CN117177436A - Printed wiring board with good heat dissipation performance and manufacturing method thereof - Google Patents
Printed wiring board with good heat dissipation performance and manufacturing method thereof Download PDFInfo
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- CN117177436A CN117177436A CN202310901267.7A CN202310901267A CN117177436A CN 117177436 A CN117177436 A CN 117177436A CN 202310901267 A CN202310901267 A CN 202310901267A CN 117177436 A CN117177436 A CN 117177436A
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- copper foil
- window groove
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 430
- 239000011889 copper foil Substances 0.000 claims abstract description 306
- 229910052802 copper Inorganic materials 0.000 claims abstract description 124
- 239000010949 copper Substances 0.000 claims abstract description 124
- 239000000758 substrate Substances 0.000 claims abstract description 96
- 229920005989 resin Polymers 0.000 claims abstract description 42
- 239000011347 resin Substances 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims description 34
- 239000003822 epoxy resin Substances 0.000 claims description 32
- 229920000647 polyepoxide Polymers 0.000 claims description 32
- 239000000047 product Substances 0.000 claims description 19
- 229920000642 polymer Polymers 0.000 claims description 14
- 230000001681 protective effect Effects 0.000 claims description 14
- 239000002390 adhesive tape Substances 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 12
- 238000010030 laminating Methods 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 10
- 239000011265 semifinished product Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 230000001680 brushing effect Effects 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims 3
- 239000007787 solid Substances 0.000 claims 3
- 239000006185 dispersion Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 33
- 238000010586 diagram Methods 0.000 description 5
- 238000003475 lamination Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
- 239000012776 electronic material Substances 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Abstract
The invention relates to a printed circuit board with good heat dissipation performance and a manufacturing method thereof, comprising a substrate, a prepreg, a first upper copper foil and a first lower copper foil, wherein a window groove is arranged between the first upper copper foil positioned at the uppermost layer and the first lower copper foil positioned at the lowermost layer, a red copper block is arranged in the window groove, resin ink is arranged between the red copper block and the outer wall and the inner wall of the window groove, a second upper copper foil is arranged above the upper surface of the first upper copper foil positioned at the uppermost layer, the upper surface of the resin ink and the upper surface of the red copper block, a second lower copper foil is arranged below the lower surface of the first lower copper foil positioned at the lowermost layer, the lower surface of the resin ink and the lower surface of the red copper block, and circuit patterns are etched on all copper foils. The printed circuit board has good heat radiation performance, and the manufacturing method of the invention enhances the binding force between the red copper block and the printed circuit board body, improves the heat resistance of the printed circuit board and improves the yield of the printed circuit board.
Description
Technical Field
The invention belongs to the technical field of printed circuit boards, and particularly discloses a printed circuit board with good heat dissipation performance and a manufacturing method thereof.
Background
Along with the diversification of the demands of vehicle-mounted electronic products, the fresh demands such as daytime running lights, width lights, welcome lights and the like are more and more, the vehicle-mounted electronic products gradually develop into an indispensable part of automobile electronics, and the products have common properties, so that the products are required to have better heat dissipation and more function integration.
Conventional lamp products generally employ metal substrates, such as aluminum substrates or copper substrates, but due to the limitations of such products, it is difficult to process the products into multi-layered products, which limits the demands of the increasingly technological product functions.
The traditional circuit board can meet the requirement of multifunctional design, but due to the fact that materials for the traditional circuit board are poor in heat dissipation effect, reliability of a product cannot be guaranteed after the automobile lamp continuously heats.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a printed circuit board with good heat dissipation performance and a manufacturing method thereof.
According to the technical scheme provided by the invention, the printed circuit board with good heat dissipation performance comprises a substrate, a prepreg, a first upper copper foil and a first lower copper foil, wherein the substrate comprises an epoxy resin base material, a substrate upper copper foil positioned on the upper surface of the epoxy resin base material and a substrate lower copper foil positioned on the lower surface of the epoxy resin base material, at least one layer of first upper copper foil is arranged above the substrate, the prepreg is arranged between two adjacent layers of first upper copper foils and between the substrate upper copper foil and the adjacent first upper copper foil, at least one layer of first lower copper foil is arranged below the substrate, and the prepreg is arranged between two adjacent layers of first lower copper foils and between the substrate lower copper foil and the adjacent first lower copper foil;
a window groove is formed between the first upper copper foil positioned at the uppermost layer and the first lower copper foil positioned at the lowermost layer, the transverse cross section of the window groove is in a round rectangle, a copper block is arranged in the window groove, the transverse cross section of the copper block is in a round rectangle, the single-side long side of the copper block is 0.12-0.18 mm smaller than the single-side long side of the window groove, the single-side wide side of the copper block is 0.12-0.18 mm smaller than the single-side wide side of the window groove, the minimum distance between the round angle of the copper block and the corresponding round angle of the window groove is 0.04-0.06 mm, and resin ink is arranged in a gap between the copper block and the outer wall and the inner wall of the window groove;
a second upper copper foil is arranged above the upper surface of the first upper copper foil positioned at the uppermost layer, the upper surface of the resin ink and the upper surface of the red copper block, and the second upper copper foil is connected with the first upper copper foil positioned at the uppermost layer into a whole; a second lower copper foil is arranged below the lower surface of the first lower copper foil positioned at the lowest layer, the lower surface of the resin ink and the lower surface of the copper block, and the second lower copper foil is connected with the first lower copper foil positioned at the lowest layer into a whole;
the circuit patterns are etched on the upper copper foil, the lower copper foil, the first upper copper foil, the first lower copper foil, the second upper copper foil and the second lower copper foil of the substrate.
Preferably, the thickness of the epoxy resin base material is 50-1000 micrometers, and the thicknesses of the copper foil on the substrate and the copper foil under the substrate are 12-60 micrometers.
Preferably, the thickness of the prepreg is 50-100 micrometers.
The thicknesses of the first upper copper foil and the first lower copper foil are 12-17 micrometers.
Preferably, on the transverse section of the window groove, the length of the long side of the fillet rectangle is 5-15 mm, the width of the wide side is 2-10 mm, and the fillet radius is 0.6-1.5 mm.
Preferably, the round rectangle has a round radius of 0.2-1 mm on the transverse section of the red copper block.
The manufacturing method of the printed circuit board with good heat dissipation performance comprises the following steps:
s1, providing a substrate, wherein the substrate comprises an epoxy resin base material, an upper substrate copper foil positioned on the upper surface of the epoxy resin base material and a lower substrate copper foil positioned on the lower surface of the epoxy resin base material, and etching circuit patterns on the upper substrate copper foil and the lower substrate copper foil;
s2, stacking and pressing the first upper copper foil, the semi-cured film, the substrate, the semi-cured film and the first lower copper foil together according to the sequence from top to bottom to form a laminated board semi-finished product, and etching circuit patterns on the first upper copper foil and the first lower copper foil;
s3, taking a semi-solidified film, namely manufacturing a copper foil into a first upper copper foil and a first lower copper foil, stacking and laminating the first upper copper foil, the semi-solidified film and the semi-finished product of the lamination stack together in a top-down sequence, or stacking and laminating the semi-finished product of the lamination stack, the semi-solidified film and the first lower copper foil together in a top-down sequence, or stacking and laminating the first upper copper foil, the semi-solidified film, the semi-finished product of the lamination stack, the semi-solidified film and the first lower copper foil together in a top-down sequence, and etching a circuit pattern on the first upper copper foil and/or the first lower copper foil;
s4, determining the implementation times (the times can be) of the S3 according to the requirement to obtain a laminated board;
s5, pasting a polymer protective film on the upper surface of the first upper copper foil positioned at the uppermost layer, and then fishing out a window groove by using a forming machine, wherein the window groove penetrates through the first lower copper foil positioned at the lowermost layer downwards, and the transverse cross section shape of the window groove is a rounded rectangle;
s6, pasting a high-temperature-resistant adhesive tape on the lower surface of the first lower copper foil positioned at the lowest layer and corresponding to the position of the window groove;
s7, taking a copper block matched with the window groove, wherein the transverse cross section of the copper block is rectangular with round corners, putting the copper block into the window groove, enabling the single-side long side of the copper block to be 0.12-0.18 mm smaller than the single-side long side of the window groove, enabling the single-side wide side of the copper block to be 0.12-0.18 mm smaller than the single-side wide side of the window groove, enabling the minimum distance between the round corners of the copper block and the corresponding round corners of the window groove to be 0.04-0.06 mm, and printing resin ink in a gap between the copper block and the outer wall and the inner wall of the window groove;
s8, removing the polymer protective film, and baking the laminated board to fix the red copper block in the laminated board through resin ink;
s9, removing the high-temperature-resistant adhesive tape, and brushing and grinding the upper surface of the first upper copper foil positioned at the uppermost layer and the lower surface of the first lower copper foil positioned at the lowermost layer;
s10, copper plating is carried out on the upper surface of the first upper copper foil positioned at the uppermost layer, the upper surface of the resin ink and the upper surface of the copper block to form a second upper copper foil, copper plating is carried out on the lower surface of the first lower copper foil positioned at the lowermost layer, the lower surface of the resin ink and the lower surface of the copper block to form a second lower copper foil, and circuit patterns are etched on the first upper copper foil positioned at the uppermost layer, the second upper copper foil, the first lower copper foil positioned at the lowermost layer and the second lower copper foil, so that a printed circuit board finished product with good heat dissipation performance is obtained.
Preferably, in step S4, S3 is performed 0 to 10 times.
The printed circuit board has good heat dissipation performance, and can be applied to products with higher heat dissipation requirements.
Drawings
Fig. 1 is a structural diagram of a substrate provided in step S1 of embodiment 1.
Fig. 2 is a structural diagram of the laminated board obtained in step S2 of example 1.
Fig. 3 is a structural view of the laminated board after the processing of step S3 of example 1.
Fig. 4 is a structural view of the laminated board after the processing of step S4 of example 1.
Fig. 5 is a structural view of the laminated board after the processing of step S5 of example 1.
Fig. 6 is a structural view of the laminated board after the processing of step S6 of example 1.
Fig. 7 is a structural view of the laminated board after the processing of step S7 of example 1.
Fig. 8 is a structural diagram of the printed wiring board finished product obtained through step S8 of example 1.
Fig. 9 is a structural diagram of the printed wiring board finished product obtained through step S10 of example 2.
Fig. 10 is a structural diagram of the finished printed wiring board obtained through step S10 of example 3.
Detailed Description
The invention will be further illustrated with reference to specific examples.
The substrates used in the following examples were supplied by table opto-electronic materials, inc., model number: EM-370 (D).
The following examples were used with semi-cured film supplied by table opto-electronic materials, inc., model number: EM-37B (D).
The polymer protective film used in the following examples was supplied by Shanghai Seille electronics materials Co., ltd., model number: 1210.
the high temperature resistant tape used in the following examples was supplied by taiwan four-dimensional precision materials, inc., model number: CM8C.
The resin inks used in the following examples were supplied by solar ink (su state) limited, model number: PHP-900 IR-10FE.
Example 1
The printed circuit board with good heat dissipation performance comprises a substrate, a semi-cured film 3, a first upper copper foil 4.1 and a first lower copper foil 4.2, wherein the substrate comprises an epoxy resin base material 1, a substrate upper copper foil 2.1 positioned on the upper surface of the epoxy resin base material 1 and a substrate lower copper foil 2.2 positioned on the lower surface of the epoxy resin base material 1, a layer of first upper copper foil 4.1 is arranged above the substrate, the semi-cured film 3 is arranged between the substrate upper copper foil 2.1 and the first upper copper foil 4.1, a layer of first lower copper foil 4.2 is arranged below the substrate, and the semi-cured film 3 is arranged between the substrate lower copper foil 2.2 and the first lower copper foil 4.2;
a window groove 5 is arranged between the first upper copper foil 4.1 and the first lower copper foil 4.2, the transverse cross section of the window groove 5 is in a round rectangle (namely, the corner of the window groove 5 is provided with a chamfer design), a red copper block 6 is arranged in the window groove 5, the transverse cross section of the red copper block 6 is in a round rectangle (namely, the corner of the red copper block 6 is provided with a chamfer design), the single-side long side of the red copper block 6 is 0.12-0.18 mm smaller than the single-side long side of the window groove 5, the single-side wide side of the red copper block 6 is 0.12-0.18 mm smaller than the single-side wide side of the window groove 5, the minimum distance between the round corner of the red copper block 6 and the corresponding round corner of the window groove 5 is 0.04-0.06 mm, and resin ink 7 is arranged between the red copper block 6 and the outer wall and the inner wall of the window groove 5;
a second upper copper foil 8.1 is arranged above the upper surface of the first upper copper foil 4.1, the upper surface of the resin ink 7 and the upper surface of the red copper block 6, and the second upper copper foil 8.1 is connected with the first upper copper foil 4.1 integrally; a second lower copper foil 8.2 is arranged below the lower surface of the first lower copper foil 4.2, the lower surface of the resin ink 7 and the lower surface of the red copper block 6, and the second lower copper foil 8.2 is connected with the first lower copper foil 4.2 into a whole;
circuit patterns are etched on the copper foil 2.1 on the substrate, the copper foil 2.2 under the substrate, the first upper copper foil 4.1, the first lower copper foil 4.2, the second upper copper foil 8.1 and the second lower copper foil 8.2.
The thickness of the epoxy resin base material 1 is 50-1000 micrometers, and the thicknesses of the copper foil 2.1 on the substrate and the copper foil 2.2 under the substrate are 12-60 micrometers.
The thickness of the prepreg sheet 3 is 50-100 micrometers.
The thicknesses of the first upper copper foil 4.1 and the first lower copper foil 4.2 are 12-17 micrometers.
On the transverse section of the window groove 5, the length of the long side of the fillet rectangle is 5-15 mm, the width of the wide side is 2-10 mm, and the fillet radius is 0.6-1.5 mm.
On the transverse section of the red copper block 6, the fillet radius of the fillet rectangle is 0.2-1 mm.
The manufacturing method of the printed circuit board with good heat dissipation performance comprises the following steps:
s1, providing a substrate, wherein the substrate comprises an epoxy resin base material 1, an upper substrate copper foil 2.1 positioned on the upper surface of the epoxy resin base material 1 and a lower substrate copper foil 2.2 positioned on the lower surface of the epoxy resin base material 1, and circuit patterns are etched on the upper substrate copper foil 2.1 and the lower substrate copper foil 2.2, as shown in FIG. 1;
s2, taking a prepreg 3, taking copper foil to manufacture a first upper copper foil 4.1 and a first lower copper foil 4.2, stacking and laminating the first upper copper foil 4.1, the prepreg 3, the substrate, the prepreg 3 and the first lower copper foil 4.2 together in sequence from top to bottom to form a laminated board, and etching circuit patterns on the first upper copper foil 4.1 and the first lower copper foil 4.2, as shown in FIG. 2;
s3, pasting a polymer protective film 21 on the upper surface of the first upper copper foil 4.1, wherein the polymer protective film can protect the upper surface of the first upper copper foil 4.1, then fishing out a window groove 5 by using a forming machine, enabling the window groove 5 to penetrate through the first lower copper foil 4.2 downwards, and enabling the transverse cross section of the window groove 5 to be in a round-corner rectangle shape as shown in FIG. 3;
s4, pasting a high-temperature-resistant adhesive tape 22 on the lower surface of the first lower copper foil 4.2 and corresponding to the position of the window groove 5, so that the red copper block 6 can be placed in the window groove 5 to be adhered with the high-temperature-resistant adhesive tape 22, and the red copper block 6 is prevented from being carried away when the resin ink 7 is printed, as shown in FIG. 4;
s5, taking a red copper block 6 matched with the window groove 5, wherein the transverse section of the red copper block 6 is in a round angle rectangle, putting the red copper block 6 into the window groove 5, enabling the single-side long side of the red copper block 6 to be 0.12-0.18 mm smaller than the single-side long side of the window groove 5, enabling the single-side wide side of the red copper block 6 to be 0.12-0.18 mm smaller than the single-side wide side of the window groove 5, enabling the minimum distance between the round angle of the red copper block 6 and the corresponding round angle of the window groove 5 to be 0.04-0.06 mm, and preventing the red copper block 6 from excessively rotating or shifting in the horizontal direction in the process of putting into the window groove 5, and printing resin ink 7 in a gap between the red copper block 6 and the outer wall and the inner wall of the window groove 5, as shown in FIG. 5;
s6, removing the polymer protective film 21, and baking the laminated board to fix the copper block 6 in the laminated board through the resin ink 7, as shown in FIG. 6;
s7, removing the high-temperature-resistant adhesive tape 22, and brushing and grinding the upper surface of the first upper copper foil 4.1 and the lower surface of the first lower copper foil 4.2, as shown in FIG. 7;
s8, copper plating is performed on the upper surface of the first upper copper foil 4.1, the upper surface of the resin ink 7 and the upper surface of the red copper block 6 to form a second upper copper foil 8.1, copper plating is performed on the lower surface of the first lower copper foil 4.2, the lower surface of the resin ink 7 and the lower surface of the red copper block 6 to form a second lower copper foil 8.2, and circuit patterns are etched on the first upper copper foil 4.1, the second upper copper foil 8.1, the first lower copper foil 4.2 and the second lower copper foil 8.2, so that a printed circuit board finished product with good heat dissipation performance is obtained, as shown in FIG. 8.
Example 2
As shown in fig. 9, the printed circuit board with good heat dissipation performance comprises a substrate, a prepreg 3, a first upper copper foil 4.1 and a first lower copper foil 4.2, wherein the substrate comprises an epoxy resin base material 1, a substrate upper copper foil 2.1 positioned on the upper surface of the epoxy resin base material 1 and a substrate lower copper foil 2.2 positioned on the lower surface of the epoxy resin base material 1, three layers of first upper copper foils 4.1 are arranged above the substrate, the prepreg 3 is arranged between two adjacent layers of first upper copper foils 4.1 and between the substrate upper copper foil 2.1 and the adjacent first upper copper foil 4.1, a layer of first lower copper foil 4.2 is arranged below the substrate, and the prepreg 3 is arranged between the substrate lower copper foil 2.2 and the first lower copper foil 4.2;
a window groove 5 is arranged between the first upper copper foil 4.1 and the first lower copper foil 4.2 which are positioned at the uppermost layer, the transverse cross section of the window groove 5 is in a round rectangle (namely, the corner of the window groove 5 is provided with a chamfer design), a red copper block 6 is arranged in the window groove 5, the transverse cross section of the red copper block 6 is in a round rectangle (namely, the corner of the red copper block 6 is provided with a chamfer design), the single-side long side of the red copper block 6 is 0.12-0.18 mm smaller than the single-side long side of the window groove 5, the single-side wide side of the red copper block 6 is 0.12-0.18 mm smaller than the single-side wide side of the window groove 5, the minimum distance between the round corner of the red copper block 6 and the corresponding round corner of the window groove 5 is 0.04-0.06 mm, and a resin ink 7 is arranged between the red copper block 6 and the outer wall and the inner wall of the window groove 5;
a second upper copper foil 8.1 is arranged above the upper surface of the first upper copper foil 4.1 positioned at the uppermost layer, the upper surface of the resin ink 7 and the upper surface of the red copper block 6, and the second upper copper foil 8.1 is connected with the first upper copper foil 4.1 positioned at the uppermost layer into a whole; a second lower copper foil 8.2 is arranged below the lower surface of the first lower copper foil 4.2, the lower surface of the resin ink 7 and the lower surface of the red copper block 6, and the second lower copper foil 8.2 is connected with the first lower copper foil 4.2 into a whole;
circuit patterns are etched on the copper foil 2.1 on the substrate, the copper foil 2.2 under the substrate, the first upper copper foil 4.1, the first lower copper foil 4.2, the second upper copper foil 8.1 and the second lower copper foil 8.2.
The thickness of the epoxy resin base material 1 is 50-1000 micrometers, and the thicknesses of the copper foil 2.1 on the substrate and the copper foil 2.2 under the substrate are 12-60 micrometers.
The thickness of the prepreg sheet 3 is 50-100 micrometers.
The thicknesses of the first upper copper foil 4.1 and the first lower copper foil 4.2 are 12-17 micrometers.
On the transverse section of the window groove 5, the length of the long side of the fillet rectangle is 5-15 mm, the width of the wide side is 2-10 mm, and the fillet radius is 0.6-1.5 mm.
On the transverse section of the red copper block 6, the fillet radius of the fillet rectangle is 0.2-1 mm.
The manufacturing method of the printed circuit board with good heat dissipation performance comprises the following steps:
s1, providing a substrate, wherein the substrate comprises an epoxy resin base material 1, an upper substrate copper foil 2.1 positioned on the upper surface of the epoxy resin base material 1 and a lower substrate copper foil 2.2 positioned on the lower surface of the epoxy resin base material 1, and etching circuit patterns on the upper substrate copper foil 2.1 and the lower substrate copper foil 2.2;
s2, taking a prepreg 3, taking copper foil to manufacture a first upper copper foil 4.1 and a first lower copper foil 4.2, stacking and laminating the first upper copper foil 4.1, the prepreg 3, the substrate, the prepreg 3 and the first lower copper foil 4.2 together in sequence from top to bottom to form a laminated board semi-finished product, and etching circuit patterns on the first upper copper foil 4.1 and the first lower copper foil 4.2;
s3, stacking and pressing the first upper copper foil 4.1, the semi-cured film 3 and the semi-finished product of the lamination plate together in sequence from top to bottom, and etching a circuit pattern on the first upper copper foil 4.1;
s4, determining the implementation times of the step S3 as secondary according to requirements to obtain a laminated board;
s5, pasting a polymer protective film 21 on the upper surface of the first upper copper foil 4.1 positioned at the uppermost layer, wherein the polymer protective film can protect the upper surface of the first upper copper foil 4.1, then fishing out a window groove 5 by using a forming machine, wherein the window groove 5 penetrates through the first lower copper foil 4.2 downwards, and the transverse cross section of the window groove 5 is in a round-corner rectangle shape;
s6, pasting a high-temperature-resistant adhesive tape 22 on the lower surface of the first lower copper foil 4.2 and corresponding to the position of the window groove 5, so that the red copper block 6 can be placed in the window groove 5 to be adhered with the high-temperature-resistant adhesive tape 22, and the red copper block 6 is prevented from being carried away when the resin ink 7 is printed;
s7, taking a red copper block 6 matched with the window groove 5, wherein the transverse cross section of the red copper block 6 is in a round angle rectangle, putting the red copper block 6 into the window groove 5, enabling the single-side long side of the red copper block 6 to be 0.12-0.18 mm smaller than the single-side long side of the window groove 5, enabling the single-side wide side of the red copper block 6 to be 0.12-0.18 mm smaller than the single-side wide side of the window groove 5, enabling the minimum distance between the round angle of the red copper block 6 and the corresponding round angle of the window groove 5 to be 0.04-0.06 mm, and preventing the red copper block 6 from excessively rotating or shifting in the horizontal direction in the process of putting into the window groove 5, and printing resin ink 7 in a gap between the red copper block 6 and the outer wall and the inner wall of the window groove 5;
s8, removing the polymer protective film 21, and baking the laminated board to fix the copper block 6 in the laminated board through the resin ink 7;
s9, removing the high-temperature-resistant adhesive tape 22, and brushing and grinding the upper surface of the first upper copper foil 4.1 and the lower surface of the first lower copper foil 4.2 positioned at the uppermost layer;
s10, copper plating is performed on the upper surface of the first upper copper foil 4.1, the upper surface of the resin ink 7 and the upper surface of the red copper block 6 which are positioned at the uppermost layer to form a second upper copper foil 8.1, copper plating is performed on the lower surface of the first lower copper foil 4.2, the lower surface of the resin ink 7 and the lower surface of the red copper block 6 to form a second lower copper foil 8.2, and circuit patterns are etched on the first upper copper foil 4.1, the second upper copper foil 8.1, the first lower copper foil 4.2 and the second lower copper foil 8.2 which are positioned at the uppermost layer to obtain a printed wiring board finished product with good heat dissipation performance, as shown in FIG. 9.
Example 3
The printed circuit board with good heat dissipation performance comprises a substrate, a prepreg 3, a first upper copper foil 4.1 and a first lower copper foil 4.2, wherein the substrate comprises an epoxy resin substrate 1, a substrate upper copper foil 2.1 positioned on the upper surface of the epoxy resin substrate 1 and a substrate lower copper foil 2.2 positioned on the lower surface of the epoxy resin substrate 1, three layers of first upper copper foils 4.1 are arranged above the substrate, prepreg 3 is arranged between two adjacent layers of first upper copper foils 4.1 and between the substrate upper copper foil 2.1 and the adjacent first upper copper foil 4.1, three layers of first lower copper foils 4.2 are arranged below the substrate, and half-cured films 3 are arranged between two adjacent layers of first lower copper foils 4.2 and between the substrate lower copper foils 2.2 and the adjacent first lower copper foils 4.2;
a window groove 5 is arranged between the first upper copper foil 4.1 positioned at the uppermost layer and the first lower copper foil 4.2 positioned at the lowermost layer, the transverse cross section of the window groove 5 is in a round rectangle (namely, the corner of the window groove 5 is provided with a chamfer design), a red copper block 6 is arranged in the window groove 5, the transverse cross section of the red copper block 6 is in a round rectangle (namely, the corner of the red copper block 6 is provided with a chamfer design), the single-side long side of the red copper block 6 is 0.12-0.18 mm smaller than the single-side long side of the window groove 5, the single-side wide side of the red copper block 6 is 0.12-0.18 mm smaller than the single-side wide side of the window groove 5, the minimum distance between the round corner of the red copper block 6 and the corresponding round corner of the window groove 5 is 0.04-0.06 mm, and a resin ink 7 is arranged between the red copper block 6 and the outer wall and the inner wall of the window groove 5;
a second upper copper foil 8.1 is arranged above the upper surface of the first upper copper foil 4.1 positioned at the uppermost layer, the upper surface of the resin ink 7 and the upper surface of the red copper block 6, and the second upper copper foil 8.1 is connected with the first upper copper foil 4.1 positioned at the uppermost layer into a whole; a second lower copper foil 8.2 is arranged below the lower surface of the first lower copper foil 4.2 positioned at the lowest layer, the lower surface of the resin ink 7 and the lower surface of the red copper block 6, and the second lower copper foil 8.2 is connected with the first lower copper foil 4.2 positioned at the lowest layer into a whole;
circuit patterns are etched on the copper foil 2.1 on the substrate, the copper foil 2.2 under the substrate, the first upper copper foil 4.1, the first lower copper foil 4.2, the second upper copper foil 8.1 and the second lower copper foil 8.2.
The thickness of the epoxy resin base material 1 is 50-1000 micrometers, and the thicknesses of the copper foil 2.1 on the substrate and the copper foil 2.2 under the substrate are 12-60 micrometers.
The thickness of the prepreg sheet 3 is 50-100 micrometers.
The thicknesses of the first upper copper foil 4.1 and the first lower copper foil 4.2 are 12-17 micrometers.
On the transverse section of the window groove 5, the length of the long side of the fillet rectangle is 5-15 mm, the width of the wide side is 2-10 mm, and the fillet radius is 0.6-1.5 mm.
On the transverse section of the red copper block 6, the fillet radius of the fillet rectangle is 0.2-1 mm.
The manufacturing method of the printed circuit board with good heat dissipation performance comprises the following steps:
s1, providing a substrate, wherein the substrate comprises an epoxy resin base material 1, an upper substrate copper foil 2.1 positioned on the upper surface of the epoxy resin base material 1 and a lower substrate copper foil 2.2 positioned on the lower surface of the epoxy resin base material 1, and etching circuit patterns on the upper substrate copper foil 2.1 and the lower substrate copper foil 2.2;
s2, taking a prepreg 3, taking copper foil to manufacture a first upper copper foil 4.1 and a first lower copper foil 4.2, stacking and laminating the first upper copper foil 4.1, the prepreg 3, the substrate, the prepreg 3 and the first lower copper foil 4.2 together in sequence from top to bottom to form a laminated board semi-finished product, and etching circuit patterns on the first upper copper foil 4.1 and the first lower copper foil 4.2;
s3, stacking and pressing the first upper copper foil 4.1, the semi-solidified film 3, the laminated plate semi-finished product, the semi-solidified film 3 and the first lower copper foil 4.2 together in sequence from top to bottom, and etching circuit patterns on the first upper copper foil 4.1 and the first lower copper foil 4.2;
s4, determining the implementation times of the step S3 as secondary according to requirements to obtain a laminated board;
s5, pasting a polymer protective film 21 on the upper surface of the first upper copper foil 4.1 positioned at the uppermost layer, wherein the polymer protective film can protect the upper surface of the first upper copper foil 4.1, then fishing out a window groove 5 by using a forming machine, wherein the window groove 5 downwards penetrates through the first lower copper foil 4.2 positioned at the lowermost layer, and the transverse cross section shape of the window groove 5 is a round rectangle;
s6, pasting a high-temperature-resistant adhesive tape 22 on the lower surface of the first lower copper foil 4.2 positioned at the lowest layer and corresponding to the position of the window groove 5, so that the red copper block 6 can be adhered to the high-temperature-resistant adhesive tape 22 when being placed in the window groove 5, and the red copper block 6 is prevented from being carried away when the resin ink 7 is printed;
s7, taking a red copper block 6 matched with the window groove 5, wherein the transverse cross section of the red copper block 6 is in a round angle rectangle, putting the red copper block 6 into the window groove 5, enabling the single-side long side of the red copper block 6 to be 0.12-0.18 mm smaller than the single-side long side of the window groove 5, enabling the single-side wide side of the red copper block 6 to be 0.12-0.18 mm smaller than the single-side wide side of the window groove 5, enabling the minimum distance between the round angle of the red copper block 6 and the corresponding round angle of the window groove 5 to be 0.04-0.06 mm, and preventing the red copper block 6 from excessively rotating or shifting in the horizontal direction in the process of putting into the window groove 5, and printing resin ink 7 in a gap between the red copper block 6 and the outer wall and the inner wall of the window groove 5;
s8, removing the polymer protective film 21, and baking the laminated board to fix the copper block 6 in the laminated board through the resin ink 7;
s9, removing the high-temperature-resistant adhesive tape 22, and brushing and grinding the upper surface of the first upper copper foil 4.1 positioned at the uppermost layer and the lower surface of the first lower copper foil 4.2 positioned at the lowermost layer;
s10, copper plating is performed on the upper surface of the first upper copper foil 4.1 positioned at the uppermost layer, the upper surface of the resin ink 7 and the upper surface of the red copper block 6 to form a second upper copper foil 8.1, copper plating is performed on the lower surface of the first lower copper foil 4.2 positioned at the lowermost layer, the lower surface of the resin ink 7 and the lower surface of the red copper block 6 to form a second lower copper foil 8.2, and circuit patterns are etched on the first upper copper foil 4.1 positioned at the uppermost layer, the second upper copper foil 8.1, the first lower copper foil 4.2 positioned at the lowermost layer and the second lower copper foil 8.2, so that a printed wiring board finished product with good heat dissipation performance is obtained, as shown in FIG. 10.
The invention can timely radiate heat generated by the printed circuit board through the copper block 6, and can ensure the requirements of high density and high electrical property.
In the printed circuit board finished product, the number of layers of the substrate can be increased as required.
Claims (8)
1. The utility model provides a printed wiring board that heat dispersion is good, includes base plate, semi-solid film (3), first upper copper foil (4.1) and first copper foil (4.2), the base plate includes epoxy base material (1), be located on the upper surface of epoxy base material (1) copper foil (2.1) on the base plate and be located on the lower surface of epoxy base material (1) copper foil (2.2) under the base plate, be equipped with at least one deck first upper copper foil (4.1) above the base plate, all be equipped with semi-solid film (3) between two adjacent decks of first upper copper foil (4.1) and between copper foil (2.1) on the base plate and the adjacent first upper copper foil (4.1), be equipped with at least one deck first copper foil (4.2) below the base plate, all be equipped with semi-solid film (3) between two adjacent decks of first copper foil (4.2) and adjacent first copper foil (4.2) under the base plate;
the method is characterized in that: a window groove (5) is formed between a first upper copper foil (4.1) positioned at the uppermost layer and a first lower copper foil (4.2) positioned at the lowermost layer, the transverse cross section of the window groove (5) is in a round rectangle, a red copper block (6) is arranged in the window groove (5), the transverse cross section of the red copper block (6) is in a round rectangle, the single-side long side of the red copper block (6) is 0.12-0.18 mm smaller than the single-side long side of the window groove (5), the single-side wide side of the red copper block (6) is 0.12-0.18 mm smaller than the single-side wide side of the window groove (5), the minimum distance between the round corners of the red copper block (6) and the corresponding round corners of the window groove (5) is 0.04-0.06 mm, and resin ink (7) is arranged in a gap between the red copper block (6) and the outer wall and the inner wall of the window groove (5);
a second upper copper foil (8.1) is arranged above the upper surface of the first upper copper foil (4.1) positioned at the uppermost layer, the upper surface of the resin ink (7) and the upper surface of the red copper block (6), and the second upper copper foil (8.1) is connected with the first upper copper foil (4.1) positioned at the uppermost layer into a whole; a second lower copper foil (8.2) is arranged below the lower surface of the first lower copper foil (4.2) positioned at the lowest layer, the lower surface of the resin ink (7) and the lower surface of the red copper block (6), and the second lower copper foil (8.2) is connected with the first lower copper foil (4.2) positioned at the lowest layer into a whole;
circuit patterns are etched on the copper foil (2.1) on the substrate, the copper foil (2.2) under the substrate, the first upper copper foil (4.1), the first lower copper foil (4.2), the second upper copper foil (8.1) and the second lower copper foil (8.2).
2. The printed wiring board with good heat dissipation performance as defined in claim 1, wherein: the thickness of the epoxy resin base material (1) is 50-1000 micrometers, and the thicknesses of the copper foil (2.1) on the substrate and the copper foil (2.2) under the substrate are 12-60 micrometers.
3. The printed wiring board with good heat dissipation performance as defined in claim 1, wherein: the thickness of the prepreg (3) is 50-100 micrometers.
4. The printed wiring board with good heat dissipation performance as defined in claim 1, wherein: the thicknesses of the first upper copper foil (4.1) and the first lower copper foil (4.2) are 12-17 micrometers.
5. The printed wiring board with good heat dissipation performance as defined in claim 1, wherein: on the transverse section of the window groove (5), the length of the long side of the fillet rectangle is 5-15 mm, the width of the wide side is 2-10 mm, and the fillet radius is 0.6-1.5 mm.
6. The printed wiring board with good heat dissipation performance as defined in claim 1, wherein: on the transverse section of the red copper block (6), the fillet radius of the fillet rectangle is 0.2-1 mm.
7. The method for manufacturing a printed wiring board excellent in heat dissipation performance as claimed in any one of claims 1 to 6, characterized in that the method comprises the steps of:
s1, providing a substrate, wherein the substrate comprises an epoxy resin base material (1), an on-substrate copper foil (2.1) positioned on the upper surface of the epoxy resin base material (1) and an under-substrate copper foil (2.2) positioned on the lower surface of the epoxy resin base material (1), and circuit patterns are etched on the on-substrate copper foil (2.1) and the under-substrate copper foil (2.2);
s2, taking a semi-solidified film (3), taking copper foil to manufacture a first upper copper foil (4.1) and a first lower copper foil (4.2), stacking and laminating the first upper copper foil (4.1), the semi-solidified film (3), a substrate, the semi-solidified film (3) and the first lower copper foil (4.2) together in sequence from top to bottom to form a laminated board semi-finished product, and etching circuit patterns on the first upper copper foil (4.1) and the first lower copper foil (4.2);
s3, stacking and laminating the first upper copper foil (4.1), the semi-solidified film (3) and the semi-finished laminated board together in a top-down sequence, or stacking and laminating the semi-finished laminated board, the semi-solidified film (3) and the first lower copper foil (4.2) together in a top-down sequence, or stacking and laminating the first upper copper foil (4.1), the semi-solidified film (3), the semi-finished laminated board, the semi-solidified film (3) and the first lower copper foil (4.2) together in a top-down sequence, and etching circuit patterns on the first upper copper foil (4.1) and/or the first lower copper foil (4.2);
s4, determining the implementation times of S3 according to requirements to obtain a laminated board;
s5, pasting a polymer protective film (21) on the upper surface of the first upper copper foil (4.1) positioned at the uppermost layer, then fishing out a window groove (5) by using a forming machine, and enabling the window groove (5) to penetrate through the first lower copper foil (4.2) positioned at the lowermost layer downwards, wherein the transverse cross section of the window groove (5) is in a round-corner rectangle shape;
s6, pasting a high-temperature-resistant adhesive tape (22) on the lower surface of the first lower copper foil (4.2) positioned at the lowest layer and corresponding to the window groove (5);
s7, taking a red copper block (6) matched with the window groove (5), wherein the transverse cross section of the red copper block (6) is in a round angle rectangle, putting the red copper block (6) into the window groove (5) so that the single-side long side of the red copper block (6) is 0.12-0.18 mm smaller than the single-side long side of the window groove (5), the single-side wide side of the red copper block (6) is 0.12-0.18 mm smaller than the single-side wide side of the window groove (5), and the minimum distance between the round angle of the red copper block (6) and the corresponding round angle of the window groove (5) is 0.04-0.06 mm, and printing resin ink (7) in a gap between the red copper block (6) and the outer wall and the inner wall of the window groove (5);
s8, removing the polymer protective film (21), and baking the laminated board to fix the copper block (6) in the laminated board through the resin ink (7);
s9, stripping the high-temperature-resistant adhesive tape (22), and brushing and grinding the upper surface of the first upper copper foil (4.1) positioned at the uppermost layer and the lower surface of the first lower copper foil (4.2) positioned at the lowermost layer;
s10, copper plating is carried out on the upper surface of the first upper copper foil (4.1) positioned at the uppermost layer, the upper surface of the resin ink (7) and the upper surface of the red copper block (6) to form a second upper copper foil (8.1), copper plating is carried out on the lower surface of the first lower copper foil (4.2) positioned at the lowermost layer, the lower surface of the resin ink (7) and the lower surface of the red copper block (6) to form a second lower copper foil (8.2), and circuit patterns are etched on the first upper copper foil (4.1), the second upper copper foil (8.1) positioned at the uppermost layer, the first lower copper foil (4.2) positioned at the lowermost layer and the second lower copper foil (8.2) to obtain a printed circuit board finished product with good heat dissipation performance.
8. The method for manufacturing a printed wiring board excellent in heat dissipation performance as set forth in claim 7, wherein: in step S4, the number of times S3 is performed is 0 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310901267.7A CN117177436A (en) | 2023-07-20 | 2023-07-20 | Printed wiring board with good heat dissipation performance and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310901267.7A CN117177436A (en) | 2023-07-20 | 2023-07-20 | Printed wiring board with good heat dissipation performance and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117177436A true CN117177436A (en) | 2023-12-05 |
Family
ID=88942012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310901267.7A Pending CN117177436A (en) | 2023-07-20 | 2023-07-20 | Printed wiring board with good heat dissipation performance and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117177436A (en) |
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2023
- 2023-07-20 CN CN202310901267.7A patent/CN117177436A/en active Pending
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