CN1171723C - 物件表层粘覆钛金属层的制造方法 - Google Patents

物件表层粘覆钛金属层的制造方法 Download PDF

Info

Publication number
CN1171723C
CN1171723C CNB011350628A CN01135062A CN1171723C CN 1171723 C CN1171723 C CN 1171723C CN B011350628 A CNB011350628 A CN B011350628A CN 01135062 A CN01135062 A CN 01135062A CN 1171723 C CN1171723 C CN 1171723C
Authority
CN
China
Prior art keywords
layer
titanium coating
adhesive layer
article surface
surface adhered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB011350628A
Other languages
English (en)
Other versions
CN1420018A (zh
Inventor
孙汇鑫
陈清平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CNB011350628A priority Critical patent/CN1171723C/zh
Priority to PCT/CN2002/000787 priority patent/WO2003041958A1/zh
Publication of CN1420018A publication Critical patent/CN1420018A/zh
Application granted granted Critical
Publication of CN1171723C publication Critical patent/CN1171723C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/008Soldering within a furnace
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/14Titanium or alloys thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

本发明公开一种物件表层粘覆钛金属层的制造方法,其加工步骤包括有:a.在容室里设有加热装置及扩散层;b.采用具有贯孔的工作台,工作台的贯孔连接抽气装置;c.在物件表层置放粘剂层(常温下为固态)及钛金属层;d.通过加热装置及扩散层使容室内温度升高至预定的温度,并使加热装置所产生的热力透过扩散层得以均匀地传导至钛金属层、粘剂层、物件,且使粘剂层形成熔融状态及使容室内空气变为稀薄;e.通过抽气装置经由贯孔进行抽气动作,使钛金属层及粘剂层同时受到吸吮而平整、牢固地粘覆在物件表层。

Description

物件表层粘覆钛金属层的制造方法
技术领域
本发明是涉及一种物件表层粘覆钛金属层的制造方法,特别是针对一般金属材质或非金属材质所制成的物件表层粘覆钛金属层的制造方法,通过此粘覆钛金属层的制造方法,可促使物件与钛金属的粘覆得以更加平整、牢固。
背景技术
对目前坊间已普遍存在的粘覆方式为在常温下直接在钛金属层下缘涂抹粘着剂,并使钛金属层与物件粘合(如图1所示)。但是,此一粘覆方式存有如下弊端:
1.如图1所示,在粘覆时,必需先在钛金属层93下缘涂抹层粘着剂92,为此,除造成涂抹不均匀外,并浪费工时。
2.在常温下进行粘覆工作,其空气密度高,易造成物件91与钛金属层93间存有气孔,并使其粘覆不能平整、牢固。
发明内容
本发明的目的是实现一种物件表层粘覆钛金属层的制造方法。该方法可促使物件与钛金属的粘覆更加平整、牢固。
为了实现上述目的,本发明采取以下技术方案:这种物件表层粘覆钛金属层的制造方法包括下述步骤:a、在容室里设有加热装置及扩散层。b、并在工作台预设一道或一道以上的贯孔,工作台的贯孔连接抽气装置。c、在物件表层置放粘剂层(常温下为固态)及钛金属层。d、通过加热装置及扩散层促使容室内温度升高至某一预定的温度,并使热力得以均匀地传导至钛金属层、粘剂层、物件,且使粘剂层形成熔融状态及使容室内空气变为稀薄。e、通过贯孔连接抽气装置进行抽气动作,使钛金属层与粘剂层同时受到抽气装置的吸吮,而平整、牢固地粘覆在物件表层。
在本发明的方法中,该粘剂层在常温下为固态。
在本发明的方法中,该粘剂层可为聚烯烃(POLYOLEFIN)。
在本发明的方法中,该粘剂层可为聚酰胺(POLYAMIDE)。
在本发明的方法中,该粘剂层可为聚氨基甲酸乙酯(POLYURETHANE)。
附图说明
图1为已知的粘覆方式示意图
图2为本发明的流程方块图
图3为本发明的加工步骤示意图
图4为本发明另一加工步骤示意图
具体实施方式
本发明所提供一种物件表层粘覆钛金属层的制造方法,如图2、图3、图4所示,其加工步骤为包括有:
a.容室(70)里设有加热装置(60)及扩散层(50);
b.工作台(10)的贯孔(11)可连接抽气装置(80);
c.物件表层置放粘剂层(30)(常温下为固态)及钛金属层(40);
d.通过加热装置(60)及扩散层(50)使容室(70)内温度升高至某一预定的温度,并使加热装置(60)所产生的热力透过扩散层(50)得以均匀地传导至钛金属层(40)、粘剂层(30)、物件(20),且使粘剂层(30)形成熔融状态及使容室(70)内空气变为稀薄;
e.通过抽气装置(80)经由贯孔(11)进行抽气动作,使钛金属层(40)及粘剂层(30)同时受到吸吮而平整、牢固地粘覆在物件(20)表层。

Claims (5)

1.一种物件表层粘覆钛金属层的制造方法,其特征在于:该方法的加工步骤包括有:
a.在容室里设有加热装置及扩散层;
b.采用具有贯孔的工作台,工作台的贯孔连接抽气装置;
c.在物件表层置放粘剂层及钛金属层;
d.通过加热装置及扩散层使容室内温度升高至预定的温度,并使加热装置所产生的热力透过扩散层得以均匀地传导至钛金属层、粘剂层、物件,且使粘剂层形成熔融状态及使容室内空气变为稀薄;
e.通过抽气装置经由贯孔进行抽气动作,使钛金属层及粘剂层同时受到吸吮而平整、牢固地粘覆在物件表层。
2.如权利要求1所述的物件表层粘覆钛金属层的制造方法,其特征在于:该粘剂层在常温下为固态。
3.如权利要求1所述的物件表层粘覆钛金属层的制造方法,其特征在于:其中该粘剂层为聚烯烃。
4.如权利要求1所述的物件表层粘覆钛金属层的制造方法,其特征在于:该粘剂层为聚酰胺。
5.如权利要求1所述的物件表层粘覆钛金属层的制造方法,其特征在于:该粘剂层为聚氨基甲酸乙酯。
CNB011350628A 2001-11-16 2001-11-16 物件表层粘覆钛金属层的制造方法 Expired - Fee Related CN1171723C (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNB011350628A CN1171723C (zh) 2001-11-16 2001-11-16 物件表层粘覆钛金属层的制造方法
PCT/CN2002/000787 WO2003041958A1 (fr) 2001-11-16 2002-11-05 Procede d'adhesion d'une couche de metal de titane a une surface de substrat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB011350628A CN1171723C (zh) 2001-11-16 2001-11-16 物件表层粘覆钛金属层的制造方法

Publications (2)

Publication Number Publication Date
CN1420018A CN1420018A (zh) 2003-05-28
CN1171723C true CN1171723C (zh) 2004-10-20

Family

ID=4672924

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB011350628A Expired - Fee Related CN1171723C (zh) 2001-11-16 2001-11-16 物件表层粘覆钛金属层的制造方法

Country Status (2)

Country Link
CN (1) CN1171723C (zh)
WO (1) WO2003041958A1 (zh)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5921306B2 (ja) * 1979-11-24 1984-05-18 河西工業株式会社 積層樹脂成形品の貼着加工方法
JP3586840B2 (ja) * 1994-08-31 2004-11-10 テイ・エス テック株式会社 部分接着積層材の製造方法及び装置
JPH08332646A (ja) * 1995-06-06 1996-12-17 Meiki Co Ltd 真空積層装置および真空積層方法

Also Published As

Publication number Publication date
CN1420018A (zh) 2003-05-28
WO2003041958A1 (fr) 2003-05-22

Similar Documents

Publication Publication Date Title
EP1122794A3 (en) Semiconductor device and manufacturing method thereof
CN1273555C (zh) 具有角锥体结构的胶粘剂层与可剥离衬里
US4664739A (en) Removal of semiconductor wafers from dicing film
CN1284839C (zh) 用于临时性粘附陶瓷电子器件中使用的生片材的粘合带和制备陶瓷电子器件的方法
EP0817254A3 (en) Semiconductor device and methods for producing and mounting the semiconductor device
CN101918906A (zh) 具有非粘性表面的热接口
MY144179A (en) Wafer-processing tape and method of producing the same
CN1157779C (zh) 一种处理装入智能插卡的削薄的芯片的方法
CN1171723C (zh) 物件表层粘覆钛金属层的制造方法
CN115172229A (zh) 一种从激光改质后的晶体上剥离晶片的全自动装置
CA2319589A1 (en) Mechanical handling systems for laser capture microdissection
EP1947685A3 (en) Semiconductor device having fluorine-added carbon dielectric film and method of fabricating the same
US20030047270A1 (en) Method for adhering a titanium layer on material
CN1577778A (zh) 半导体器件的制造方法及半导体制造装置
JP2019212810A (ja) ウェーハの加工方法
CN110330918A (zh) 一种用于uv膜的可快速失去粘性的uv胶配方、uv膜
RU110742U1 (ru) Многослойное защитное энергосберегающее стекло
JP2004531061A (ja) 複合体から電子部品を分割する方法
CN210143160U (zh) 一种印刷电路板用线路预刻组件
JPH07111274A (ja) 急速硬化マニホルド
EP0776351B1 (en) Laminate for precise application of graphics to a substrate
JP4810722B2 (ja) 孔明け用滑剤シート及び孔明け加工法
JPH03267171A (ja) 塗膜保護方法
US4761310A (en) Method of bonding an oil-based ceramic paint to a surface of a glass sheet
JPH0313290A (ja) レーザ加工装置

Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee