1) KR102798614B1 (https=)
CN (1) CN117296140A (https=)
TW (1) TW202301528A (https=)
WO (1) WO2022269718A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12424472B2 (en) * 2021-03-29 2025-09-23 Miraial Co., Ltd. Substrate storing container
US12347711B2 (en) 2021-08-17 2025-07-01 Gudeng Precision Industrial Co., Ltd. Gas diffusion device, and wafer container including the same
TWI858804B (zh) * 2022-12-01 2024-10-11 家登精密工業股份有限公司 晶圓載具量測裝置
TWI897695B (zh) * 2024-02-20 2025-09-11 中勤實業股份有限公司 具有供流體進入之氣體擴散裝置的基板容器
WO2026009428A1 (ja) * 2024-07-05 2026-01-08 ミライアル株式会社 基板収納容器及び気体噴出ノズル部

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011514014A (ja) * 2008-03-13 2011-04-28 インテグリス インコーポレーテッド 管状制御要素を有するウエハーコンテナ
JP2013513951A (ja) * 2009-12-10 2013-04-22 インテグリス・インコーポレーテッド 微小環境中に均一に分布した浄化ガスを得るための多孔質バリア
JP3198841U (ja) * 2014-06-09 2015-07-23 家登精密工業股▲ふん▼有限公司 ウエハポッドの気体拡散装置
WO2018179964A1 (ja) * 2017-03-27 2018-10-04 信越ポリマー株式会社 基板収納容器
JP2019216258A (ja) * 2015-03-24 2019-12-19 ピコ アンド テラ カンパニー リミテッドPico & Tera Co., Ltd ウェハー収納容器
KR20200011290A (ko) * 2018-07-24 2020-02-03 세메스 주식회사 기판 처리 장치
WO2021014653A1 (ja) * 2019-07-25 2021-01-28 ミライアル株式会社 基板収納容器

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5879458A (en) * 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
SG11201602916VA (en) 2013-10-14 2016-05-30 Entegris Inc Towers for substrate carriers
JP6265844B2 (ja) 2014-06-18 2018-01-24 信越ポリマー株式会社 基板収納容器
JP6424728B2 (ja) 2014-07-03 2018-11-21 Tdk株式会社 半導体磁器組成物およびptcサーミスタ
JP6400534B2 (ja) 2015-07-06 2018-10-03 信越ポリマー株式会社 基板収納容器
SG11201901884RA (en) * 2016-09-06 2019-04-29 Shin Etsu Polymer Co Ltd Substrate Storage Container and Gas Replacement Unit
WO2018203384A1 (ja) * 2017-05-02 2018-11-08 ミライアル株式会社 基板収納容器
US10937677B2 (en) * 2018-04-02 2021-03-02 Bum Je WOO Wafer storage container
US11948821B2 (en) * 2018-04-25 2024-04-02 Miraial Co., Ltd. Substrate storing container
US10879099B2 (en) * 2018-08-15 2020-12-29 Taiwan Semiconductor Manufacturing Co., Ltd. Humidity control in storage device
CN112289718A (zh) 2019-07-13 2021-01-29 家登精密工业股份有限公司 基板载具及其气体扩散模块
US11820575B2 (en) * 2020-10-23 2023-11-21 Miraial Co., Ltd. Substrate storing container, method for manufacturing the same, and filter unit

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011514014A (ja) * 2008-03-13 2011-04-28 インテグリス インコーポレーテッド 管状制御要素を有するウエハーコンテナ
JP2013513951A (ja) * 2009-12-10 2013-04-22 インテグリス・インコーポレーテッド 微小環境中に均一に分布した浄化ガスを得るための多孔質バリア
JP3198841U (ja) * 2014-06-09 2015-07-23 家登精密工業股▲ふん▼有限公司 ウエハポッドの気体拡散装置
JP2019216258A (ja) * 2015-03-24 2019-12-19 ピコ アンド テラ カンパニー リミテッドPico & Tera Co., Ltd ウェハー収納容器
WO2018179964A1 (ja) * 2017-03-27 2018-10-04 信越ポリマー株式会社 基板収納容器
KR20200011290A (ko) * 2018-07-24 2020-02-03 세메스 주식회사 기판 처리 장치
WO2021014653A1 (ja) * 2019-07-25 2021-01-28 ミライアル株式会社 基板収納容器

Also Published As

Publication number Publication date
JP7721643B2 (ja) 2025-08-12
WO2022269718A1 (ja) 2022-12-29
US20240145284A1 (en) 2024-05-02
TW202301528A (zh) 2023-01-01
KR102798614B1 (ko) 2025-04-18
US12374573B2 (en) 2025-07-29
CN117296140A (zh) 2023-12-26
KR20240024780A (ko) 2024-02-26

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