CN117062347A - Method for uncovering area of closed cavity of printed circuit board - Google Patents
Method for uncovering area of closed cavity of printed circuit board Download PDFInfo
- Publication number
- CN117062347A CN117062347A CN202311086938.5A CN202311086938A CN117062347A CN 117062347 A CN117062347 A CN 117062347A CN 202311086938 A CN202311086938 A CN 202311086938A CN 117062347 A CN117062347 A CN 117062347A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- protective film
- acrylic substrate
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 92
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 90
- 230000001681 protective effect Effects 0.000 claims abstract description 81
- 238000003825 pressing Methods 0.000 claims abstract description 17
- 239000012790 adhesive layer Substances 0.000 claims description 21
- 238000010438 heat treatment Methods 0.000 claims description 19
- 239000003292 glue Substances 0.000 claims description 12
- 239000010410 layer Substances 0.000 claims description 12
- 238000003698 laser cutting Methods 0.000 claims description 9
- 238000004080 punching Methods 0.000 claims description 4
- 229920002799 BoPET Polymers 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000011505 plaster Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 9
- 239000002390 adhesive tape Substances 0.000 description 3
- -1 acryl Chemical group 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to a method for uncovering a closed cavity area of a printed circuit board, which comprises the following steps: providing a printed circuit board, processing a positioning hole on a connecting sheet, processing a window and a positioning hole on a protective film, processing a positioning hole on a first acrylic substrate, processing a positioning column base hole on a second acrylic substrate, taking a third acrylic substrate, assembling a positioning jig, positioning and fixing the printed circuit board and the protective film on the positioning jig, positioning and fixing the connecting sheet, and pressing and uncovering. The uncovering method can greatly improve the product yield, reduce the cost, has simple steps and is easy to operate.
Description
Technical Field
The invention belongs to the technical field of manufacturing methods of printed circuit boards, and particularly discloses a method for uncovering a closed cavity area of a printed circuit board.
Background
At present, with the trend of the chip assembly technology becoming more and more, many products are developed towards light, thin, short and small, but the functions are also more and more, so that the end customer design needs to sink the chip into the printed circuit board to reduce the thickness of the assembled module, and the cavity design has to be used. The process is very challenging to the process of uncovering the cavity area of the printed circuit board, particularly the process of uncovering the closed cavity, and because the uncovering area is arranged in the middle of the printed circuit board, no force point can be used for uncovering, if the metal blade is manually used for uncovering, the conductors near the cavity and in the cavity are damaged, the yield is greatly reduced, and the efficiency is very low.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide the method for uncovering the sealed cavity area of the printed circuit board, which can greatly improve the product yield, reduce the cost, has simple steps and is easy to operate.
According to the technical scheme provided by the invention, the method for uncovering the closed cavity area of the printed circuit board comprises the following steps:
s1, taking a printed circuit board to be uncovered, wherein a printed circuit board positioning hole is pre-processed on the printed circuit board outside a corresponding cover plate area, and an uncovering groove is pre-processed on the printed circuit board at the edge of the corresponding cover plate area, wherein the depth of the uncovering groove is smaller than the thickness of the printed circuit board;
s2, taking a connecting sheet, and processing a connecting sheet positioning hole on the connecting sheet, wherein the central positions of the connecting sheet positioning hole and the printed circuit board positioning hole are the same, and the apertures of the connecting sheet positioning hole and the printed circuit board positioning hole are equal;
s3, taking a protective film, wherein the protective film comprises a strippable adhesive layer, a framework film positioned on the strippable adhesive layer and a release film positioned on the framework film, cutting off the inner side of a cover plate area corresponding to the printed circuit board on the protective film to form a window, and processing a protective film positioning hole on the protective film, wherein the central positions of the protective film positioning hole and the printed circuit board positioning hole are the same, and the apertures of the protective film positioning hole and the printed circuit board positioning hole are the same;
s4, a first acrylic substrate is taken, a first acrylic substrate positioning hole is processed on the first acrylic substrate, and the first acrylic substrate positioning hole and the printed circuit board positioning hole are identical in center position and aperture;
s5, taking a second acrylic substrate, wherein the size of the second acrylic substrate is equal to that of the first acrylic substrate, a positioning column base hole is processed on the second acrylic substrate, the central positions of the positioning column base hole and the positioning hole of the printed circuit board are the same, and the aperture of the positioning column base hole is larger than that of the positioning hole of the printed circuit board;
s6, taking a third acrylic substrate, wherein the size of the third acrylic substrate is equal to that of the first acrylic substrate;
s7, horizontally placing a third acrylic substrate on a table top of an operation table, placing a second acrylic substrate on the upper surface of the third acrylic substrate, placing a positioning column base of a positioning column assembly into a positioning column base hole, wherein the positioning column assembly comprises a positioning column base and a positioning column fixed on the positioning column base, the positioning column is in precise fit with a positioning hole of a printed circuit board, the height of the positioning column base is equal to the depth of the positioning column base hole, aligning the second acrylic substrate with the side wall of the third acrylic substrate, placing a first acrylic substrate on the upper surface of the second acrylic substrate, positioning Kong Taozhu the first acrylic substrate, and fixing the first acrylic substrate, the second acrylic substrate and the side wall of the third acrylic substrate together by adhesive tape bonding to form a positioning jig;
s8, placing the printed circuit board on the upper surface of the positioning jig to position the printed circuit board on the Kong Taozhu positioning column, placing the protective film on the upper surface of the printed circuit board, positioning Kong Taozhu the positioning column on the protective film, and heating the periphery of the positioning column to fix the peelable adhesive layer in the protective film and the printed circuit board together;
s9, removing the release film in the protective film, placing a connecting sheet on the upper surface of the skeleton film, positioning Kong Taozhu positioning columns by the connecting sheet, and heating around the positioning columns to fix the connecting sheet and the skeleton film in the protective film together;
s10, placing the strippable glue layer, the skeleton film and the connecting sheet in the fixed printed circuit board and the protective film into a pressing machine for pressing, so that the connecting sheet is solidified and connected with a cover plate of the printed circuit board;
s11, tearing the strippable glue layer in the protective film, the framework film and the connecting sheet from the printed circuit board, tearing off the strippable glue layer in the protective film, the framework film and the connecting sheet together, and forming a concave cavity in the cover plate area of the printed circuit board to obtain a finished product.
As preferable: in step S1, the uncovering groove is processed on the printed circuit board corresponding to the edge of the uncovering area through a groove dragging process or a laser cutting process in advance.
As preferable: in step S2, the connection sheet is a prepreg or a plain film.
As preferable: in step S3, the skeleton film is a PET film or a PI film.
As preferable: in step S3, the protective film corresponding to the cover plate area of the printed circuit board is removed by using a laser cutting process or a die stamping process, so as to form a window.
As preferable: in step S3, a laser cutting process or a die punching process is adopted to process a positioning hole of the protective film on the protective film.
As preferable: in step S8, heating is performed around the positioning column, and the heating temperature is controlled to be 150-400 ℃, so that the strippable glue layer in the protective film and the printed circuit board are fixed together.
As preferable: in step S9, heating is performed around the positioning column, and the heating temperature is controlled to be 150-400 ℃ so that the connecting sheet and the framework film in the protective film are fixed together.
As preferable: in step S10, the pressing temperature is controlled to be 100-215 ℃, the pressing pressure is controlled to be 2.4-3.1 MPa, and the holding time is controlled to be 175-235 min.
The uncovering method solves the problem that the closed cavity cannot be uncovered in the prior art, solves the problems of low uncovering yield and low production efficiency caused by uncovering without an acting point in the prior art, and can greatly improve the product yield, reduce the cost, simplify the steps and facilitate the operation.
Drawings
Fig. 1 is a structural diagram of a printed circuit board taken in step S1 of embodiment 1.
Fig. 2 is a structural diagram of the connection piece after the processing of step S2 of example 1.
Fig. 3 is a structural diagram of the protective film after the treatment of step S3 of example 1.
Fig. 4 is a structural diagram of the first acryl substrate processed in the step S4 of example 1.
Fig. 5 is a structural diagram of the second acryl substrate processed in step S5 of example 1.
Fig. 6 is a structural diagram of the third acrylic substrate taken in step S6 of example 1.
Fig. 7 is a structural diagram of the positioning jig assembled in step S7 of embodiment 1.
Fig. 8 is a structural diagram of the printed circuit board and the protective film fixed together after the processing of step S8 of embodiment 1.
Fig. 9 is a structural view of the printed circuit board, the protective film and the connection sheet fixed together after the processing of step S9 of example 1.
Fig. 10 is a structural view of the printed circuit board, the protective film and the connection sheet pressed together through step S10 of embodiment 1.
Fig. 11 is a diagram showing the structure of the finished printed circuit board after the uncovering has been completed, which is obtained through step S11 of example 1.
Detailed Description
The invention will be further illustrated with reference to specific examples.
Example 1
A method of uncovering a closed cavity area of a printed circuit board, the method comprising the steps of:
s1, taking a printed circuit board 1 to be uncovered, wherein a printed circuit board positioning hole 1.1 is processed in advance on the printed circuit board 1 outside a corresponding cover plate area, and an uncovering groove 1.2 is processed in advance on the printed circuit board 1 corresponding to the edge of the uncovering area through a groove dragging process, wherein the depth of the uncovering groove 1.2 is smaller than the thickness of the printed circuit board 1, as shown in figure 1;
s2, taking a connecting sheet 2, wherein the connecting sheet 2 is a prepreg, processing a connecting sheet positioning hole 2.1 on the connecting sheet 2, wherein the central positions of the connecting sheet positioning hole 2.1 and the central position of the printed circuit board positioning hole 1.1 are the same, and the apertures are equal, as shown in figure 2;
s3, taking a protective film 3, wherein the protective film 3 comprises a strippable adhesive layer 3.1, a skeleton film 3.2 positioned on the strippable adhesive layer 3.1 and a release film 3.3 positioned on the skeleton film 3.2, the skeleton film 3.2 is a PET film, a laser cutting process is adopted to cut the inner side of a cover plate area of the protective film 3 corresponding to the printed circuit board 1 to form a window, a laser cutting process is adopted to process a protective film positioning hole 3.4 on the protective film 3, and the central positions of the protective film positioning hole 3.4 and the printed circuit board positioning hole 1.1 are identical and the aperture is identical, as shown in figure 3;
s4, taking a first acrylic substrate 4, and processing a first acrylic substrate positioning hole 4.1 on the first acrylic substrate 4, wherein the central positions of the first acrylic substrate positioning hole 4.1 and the central positions of the printed circuit board positioning holes 1.1 are the same, and the apertures are the same, as shown in FIG. 4;
s5, taking a second acrylic substrate 5, wherein the size of the second acrylic substrate 5 is equal to that of the first acrylic substrate 4, processing a positioning column base hole 5.1 on the second acrylic substrate 5, wherein the positioning column base hole 5.1 is the same as the center of the printed circuit board positioning hole 1.1, and the aperture of the positioning column base hole 5.1 is larger than that of the printed circuit board positioning hole 1.1, as shown in FIG. 5;
s6, taking a third acrylic substrate 6, wherein the size of the third acrylic substrate 6 is equal to that of the first acrylic substrate 4, as shown in FIG. 6;
s7, placing the third acrylic substrate 6 on the table top of an operation table horizontally, placing the second acrylic substrate 5 on the upper surface of the third acrylic substrate 6, placing a positioning column base of a positioning column assembly 7 into a positioning column base hole 5.1, wherein the positioning column assembly 7 comprises a positioning column base and a positioning column fixed on the positioning column base, the positioning column is in precise fit with the positioning hole 1.1 of a printed circuit board, the height of the positioning column base is equal to the depth of the positioning column base hole 5.1, aligning the second acrylic substrate 5 with the side wall of the third acrylic substrate 6, placing the first acrylic substrate 4 on the upper surface of the second acrylic substrate 5, sleeving the positioning column in the positioning hole 4.1 of the first acrylic substrate, and fixing the first acrylic substrate 4, the second acrylic substrate 5 and the side wall of the third acrylic substrate 6 together by adhesive tape bonding, so as to form a positioning jig, as shown in FIG. 7;
s8, placing the printed circuit board 1 on the upper surface of a positioning jig, enabling the positioning hole 1.1 of the printed circuit board to cover a positioning column, placing the protective film 3 on the upper surface of the printed circuit board 1, enabling the positioning hole 3.4 of the protective film 3 to cover the positioning column, enabling the lower surface of the strippable glue layer 3.1 in the protective film 3 to be in contact with the upper surface of the printed circuit board 1, heating around the positioning column, controlling the heating temperature to be 150 ℃, and enabling the strippable glue layer 3.1 in the protective film 3 to be fixed with the printed circuit board 1, as shown in FIG. 8;
s9, removing the release film 3.3 in the protective film 3, placing the connecting sheet 2 on the upper surface of the skeleton film 3.2, sleeving the connecting sheet positioning holes 2.1 on the positioning column, heating around the positioning column, and controlling the heating temperature at 150 ℃ to fix the connecting sheet 2 and the skeleton film 3.2 in the protective film 3 together, as shown in figure 9;
s10, placing the strippable glue layer 3.1, the framework film 3.2 and the connecting sheet 2 in the fixed printed circuit board 1 and the protective film 3 into a pressing machine for pressing, controlling the pressing temperature to be 100 ℃, the pressing pressure to be 3.1MPa, and the holding time to be 235min, and curing and connecting the connecting sheet 2 and a cover plate of the printed circuit board 1, as shown in FIG. 10;
s11, tearing the peelable adhesive layer 3.1 and the skeleton film 3.2 in the protective film 3 and the connecting sheet 2 from the printed circuit board 1, tearing off the cover board of the printed circuit board 1 and the peelable adhesive layer 3.1 and the skeleton film 3.2 in the protective film 3 and the connecting sheet 2 together, and forming a concave cavity in the cover board area of the printed circuit board 1 to obtain a finished product, as shown in FIG. 11.
Example 2
A method of uncovering a closed cavity area of a printed circuit board, the method comprising the steps of:
s1, taking a printed circuit board 1 to be uncovered, wherein a printed circuit board positioning hole 1.1 is processed in advance on the printed circuit board 1 outside a corresponding cover plate area, and a cover uncovering groove 1.2 is processed in advance on the printed circuit board 1 corresponding to the edge of the cover uncovering area through a laser cutting process, wherein the depth of the cover uncovering groove 1.2 is smaller than the thickness of the printed circuit board 1;
s2, taking a connecting sheet 2, wherein the connecting sheet 2 is a pure rubber sheet, and processing a connecting sheet positioning hole 2.1 on the connecting sheet 2, wherein the central positions of the connecting sheet positioning hole 2.1 and the central positions of the printed circuit board positioning holes 1.1 are the same, and the apertures of the connecting sheet positioning holes are equal;
s3, taking a protective film 3, wherein the protective film 3 comprises a strippable adhesive layer 3.1, a framework film 3.2 positioned on the strippable adhesive layer 3.1 and a release film 3.3 positioned on the framework film 3.2, the framework film 3.2 is a PI film, a die punching process is adopted to cut the inner side of a cover plate area of the protective film 3 corresponding to the printed circuit board 1 to form a window, a die punching process is adopted to process a protective film positioning hole 3.4 on the protective film 3, and the central positions of the protective film positioning hole 3.4 and the printed circuit board positioning hole 1.1 are identical and the apertures are identical;
s4, taking a first acrylic substrate 4, and processing a first acrylic substrate positioning hole 4.1 on the first acrylic substrate 4, wherein the central positions of the first acrylic substrate positioning hole 4.1 and the central positions of the printed circuit board positioning holes 1.1 are the same, and the apertures are the same;
s5, taking a second acrylic substrate 5, wherein the size of the second acrylic substrate 5 is equal to that of the first acrylic substrate 4, processing a positioning column base hole 5.1 on the second acrylic substrate 5, wherein the positioning column base hole 5.1 is the same as the center of the printed circuit board positioning hole 1.1, and the aperture of the positioning column base hole 5.1 is larger than that of the printed circuit board positioning hole 1.1;
s6, taking a third acrylic substrate 6, wherein the size of the third acrylic substrate 6 is equal to that of the first acrylic substrate 4;
s7, placing the third acrylic substrate 6 on the table top of an operation table horizontally, placing the second acrylic substrate 5 on the upper surface of the third acrylic substrate 6, placing a positioning column base of a positioning column assembly 7 into a positioning column base hole 5.1, wherein the positioning column assembly 7 comprises a positioning column base and a positioning column fixed on the positioning column base, the positioning column is in precise fit with the positioning hole 1.1 of a printed circuit board, the height of the positioning column base is equal to the depth of the positioning column base hole 5.1, aligning the second acrylic substrate 5 with the side wall of the third acrylic substrate 6, placing the first acrylic substrate 4 on the upper surface of the second acrylic substrate 5, sleeving the positioning column in the positioning column base 4.1 of the first acrylic substrate 4, and fixing the first acrylic substrate 5 and the side wall of the third acrylic substrate 6 together by adhesive tape bonding to form a positioning jig;
s8, placing the printed circuit board 1 on the upper surface of a positioning jig, enabling the positioning hole 1.1 of the printed circuit board to cover a positioning column, placing the protective film 3 on the upper surface of the printed circuit board 1, enabling the positioning hole 3.4 of the protective film 3 to cover the positioning column, enabling the lower surface of the strippable adhesive layer 3.1 in the protective film 3 to be in contact with the upper surface of the printed circuit board 1, heating around the positioning column, controlling the heating temperature to be 400 ℃, and enabling the strippable adhesive layer 3.1 in the protective film 3 to be fixed with the printed circuit board 1;
s9, removing the release film 3.3 in the protective film 3, placing the connecting sheet 2 on the upper surface of the skeleton film 3.2, sleeving the connecting sheet positioning holes 2.1 on the positioning column, and heating around the positioning column at 400 ℃ to fix the connecting sheet 2 and the skeleton film 3.2 in the protective film 3;
s10, placing the strippable adhesive layer 3.1, the skeleton film 3.2 and the connecting sheet 2 in the fixed printed circuit board 1 and the protective film 3 into a pressing machine for pressing, controlling the pressing temperature at 215 ℃, controlling the pressing pressure at 2.4MPa, and controlling the dwell time at 175min, so that the connecting sheet 2 is solidified and connected with a cover plate of the printed circuit board 1;
s11, tearing the peelable adhesive layer 3.1, the skeleton film 3.2 and the connecting sheet 2 in the protective film 3 from the printed circuit board 1, tearing off the cover board of the printed circuit board 1 and the peelable adhesive layer 3.1, the skeleton film 3.2 and the connecting sheet 2 in the protective film 3, and forming a concave cavity in the cover board area of the printed circuit board 1 to obtain a finished product.
Because the closed cavity is positioned in the middle of the printed circuit board 1, the manual uncovering has no force points, and the smooth uncovering cannot be realized. The invention uses the principle that the strippable glue layer 3.1 in the protective film 3 can still be stripped after high temperature lamination, the non-cover plate area of the printed circuit board 1 uses the strippable glue layer 3.1 in the protective film and the skeleton film 3.2 to be spaced between the connecting pieces 2, and the cover plate area of the printed circuit board 1 digs the protective film 3 so that the connecting pieces 2 are directly and tightly connected with the cover plate area of the printed circuit board 1 after lamination. Finally, when the strippable glue layer 3.1, the framework film 3.2 and the upper connecting sheet 2 in the protective film 3 are torn off, the cover plate can be uncovered along with the strippable glue layer, and the invention solves the problem of uncovering the closed cavity area on the printed circuit board 1.
Claims (9)
1. A method for uncovering a closed cavity area of a printed circuit board is characterized by comprising the following steps:
s1, taking a printed circuit board (1) to be uncovered, wherein printed circuit board positioning holes (1.1) are pre-machined on the printed circuit board (1) at the outer side of a corresponding cover plate area, cover uncovering grooves (1.2) are pre-machined on the printed circuit board (1) at the edge of the corresponding cover plate area, and the depth of the cover uncovering grooves (1.2) is smaller than the thickness of the printed circuit board (1);
s2, taking a connecting sheet (2), and processing a connecting sheet positioning hole (2.1) on the connecting sheet (2), wherein the central positions of the connecting sheet positioning hole (2.1) and the central position of the printed circuit board positioning hole (1.1) are the same, and the apertures are equal;
s3, taking a protective film (3), wherein the protective film (3) comprises a strippable adhesive layer (3.1), a framework film (3.2) positioned on the strippable adhesive layer (3.1) and a release film (3.3) positioned on the framework film (3.2), cutting off the inner side of a cover plate area corresponding to the printed circuit board (1) on the protective film (3) to form a window, processing a protective film positioning hole (3.4) on the protective film (3), wherein the central positions of the protective film positioning hole (3.4) and the printed circuit board positioning hole (1.1) are the same, and the apertures are the same;
s4, taking a first acrylic substrate (4), and processing a first acrylic substrate positioning hole (4.1) on the first acrylic substrate (4), wherein the first acrylic substrate positioning hole (4.1) and the central position of the printed circuit board positioning hole (1.1) are identical and the aperture is identical;
s5, taking a second acrylic substrate (5), wherein the size of the second acrylic substrate (5) is equal to that of the first acrylic substrate (4), processing a positioning column base hole (5.1) on the second acrylic substrate (5), wherein the positioning column base hole (5.1) is the same as the center of the printed circuit board positioning hole (1.1), and the aperture of the positioning column base hole (5.1) is larger than that of the printed circuit board positioning hole (1.1);
s6, taking a third acrylic substrate (6), wherein the size of the third acrylic substrate (6) is equal to that of the first acrylic substrate (4);
s7, horizontally placing a third acrylic substrate (6) on a table top of an operation table, placing a second acrylic substrate (5) on the upper surface of the third acrylic substrate (6), placing a positioning column base of a positioning column assembly (7) into a positioning column base hole (5.1), wherein the positioning column assembly (7) comprises a positioning column base and a positioning column fixed on the positioning column base, the positioning column is in precise fit with a printed circuit board positioning hole (1.1), the height of the positioning column base is equal to the depth of the positioning column base hole (5.1), aligning the second acrylic substrate (5) with the side wall of the third acrylic substrate (6), placing a first acrylic substrate (4) on the upper surface of the second acrylic substrate (5), sleeving the positioning column by the positioning column base hole (4.1), and fixing the first acrylic substrate (4), the second acrylic substrate (5) and the side wall of the third acrylic substrate (6) together by adhesive plaster to form a positioning jig;
s8, placing the printed circuit board (1) on the upper surface of the positioning jig, enabling the positioning hole (1.1) of the printed circuit board to cover the positioning column, placing the protective film (3) on the upper surface of the printed circuit board (1), enabling the protective film positioning hole (3.4) on the protective film (3) to cover the positioning column, enabling the lower surface of the strippable adhesive layer (3.1) in the protective film (3) to be in contact with the upper surface of the printed circuit board (1), and heating around the positioning column to enable the strippable adhesive layer (3.1) in the protective film (3) to be fixed with the printed circuit board (1);
s9, removing the release film (3.3) in the protective film (3), placing the connecting sheet (2) on the upper surface of the skeleton film (3.2), sleeving the positioning column by the connecting sheet positioning hole (2.1), and heating around the positioning column to fix the connecting sheet (2) and the skeleton film (3.2) in the protective film (3) together;
s10, placing the strippable adhesive layer (3.1), the framework film (3.2) and the connecting sheet (2) in the printed circuit board (1) and the protective film (3) which are fixed together into a pressing machine for pressing, so that the connecting sheet (2) is solidified and connected with a cover plate of the printed circuit board (1);
s11, tearing the peelable adhesive layer (3.1) in the protective film (3), the skeleton film (3.2) and the connecting sheet (2) from the printed circuit board (1), tearing off the peelable adhesive layer (3.1) in the protective film (3), the skeleton film (3.2) and the connecting sheet (2) together, and forming a concave cavity in the cover board area of the printed circuit board (1) to obtain a finished product.
2. The method of uncovering a closed cavity area of a printed circuit board according to claim 1, wherein: in step S1, the uncovering groove (1.2) is processed on the printed circuit board (1) corresponding to the edge of the uncovering area in advance through a groove dragging process or a laser cutting process.
3. The method of uncovering a closed cavity area of a printed circuit board according to claim 1, wherein: in the step S2, the connecting sheet (2) is a prepreg or a plain film.
4. The method of uncovering a closed cavity area of a printed circuit board according to claim 1, wherein: in step S3, the skeleton film (3.2) is a PET film or a PI film.
5. The method of uncovering a closed cavity area of a printed circuit board according to claim 1, wherein: in step S3, a laser cutting process or a die stamping process is adopted to remove the protective film (3) corresponding to the cover plate area of the printed circuit board (1) to form a window.
6. The method of uncovering a closed cavity area of a printed circuit board according to claim 1, wherein: in the step S3, a laser cutting process or a die punching process is adopted to process a protective film positioning hole (3.4) on the protective film (3).
7. The method of uncovering a closed cavity area of a printed circuit board according to claim 1, wherein: in the step S8, heating is performed around the positioning column, the heating temperature is controlled to be 150-400 ℃, and the strippable glue layer (3.1) in the protective film (3) and the printed circuit board (1) are fixed together.
8. The method of uncovering a closed cavity area of a printed circuit board according to claim 1, wherein: in the step S9, heating is carried out around the positioning column, the heating temperature is controlled to be 150-400 ℃, and the connecting sheet (2) and the framework film (3.2) in the protective film (3) are fixed together.
9. The method of uncovering a closed cavity area of a printed circuit board according to claim 1, wherein: in step S10, the pressing temperature is controlled to be 100-215 ℃, the pressing pressure is controlled to be 2.4-3.1 MPa, and the holding time is controlled to be 175-235 min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311086938.5A CN117062347A (en) | 2023-08-28 | 2023-08-28 | Method for uncovering area of closed cavity of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311086938.5A CN117062347A (en) | 2023-08-28 | 2023-08-28 | Method for uncovering area of closed cavity of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117062347A true CN117062347A (en) | 2023-11-14 |
Family
ID=88669107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311086938.5A Pending CN117062347A (en) | 2023-08-28 | 2023-08-28 | Method for uncovering area of closed cavity of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117062347A (en) |
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2023
- 2023-08-28 CN CN202311086938.5A patent/CN117062347A/en active Pending
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